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Master Bond, Inc. One Component Thermally Conductive Epoxy Film FL901AO

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One Component Thermally Conductive Epoxy Film - FL901AO - Master Bond, Inc.
Hackensack, NJ, USA
One Component Thermally Conductive Epoxy Film
FL901AO
One Component Thermally Conductive Epoxy Film FL901AO
Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is recommended for optimizing the shelf life. Master Bond Polymer System FL901AO features excellent thermal conductivity, high electrical insulation properties, and superior mechanical strength including high bond strength properties for both similar and dissimilar substrates. An additional attractive characteristic of FL901AO is its ability to cure quickly at moderate temperatures, e.g. 1 hour at 250°F (125°C) or 30-40 minutes at 300°F (150°C). Master Bond Polymer System FL901AO is available in a range of film thicknesses (standard film thickness is 3 mils). The film processes very easily and squeeze out during bonding is minimal. Master Bond Polymer System FL901AO retains its excellent thermal conductivity and electrical insulation properties over a wide temperature range from -100°F to 400°F. The weight loss at 600°F (300°C) is less than 0.6%. The thermal conductivity measures 10 BTU•in/ft²hr°F. The volume resistivity exceeds 10x1012 ohm cm. This superior thermally conductive film product is widely employed for bonding electronic components to heat sinks along with adhering substrates into microelectronic packages. It offers more than five times the thermal conductivity of conventional (non-conductivity) adhesive film products. The Master Bond Polymer System FL901AO is also available in specific shapes upon request. Master Bond also offers the extra service of applying the film directly onto parts and then returning them to the end user for assembly.

Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is recommended for optimizing the shelf life. Master Bond Polymer System FL901AO features excellent thermal conductivity, high electrical insulation properties, and superior mechanical strength including high bond strength properties for both similar and dissimilar substrates. An additional attractive characteristic of FL901AO is its ability to cure quickly at moderate temperatures, e.g. 1 hour at 250°F (125°C) or 30-40 minutes at 300°F (150°C). Master Bond Polymer System FL901AO is available in a range of film thicknesses (standard film thickness is 3 mils). The film processes very easily and squeeze out during bonding is minimal. Master Bond Polymer System FL901AO retains its excellent thermal conductivity and electrical insulation properties over a wide temperature range from -100°F to 400°F. The weight loss at 600°F (300°C) is less than 0.6%. The thermal conductivity measures 10 BTU•in/ft²hr°F. The volume resistivity exceeds 10x1012 ohm cm. This superior thermally conductive film product is widely employed for bonding electronic components to heat sinks along with adhering substrates into microelectronic packages. It offers more than five times the thermal conductivity of conventional (non-conductivity) adhesive film products. The Master Bond Polymer System FL901AO is also available in specific shapes upon request. Master Bond also offers the extra service of applying the film directly onto parts and then returning them to the end user for assembly.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number FL901AO
Product Name One Component Thermally Conductive Epoxy Film
Cure / Technology Thermoset; Single Component
Substrate Compatibility Ceramic, Glass; Composites; Metal; Dissimilar Substrates
Chemical System Epoxy
Composition Unfilled
Features High Dielectric; Thermally Conductive
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