Master Bond, Inc. Thermally Conductive, USP Class VI approved Epoxy Adhesive EP21AOLV-2Med

Description
Two component EP21AOLV-2Med, passes USP Class VI biocompatibility testing and ISO 10993-5 cytotoxicity requirements. It resists many chemicals including water, oils, fuels and most notably, EtO, radiation and many cold sterilants. This electrically isolating epoxy is well suited for bonding, sealing, coating and encapsulation applications in the medical device industry.
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Description
Two component EP21AOLV-2Med, passes USP Class VI biocompatibility testing and ISO 10993-5 cytotoxicity requirements. It resists many chemicals including water, oils, fuels and most notably, EtO, radiation and many cold sterilants. This electrically isolating epoxy is well suited for bonding, sealing, coating and encapsulation applications in the medical device industry.
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Suppliers

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Thermally Conductive, USP Class VI approved Epoxy Adhesive - EP21AOLV-2Med - Master Bond, Inc.
Hackensack, NJ, USA
Thermally Conductive, USP Class VI approved Epoxy Adhesive
EP21AOLV-2Med
Thermally Conductive, USP Class VI approved Epoxy Adhesive EP21AOLV-2Med
Two component EP21AOLV-2Med, passes USP Class VI biocompatibility testing and ISO 10993-5 cytotoxicity requirements. It resists many chemicals including water, oils, fuels and most notably, EtO, radiation and many cold sterilants. This electrically isolating epoxy is well suited for bonding, sealing, coating and encapsulation applications in the medical device industry.

Two component EP21AOLV-2Med, passes USP Class VI biocompatibility testing and ISO 10993-5 cytotoxicity requirements. It resists many chemicals including water, oils, fuels and most notably, EtO, radiation and many cold sterilants. This electrically isolating epoxy is well suited for bonding, sealing, coating and encapsulation applications in the medical device industry.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP21AOLV-2Med
Product Name Thermally Conductive, USP Class VI approved Epoxy Adhesive
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Epoxy
Composition Unfilled
Features High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
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