Master Bond, Inc. Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion EP42HT-3AO

Description
Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.
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Description
Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.
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Suppliers

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Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion - EP42HT-3AO - Master Bond, Inc.
Hackensack, NJ, USA
Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
EP42HT-3AO
Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion EP42HT-3AO
Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.

Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP42HT-3AO
Product Name Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Chemical System Epoxy
Composition Unfilled
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