Master Bond, Inc. Two Component, Optically Clear, Low Viscosity Epoxy EP30P

Description
Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a 4 to 1 mix ratio by weight and contains no solvents or diluents. Master Bond Polymer System EP30P produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil, acids, and many organic solvents. It is serviceable over the wide temperature range of -60°F to + 250°F. It bonds well to a wide variety of substrates including metals, glass, ceramics, and many plastics, especially polycarbonates and acrylics. EP30P has exceptionally low linear shrinkage upon cure as well as superb optical clarity. The cured compound is also an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting compound. EP30P is widely used in fiberoptics, electro-optics, optical, and related industries. EP30P can be conveniently dispensed with a gun type mixing device.
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Description
Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a 4 to 1 mix ratio by weight and contains no solvents or diluents. Master Bond Polymer System EP30P produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil, acids, and many organic solvents. It is serviceable over the wide temperature range of -60°F to + 250°F. It bonds well to a wide variety of substrates including metals, glass, ceramics, and many plastics, especially polycarbonates and acrylics. EP30P has exceptionally low linear shrinkage upon cure as well as superb optical clarity. The cured compound is also an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting compound. EP30P is widely used in fiberoptics, electro-optics, optical, and related industries. EP30P can be conveniently dispensed with a gun type mixing device.
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Suppliers

Company
Product
Description
Supplier Links
Two Component, Optically Clear, Low Viscosity Epoxy - EP30P - Master Bond, Inc.
Hackensack, NJ, USA
Two Component, Optically Clear, Low Viscosity Epoxy
EP30P
Two Component, Optically Clear, Low Viscosity Epoxy EP30P
Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a 4 to 1 mix ratio by weight and contains no solvents or diluents. Master Bond Polymer System EP30P produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil, acids, and many organic solvents. It is serviceable over the wide temperature range of -60°F to + 250°F. It bonds well to a wide variety of substrates including metals, glass, ceramics, and many plastics, especially polycarbonates and acrylics. EP30P has exceptionally low linear shrinkage upon cure as well as superb optical clarity. The cured compound is also an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting compound. EP30P is widely used in fiberoptics, electro-optics, optical, and related industries. EP30P can be conveniently dispensed with a gun type mixing device.

Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a 4 to 1 mix ratio by weight and contains no solvents or diluents. Master Bond Polymer System EP30P produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil, acids, and many organic solvents. It is serviceable over the wide temperature range of -60°F to + 250°F. It bonds well to a wide variety of substrates including metals, glass, ceramics, and many plastics, especially polycarbonates and acrylics. EP30P has exceptionally low linear shrinkage upon cure as well as superb optical clarity. The cured compound is also an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting compound. EP30P is widely used in fiberoptics, electro-optics, optical, and related industries. EP30P can be conveniently dispensed with a gun type mixing device.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP30P
Product Name Two Component, Optically Clear, Low Viscosity Epoxy
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Epoxy
Composition Filled
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