Master Bond, Inc. Datasheets for Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more
| Product Name | Notes |
|---|---|
| Toughened Two Part Epoxy Withstands Repeated Thermal Cycling -- Supreme 62-1 | Chemically resistant to acids, bases and solvents, Master Bond epoxy Supreme 62-1 features excellent flow properties and a long working life. With a wide service temperature range of -60°F to... |
| One Component Elastomeric System Features Excellent Thermal Conductivity -- X5TC | Elastomeric adhesive system, X5TC delivers thermal conductivity of 10-12 BTU•in/ft2•hr•°F [1.44-1.73 W/m•K] while maintaining excellent electrical insulation properties. It is well suited for bonding dissimilar substrates and performs well when... |
| Two Component Thermally Conductive Epoxy System -- EP21TDCANHT | EP21TDCANHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally... |
| Two Component Thermally Conductive Epoxy -- EP21TDCAOHT | EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally... |
| Thermally Conductive Epoxy Features Long Working Life -- EP29LPAO | EP29LPAO is a two component thermally conductive, electrically insulative epoxy well suited for potting and encapsulating, even in large volumes. This product has low exotherm, a long working life of... |
| Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black | EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well... |
| Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1 | EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as... |
| Solvent Resistant Adhesive Withstands Methylene Cholride, Alcohols and Fuels -- EP41S-5 | EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical... |
| Two Component, Low Viscosity Epoxy Features Outstanding Chemical Resistance -- EP62-1BF | EP62-1BF is a two part epoxy featuring the ability to withstand exposure to aggressive chemicals including acids, bases and solvents, even at high temperatures. This low exotherm system has a... |
| Flexible, Electrically Conductive Two Component Epoxy -- EP79FL | EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity... |
| Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT | EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests... |
| Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications -- EP21TDCN-LO | Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and... |
| Two Part, NASA Low Outgassing, Nickel Conductive Epoxy -- EP21TDCN-LO | Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system... |
| Two Component, Thermally Conductive Urethane Modified Epoxy Gel-Like System -- Super Gel 9AO | Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable... |
| Thermally Conductive Flame Retardant Silicone -- MasterSil 156 | Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage... |
| Epoxy Adhesive with Ultra Low Thermal Resistance -- EP48TC | For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system... |
| One component, high temperature resistant epoxy system for bonding and sealing -- EP17HTDA-1 | Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear... |
| Ultra Low Viscosity Biocompatible Epoxy for Medical Electronic Applications -- EP62-1LPSPMed | Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a an ultra low viscosity. This makes it makes it ideal for use in... |
| Room Temperature Curing Epoxy Features Low Thermal Resistance -- EP30TC | Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88... |
| Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission -- EP30-2LB | Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is... |
| One Component, Electrically Conductive Coating System -- MB600G | Ideal for electromagnetic interference (EMI) and radio frequency interference (RFI) shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Electrically conductive, graphite filled materials are... |
| High Elongation, Two Component Epoxy System with Excellent Thermal Shock Resistance -- EP110F8-3 | Master Bond EP110F8-3 is a two component high performance epoxy resin system with a long pot life for potting, sealing, encapsulating and casting. |
| Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life -- EP110F8-5 | Master Bond EP110F8-5 was developed for potting, sealing, encapsulation and casting applications. It is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties, resists... |
| Thermally Conductive, Dimensionally Stable Epoxy -- EP121AO | Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing,... |
| Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C -- EP126 | Master Bond EP126 withstands very high temperatures, up to +600°F, and has a glass transistion temperature of +240°C. This two component product features unique handling properties as Part A is... |
| One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications -- EP17HTND-CCM | Master Bond EP17HTND-CCM is a single part, heat cured epoxy system for bonding, sealing and glob top applications. |
| Two Part Epoxy Adhesive for Structural Bonding Features Long Pot Life -- EP21ND-LP | Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas. |
| Thermally Conductive Epoxy Polysulfide Adhesive -- EP21TPFL-1AO | Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)]. As a polysulfide based system, it has very good... |
| Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS | Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically... |
| Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system -- EP39MAOHT | Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and... |
| One Part, NASA Low Outgassing Electrically Conductive Epoxy -- EP3HTS-LO | Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for... |
| One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability -- EP3HTSDA-2 | Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance. |
| One Part Epoxy Adhesive for Underfill Applications -- EP3UF | Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as... |
| Low Viscosity, Thermally Conductive Underfill Epoxy -- EP3UF-1 | Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications. |
| UL 1203 Certified Epoxy for Explosion-Proof & Dust-Ignition-Proof Electrical Equipment -- EP41S-6 | Master Bond EP41S-6 is a two part epoxy system that meets UL 1203. Meeting this standard allows EP41S-6 to be used in conjunction with electrical equipment that needs to be... |
| Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion -- EP42HT-3AO | Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and... |
| Thermally Conductive, Chemically Resistant Epoxy Sealant -- EP62-1AO | Master Bond EP62-1AO is a two part epoxy adhesive and sealant with an exceptionally long working life of 12-14 hours at ambient temperature for a 100 gram mass. This makes... |
| High Tensile Strength Epoxy Adhesive Utilizes Renewable Biomaterial -- EP70CN | Master Bond EP70CN is a two component, epoxy system for bonding, sealing, coating and potting featuring a natural curing agent. |
| Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test -- EP93AOFR | Master Bond EP93AOFR is a two component flame retardant epoxy system for bonding, sealing, coating and potting. |
| Silver Filled, Electrically Conductive Adhesive Film -- FL901S | Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration... |
| B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation -- FLM36 | Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. It differs from other heat... |
| Biocompatible, Nanosilica Filled LED Curable Adhesive -- LED405Med | Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets... |
| Non-Drip, Thermal Conductive One Component Silicone -- MasterSil 705TC | Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications... |
| Two Part, Addition Cured Fluorosilicone Offers Excellent Chemical Resistance -- MasterSil 980 | Master Bond MasterSil 980 is a two component fluorosilicone for bonding, sealing, coating and encapsulating. Its most outstanding attribute is enhanced chemical resistance particularly to fuels, oils and solvents. |
| Silver Conductive, One Part Aqueous Based Sodium Silicate System Available for EMI/RFI Shielding -- MB600S | Master Bond MB600S is an aqueous based sodium silicate coating formulated for applications where electromagnetic interference/radio frequency interference (EMI/RFI) shielding is required. Tested according to IEEE 299, 2006 methods, MB600S... |
| Thermally Conductive Room temperature Curing Epoxy -- EP21AN | Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has... |
| Two Component, Thermally Conductive -- EP21ANHT | Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is... |
| Thermally Conductive, Dimensionally Stable Epoxy -- EP21AO | Master Bond Polymer Adhesive EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile... |
| Thermally Conductive, Room temperature Curing Epoxy -- EP21AOHT | Master Bond Polymer Adhesive EP21AOHT is a high temperature resistant, two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or... |
| Non-Drip, Polysulfide Based Two Component Adhesive -- EP21TPND-NV | Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100... |
| Moderate Viscosity Thermally Conductive Epoxy -- EP112AO | Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where... |
| Radiopaque Two Component Epoxy Compound -- EP21BAS | Master Bond Polymer System EP21BAS is a radioopaque two component epoxy compound which cures readily at ambient or more quickly at elevated temperatures. This epoxy polymer system features outstanding physical... |
| Two Component, Room Temperature Curing Epoxy -- EP21ND | Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, a very forgiving 1 to 1 mix ratio by weight or volume... |
| Thermally Conductive, Heat Resistant Epoxy -- EP21TCHT-1 | Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100/60... |
| Two Component, Thermally Conductive Epoxy -- EP21TDC-2AN | Master Bond Polymer System EP21TDC-2AN is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient... |
| Two Component Highly Flexibilized Epoxy -- EP21TDC-2AO | Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient... |
| Two Component, Nickel Conductive Epoxy Adhesive -- EP21TDCN | Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures. |
| Two Component Nickel Conductive Epoxy Adhesive -- EP21TDCNFL | Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... |
| Silver Filled, Electrically Conductive Epoxy -- EP21TDCS | Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... |
| Two Component, Silver Conductive Epoxy Adhesive -- EP21TDCS-LO | Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... |
| Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL | Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... |
| Medical Grade, Silver Conductive Epoxy Compound -- EP21TDCSMed | Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room... |
| Thermally Conductive, Dimensionally Stable Epoxy -- EP30AN | Master Bond Polymer System EP30AN is a two component epoxy resin system for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and excellent electrical insulation properties. |
| Thermally Conductive, Low Outgassing Epoxy -- EP30AN-1 | Master Bond Polymer System EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity, excellent electrical insulation properties and NASA low... |
| Thermally Conductive, Low Viscosity Epoxy -- EP30AO | Master Bond Polymer System EP30AO is a two component epoxy resin system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at... |
| Graphite Filled, Electrically Conductive Epoxy -- EP75-1 | Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly... |
| Nickel Filled Electrically Conductive Epoxy System -- EP76M | Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly... |
| Two Component Silver Conductive Epoxy -- EP77M-1 | Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... |
| Silver Conductive, Fast Curing Epoxy Adhesive -- EP77M-F | Master Bond Polymer System EP77M-F is a two component, silver filled, electrically conductive adhesive for high performance bonding formulated to cure very rapidly at room temperature. Unlike the majority of... |
| Two Component, Silver Coated, Nickel Filled Epoxy -- EP79 | Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more... |
| One Component Thermally Conductive Epoxy Film -- FL901AO | Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film... |
| One Part, Thermally Conductive, Elastomer Based System -- X5TC | Master Bond X-5TC is an aluminum oxide filled, thermally conductive elastomer-based, one component adhesive for high performance bonding and sealing. This thermally conductive adhesive bonds well in both shear and... |
| One component primer/adhesive for polyolefins, passes ISO 10993-5 test -- X21Med | Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity (<250 cps) solvent based system is easy... |
| Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC | MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies... |
| Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157 | MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it... |
| Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel | MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. |
| NASA Low Outgassing, Thermally Conductive Two Part Silicone -- MasterSil 972TC-LO | MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU•in/ft²•hr•°F [1.01-1.30 W/(m•K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates,... |
| Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO | MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving... |
| No Mix, Thermally Conductive Epoxy Adhesive -- EP3RR-80 | Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation... |
| New Epoxy Offers Rapid Cures and Chemical Resistance -- EP41S-F | Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant... |
| Dual Curing, Thixotropic Adhesive -- UV22DC80-10F | One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional... |
| Two Part, Low Viscosity Epoxy Offers Long Working Life and High Elongation -- EP29LPHE | Optically clear EP29LPHE is a two component epoxy that has notable toughness along with high elongation, which imparts good impact and shock resistance. It bonds well to a wide variety... |
| Toughened One Part Epoxy for Chip Coating Applications -- Supreme 3HTND-2CCM | Primarily used for chip coating, glob top and die attach applications, Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound... |
| Thermally Conductive One Part Epoxy for Die Attach -- Supreme 3HTND-2DA | Single component Supreme 3HTND-2DA offers convenient processing and dispensing with no tailing or bleed out and only requires simple refrigeration for storage. It cures rapidly in 5-10 minutes at 150°C. |
| Heat Resistant, NASA Low Outgassing Epoxy Adhesive -- Supreme 12AOHT-LO | Supreme 12AOHT-LO is a toughened system with superior resistance to aggressive thermal cycling and shock. Cryogenically serviceable, it combines superior thermal conductivity with reliable electrical insulation properties. This dimensionally stable... |
| Ultra Low Thermal Resistance One Part Epoxy System -- Supreme 18TC | Supreme 18TC is a one component conductive epoxy adhesive featuring the same exceptional heat transfer capabilities as EP48TC. This thermal conductive and electrically insulative system meets NASA low outgassing specifications. |
| One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation -- Supreme 3HTND-2DM | Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it... |
| Thermally Conductive, USP Class VI approved Epoxy Adhesive -- EP21AOLV-2Med | Two component EP21AOLV-2Med, passes USP Class VI biocompatibility testing and ISO 10993-5 cytotoxicity requirements. It resists many chemicals including water, oils, fuels and most notably, EtO, radiation and many cold... |
| Thermally Conductive, High Temperature Resistant Epoxy Passes NASA Low Outgassing Tests -- EP46HT-2AO Black | Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range... |
| Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2 | Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils,... |
| One Part Epoxy for Bonding and Glob Top Applications -- Supreme 3HTND-2GT | Well suited for glob top or die attach applications, Master Bond Supreme 3HTND-2GT is a one part epoxy system with limited flow for bonding and sealing. Combining outstanding thermal conductivity... |
| High Temperature Resistant, Thermally Conductive Epoxy -- EP46HT-1AO | With exceptional thermal conductivity and electrical insulation properties, EP46HT-1AO is a two component epoxy for high performance bonding and sealing applications. This high temperature resistant system has a glass transition... |