Master Bond, Inc. Datasheets for Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more
| Product Name | Notes |
|---|---|
| Chemical resistant, two part epoxy, EP41S-5 has exemplary resistance to a wide array of chemicals, such as acids, bases, alcohols, fuels and many solvents, including methylene chloride. It is widely... | |
| Chemically resistant to acids, bases and solvents, Master Bond epoxy Supreme 62-1 features excellent flow properties and a long working life. With a wide service temperature range of -60°F to... | |
| Elastomeric adhesive system, X5TC delivers thermal conductivity of 10-12 BTU•in/ft2•hr•°F [1.44-1.73 W/m•K] while maintaining excellent electrical insulation properties. It is well suited for bonding dissimilar substrates and performs well when... | |
| EP21TDCANHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally... | |
| EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally... | |
| EP29LPAO is a two component thermally conductive, electrically insulative epoxy well suited for potting and encapsulating, even in large volumes. This product has low exotherm, a long working life of... | |
| EP30AO is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where electrical insulation and environmental protection are required and heat transfer must be maintained. | |
| EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. | |
| EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of... | |
| EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well... | |
| EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as... | |
| EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. | |
| EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical... | |
| EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically... | |
| EP62-1BF is a two part epoxy featuring the ability to withstand exposure to aggressive chemicals including acids, bases and solvents, even at high temperatures. This low exotherm system has a... | |
| EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity... | |
| EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests... | |
| Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and... | |
| Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system... | |
| Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable... | |
| Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage... | |
| For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system... | |
| Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear... | |
| Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a an ultra low viscosity. This makes it makes it ideal for use in... | |
| Formulated for specific optical applications, Master Bond EP30-2LB blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm. This two part system is optically... | |
| Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88... | |
| Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is... | |
| Ideal for electromagnetic interference (EMI) and radio frequency interference (RFI) shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Electrically conductive, graphite filled materials are... | |
| Master Bond EP110F8-3 is a two component high performance epoxy resin system with a long pot life for potting, sealing, encapsulating and casting. | |
| Master Bond EP110F8-5 was developed for potting, sealing, encapsulation and casting applications. It is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties, resists... | |
| Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing,... | |
| Master Bond EP126 withstands very high temperatures, up to +600°F, and has a glass transistion temperature of +240°C. This two component product features unique handling properties as Part A is... | |
| Master Bond EP17HTND-CCM is a single part, heat cured epoxy system for bonding, sealing and glob top applications. | |
| Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. | |
| Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas. | |
| Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)]. As a polysulfide based system, it has very good... | |
| Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems. | |
| Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation. | |
| Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically... | |
| Master Bond EP35AOLV is a two component thermally conductive, electrically isolating epoxy for bonding, sealing and potting. Key features include its good flow properties, high temperature resistance, its ability to... | |
| Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and... | |
| Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for... | |
| Master Bond EP3HTS-TC is a fast curing, silver filled, one part epoxy with unparalleled electrical and thermal conductivity. | |
| Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance. | |
| Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as... | |
| Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications. | |
| Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required. | |
| Master Bond EP41S-6 is a two part epoxy system that meets UL 1203. Meeting this standard allows EP41S-6 to be used in conjunction with electrical equipment that needs to be... | |
| Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and... | |
| Master Bond EP62-1AO is a two component, flowable epoxy system with an exceptionally long open time at ambient temperature. | |
| Master Bond EP70CN is a two component, epoxy system for bonding, sealing, coating and potting featuring a natural curing agent. | |
| Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. | |
| Master Bond EP93AOFR is a two component flame retardant epoxy system for bonding, sealing, coating and potting. | |
| Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration... | |
| Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. It differs from other heat... | |
| Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets... | |
| Master Bond MasterSil 153AO is an addition cured two part silicone with a high tensile lap shear strength, thermal conductivity and electrical insulation. | |
| Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications... | |
| Master Bond MasterSil 980 is a two component fluorosilicone for bonding, sealing, coating and encapsulating. Its most outstanding attribute is enhanced chemical resistance particularly to fuels, oils and solvents. | |
| Master Bond MB600S is an aqueous based sodium silicate coating formulated for applications where electromagnetic interference/radio frequency interference (EMI/RFI) shielding is required. Tested according to IEEE 299, 2006 methods, MB600S... | |
| Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has... | |
| Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is... | |
| Master Bond Polymer Adhesive EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile... | |
| Master Bond Polymer Adhesive EP21AOHT is a high temperature resistant, two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or... | |
| Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100... | |
| Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where... | |
| Master Bond Polymer System EP126 is a two component toughened epoxy resin based high temperature resistant adhesive system with continuous service capability at 500°F and outstanding chemical resistance. This unique... | |
| Master Bond Polymer System EP21BAS is a radioopaque two component epoxy compound which cures readily at ambient or more quickly at elevated temperatures. This epoxy polymer system features outstanding physical... | |
| Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, a very forgiving 1 to 1 mix ratio by weight or volume... | |
| Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100/60... | |
| Master Bond Polymer System EP21TDC-2AN is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient... | |
| Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient... | |
| Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures. | |
| Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room... | |
| Master Bond Polymer System EP30AN is a two component epoxy resin system for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and excellent electrical insulation properties. | |
| Master Bond Polymer System EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity, excellent electrical insulation properties and NASA low... | |
| Master Bond Polymer System EP30AO is a two component epoxy resin system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly... | |
| Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly... | |
| Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... | |
| Master Bond Polymer System EP77M-F is a two component, silver filled, electrically conductive adhesive for high performance bonding formulated to cure very rapidly at room temperature. Unlike the majority of... | |
| Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more... | |
| Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film... | |
| Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity. | |
| Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation with a free flowing viscosity. | |
| Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. | |
| Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. | |
| Master Bond X-5TC is an aluminum oxide filled, thermally conductive elastomer-based, one component adhesive for high performance bonding and sealing. This thermally conductive adhesive bonds well in both shear and... | |
| Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity (<250 cps) solvent based system is easy... | |
| MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies... | |
| MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it... | |
| MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. | |
| MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU•in/ft²•hr•°F [1.01-1.30 W/(m•K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates,... | |
| MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving... | |
| Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation... | |
| Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant... | |
| One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional... | |
| Optically clear EP29LPHE is a two component epoxy that has notable toughness along with high elongation, which imparts good impact and shock resistance. It bonds well to a wide variety... | |
| Primarily used for chip coating, glob top and die attach applications, Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound... | |
| Single component Supreme 3HTND-2DA offers convenient processing and dispensing with no tailing or bleed out and only requires simple refrigeration for storage. It cures rapidly in 5-10 minutes at 150°C. | |
| Supreme 121AOND is a thermally conductive, electrically insulative epoxy with superior physical strength properties and a high glass transition temperature. It has a paste consistency and a long working life. | |
| Supreme 12AOHT-LO is a toughened system with superior resistance to aggressive thermal cycling and shock. Cryogenically serviceable, it combines superior thermal conductivity with reliable electrical insulation properties. This dimensionally stable... | |
| Supreme 18TC is a one component conductive epoxy adhesive featuring the same exceptional heat transfer capabilities as EP48TC. This thermal conductive and electrically insulative system meets NASA low outgassing specifications. | |
| Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it... | |
| Toughened, two part epoxy Supreme 11ANHT withstands thermal cycling and is both thermally conductive and electrically insulative. | |
| Two component EP21AOLV-2Med, passes USP Class VI biocompatibility testing and ISO 10993-5 cytotoxicity requirements. It resists many chemicals including water, oils, fuels and most notably, EtO, radiation and many cold... | |
| Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range... | |
| Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils,... | |
| Well suited for glob top or die attach applications, Master Bond Supreme 3HTND-2GT is a one part epoxy system with limited flow for bonding and sealing. Combining outstanding thermal conductivity... | |
| With exceptional thermal conductivity and electrical insulation properties, EP46HT-1AO is a two component epoxy for high performance bonding and sealing applications. This high temperature resistant system has a glass transition... |