Master Bond, Inc. Epoxy Features Very Low Coefficient of Thermal Expansion EP30LTE-2

Description
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating.
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Description
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating.
Request a Quote

Suppliers

Company
Product
Description
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Epoxy Features Very Low Coefficient of Thermal Expansion - EP30LTE-2 - Master Bond, Inc.
Hackensack, NJ, USA
Epoxy Features Very Low Coefficient of Thermal Expansion
EP30LTE-2
Epoxy Features Very Low Coefficient of Thermal Expansion EP30LTE-2
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP30LTE-2
Product Name Epoxy Features Very Low Coefficient of Thermal Expansion
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Epoxy
Composition Unfilled
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