Master Bond, Inc. Datasheets for Conductive Compounds

Conductive compounds provide an electrically and/or thermally conductive path between components.
Conductive Compounds: Learn more

Product Name Notes
Chemically resistant to acids, bases and solvents, Master Bond epoxy Supreme 62-1 features excellent flow properties and a long working life. With a wide service temperature range of -60°F to...
Elastomeric adhesive system, X5TC delivers thermal conductivity of 10-12 BTU•in/ft2•hr•°F [1.44-1.73 W/m•K] while maintaining excellent electrical insulation properties. It is well suited for bonding dissimilar substrates and performs well when...
EP21TDCANHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally...
EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally...
EP29LPAO is a two component thermally conductive, electrically insulative epoxy well suited for potting and encapsulating, even in large volumes. This product has low exotherm, a long working life of...
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of...
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well...
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as...
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics.
EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical...
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically...
EP62-1BF is a two part epoxy featuring the ability to withstand exposure to aggressive chemicals including acids, bases and solvents, even at high temperatures. This low exotherm system has a...
EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity...
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests...
Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and...
Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system...
Featuring exceptional abrasion and chemical resistance, Supreme 45HTQ is a two component, quartz filled epoxy system for bonding, sealing and casting applications. It effectively withstands exposure to petrochemicals, acids, bases...
Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable...
Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage...
For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system...
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear...
Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a an ultra low viscosity. This makes it makes it ideal for use in...
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88...
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is...
Ideal for electromagnetic interference (EMI) and radio frequency interference (RFI) shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Electrically conductive, graphite filled materials are...
Master Bond EP110F8-3 is a two component high performance epoxy resin system with a long pot life for potting, sealing, encapsulating and casting.
Master Bond EP110F8-5 was developed for potting, sealing, encapsulation and casting applications. It is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties, resists...
Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing,...
Master Bond EP126 withstands very high temperatures, up to +600°F, and has a glass transistion temperature of +240°C. This two component product features unique handling properties as Part A is...
Master Bond EP17HTND-CCM is a single part, heat cured epoxy system for bonding, sealing and glob top applications.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures.
Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas.
Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)]. As a polysulfide based system, it has very good...
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems.
Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation.
Master Bond EP30DPBFMed is a two part, flexibilized epoxy-urethane hybrid system that can be used for bonding, sealing, coating, and encapsulation.
Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically...
Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various...
Master Bond EP36CLV is a unique one component, high performance epoxy for bonding, sealing, potting and coating featuring electrical insulation, high temperature resistance and exceptionally low viscosity. It varies appreciably...
Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and...
Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for...
Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance.
Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as...
Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications.
Master Bond EP41S-6 is a two part epoxy system that meets UL 1203. Meeting this standard allows EP41S-6 to be used in conjunction with electrical equipment that needs to be...
Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and...
Master Bond EP62-1AO is a two component, flowable epoxy system with an exceptionally long open time at ambient temperature.
Master Bond EP70CN is a two component, epoxy system for bonding, sealing, coating and potting featuring a natural curing agent.
Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting.
Master Bond EP93AOFR is a two component flame retardant epoxy system for bonding, sealing, coating and potting.
Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration...
Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. It differs from other heat...
Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets...
Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications...
Master Bond MasterSil 980 is a two component fluorosilicone for bonding, sealing, coating and encapsulating. Its most outstanding attribute is enhanced chemical resistance particularly to fuels, oils and solvents.
Master Bond MB600S is an aqueous based sodium silicate coating formulated for applications where electromagnetic interference/radio frequency interference (EMI/RFI) shielding is required. Tested according to IEEE 299, 2006 methods, MB600S...
Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has...
Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is...
Master Bond Polymer Adhesive EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile...
Master Bond Polymer Adhesive EP21AOHT is a high temperature resistant, two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or...
Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one...
Master Bond Polymer Adhesive EP21TDCHT is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one...
Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100...
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more...
Master Bond Polymer Adhesive EP33LV is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more...
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio...
Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio...
Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly...
Master Bond Polymer Compound EP45HTAO is a two component thermally conductive epoxy compound for high performance structural bonding, and casting. It is suitable for applications where long term exposure to...
Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where...
Master Bond Polymer System EP21BAS is a radioopaque two component epoxy compound which cures readily at ambient or more quickly at elevated temperatures. This epoxy polymer system features outstanding physical...
Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures,...
Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, a very forgiving 1 to 1 mix ratio by weight or volume...
Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100/60...
Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient...
Master Bond Polymer System EP21TDC-2AN is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient...
Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient...
Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to...
Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or...
Master Bond Polymer System EP21TDC-4HT is a unique two component, toughened epoxy compound for high performance bonding, sealing and casting featuring high peel strength, superior resistance to vibration, impact and...
Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or...
Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures.
Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room...
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more...
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will...
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function...
Master Bond Polymer System EP30AN is a two component epoxy resin system for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and excellent electrical insulation properties.
Master Bond Polymer System EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity, excellent electrical insulation properties and NASA low...
Master Bond Polymer System EP30AO is a two component epoxy resin system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at...
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many...
Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature...
Master Bond Polymer System EP34AN is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where very high thermal conductivity is required. It...
Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity is required. It is formulated...
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination...
Master Bond Polymer System EP36AO is a truly unique one component high performance flexibilized epoxy system for electrical potting and encapsulation, baked coatings and adhesive applications. It features an outstanding...
Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures...
Master Bond Polymer System EP37-3FLFAO is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures...
Master Bond Polymer System EP46HT-1 is a two component epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures from -100°F to +550°F is...
Master Bond Polymer System EP51FL-1 is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very slow curing,...
Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting...
Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting...
Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly...
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly...
Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Master Bond Polymer System EP77M-F is a two component, silver filled, electrically conductive adhesive for high performance bonding formulated to cure very rapidly at room temperature. Unlike the majority of...
Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more...
Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film...
Master Bond Polymer System Supreme 10HTF-1 is a one-part/no-mix system featuring a unique combination of properties including high shear and peel strength, exceptionally wide service temperature range and very rapid...
Master Bond Polymer System Supreme 10HTFL features a unique blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4K to...
Master Bond Supreme 10HTCL features a unique blend of performance properties including both high shear and peel strengths along with convenient handling. This one component system is formulated to cure...
Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity.
Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation with a free flowing viscosity.
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties.
Master Bond System EP46HT is a newly formulated two component high performance heat resistant epoxy resin system with excellent mechanical strength and chemically resistant properties for structural bonding, sealing and...
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature.
Master Bond X-5TC is an aluminum oxide filled, thermally conductive elastomer-based, one component adhesive for high performance bonding and sealing. This thermally conductive adhesive bonds well in both shear and...
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity (<250 cps) solvent based system is easy...
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies...
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it...
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation.
MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU•in/ft²•hr•°F [1.01-1.30 W/(m•K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates,...
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving...
Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation...
Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant...
One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional...
Optically clear EP29LPHE is a two component epoxy that has notable toughness along with high elongation, which imparts good impact and shock resistance. It bonds well to a wide variety...
Primarily used for chip coating, glob top and die attach applications, Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound...
Single component Supreme 3HTND-2DA offers convenient processing and dispensing with no tailing or bleed out and only requires simple refrigeration for storage. It cures rapidly in 5-10 minutes at 150°C.
Supreme 12AOHT-LO is a toughened system with superior resistance to aggressive thermal cycling and shock. Cryogenically serviceable, it combines superior thermal conductivity with reliable electrical insulation properties. This dimensionally stable...
Supreme 18TC is a one component conductive epoxy adhesive featuring the same exceptional heat transfer capabilities as EP48TC. This thermal conductive and electrically insulative system meets NASA low outgassing specifications.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it...
Two component EP21AOLV-2Med, passes USP Class VI biocompatibility testing and ISO 10993-5 cytotoxicity requirements. It resists many chemicals including water, oils, fuels and most notably, EtO, radiation and many cold...
Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range...
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils,...
Well suited for glob top or die attach applications, Master Bond Supreme 3HTND-2GT is a one part epoxy system with limited flow for bonding and sealing. Combining outstanding thermal conductivity...
With exceptional thermal conductivity and electrical insulation properties, EP46HT-1AO is a two component epoxy for high performance bonding and sealing applications. This high temperature resistant system has a glass transition...