Master Bond, Inc. Datasheets for Conductive Compounds

Conductive compounds provide an electrically and/or thermally conductive path between components.
Conductive Compounds: Learn more

Product Name Notes
Toughened Two Part Epoxy Withstands Repeated Thermal Cycling -- Supreme 62-1 Chemically resistant to acids, bases and solvents, Master Bond epoxy Supreme 62-1 features excellent flow properties and a long working life. With a wide service temperature range of -60°F to...
One Component Elastomeric System Features Excellent Thermal Conductivity -- X5TC Elastomeric adhesive system, X5TC delivers thermal conductivity of 10-12 BTU•in/ft2•hr•°F [1.44-1.73 W/m•K] while maintaining excellent electrical insulation properties. It is well suited for bonding dissimilar substrates and performs well when...
Two Component Thermally Conductive Epoxy System -- EP21TDCANHT EP21TDCANHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally...
Two Component Thermally Conductive Epoxy -- EP21TDCAOHT EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally...
Thermally Conductive Epoxy Features Long Working Life -- EP29LPAO EP29LPAO is a two component thermally conductive, electrically insulative epoxy well suited for potting and encapsulating, even in large volumes. This product has low exotherm, a long working life of...
Epoxy Features Exceptional Chemical and Heat Resistance -- EP35SP EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing.
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of...
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well...
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1 EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as...
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics.
Solvent Resistant Adhesive Withstands Methylene Cholride, Alcohols and Fuels -- EP41S-5 EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical...
NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance -- EP42-2LV Black EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically...
Two Component, Low Viscosity Epoxy Features Outstanding Chemical Resistance -- EP62-1BF EP62-1BF is a two part epoxy featuring the ability to withstand exposure to aggressive chemicals including acids, bases and solvents, even at high temperatures. This low exotherm system has a...
Flexible, Electrically Conductive Two Component Epoxy -- EP79FL EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity...
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests...
Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications -- EP21TDCN-LO Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and...
Two Part, NASA Low Outgassing, Nickel Conductive Epoxy -- EP21TDCN-LO Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system...
Quartz Filled Chemical Resistant Two Component Epoxy -- Supreme 45HTQ Featuring exceptional abrasion and chemical resistance, Supreme 45HTQ is a two component, quartz filled epoxy system for bonding, sealing and casting applications. It effectively withstands exposure to petrochemicals, acids, bases...
Two Component, Thermally Conductive Urethane Modified Epoxy Gel-Like System -- Super Gel 9AO Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable...
Thermally Conductive Flame Retardant Silicone -- MasterSil 156 Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage...
Epoxy Adhesive with Ultra Low Thermal Resistance -- EP48TC For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system...
One component, high temperature resistant epoxy system for bonding and sealing -- EP17HTDA-1 Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear...
Ultra Low Viscosity Biocompatible Epoxy for Medical Electronic Applications -- EP62-1LPSPMed Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a an ultra low viscosity. This makes it makes it ideal for use in...
Room Temperature Curing Epoxy Features Low Thermal Resistance -- EP30TC Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88...
Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission -- EP30-2LB Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is...
One Component, Electrically Conductive Coating System -- MB600G Ideal for electromagnetic interference (EMI) and radio frequency interference (RFI) shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Electrically conductive, graphite filled materials are...
High Elongation, Two Component Epoxy System with Excellent Thermal Shock Resistance -- EP110F8-3 Master Bond EP110F8-3 is a two component high performance epoxy resin system with a long pot life for potting, sealing, encapsulating and casting.
Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life -- EP110F8-5 Master Bond EP110F8-5 was developed for potting, sealing, encapsulation and casting applications. It is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties, resists...
Thermally Conductive, Dimensionally Stable Epoxy -- EP121AO Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing,...
Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C -- EP126 Master Bond EP126 withstands very high temperatures, up to +600°F, and has a glass transistion temperature of +240°C. This two component product features unique handling properties as Part A is...
One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications -- EP17HTND-CCM Master Bond EP17HTND-CCM is a single part, heat cured epoxy system for bonding, sealing and glob top applications.
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures.
Two Part Epoxy Adhesive for Structural Bonding Features Long Pot Life -- EP21ND-LP Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas.
Thermally Conductive Epoxy Polysulfide Adhesive -- EP21TPFL-1AO Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)]. As a polysulfide based system, it has very good...
Tough Epoxy Polysulfide Adhesive Resists High Temperatures -- EP21TPHT Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems.
Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation -- EP29LPTCHT Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation.
Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications -- EP30DPBFMed Master Bond EP30DPBFMed is a two part, flexibilized epoxy-urethane hybrid system that can be used for bonding, sealing, coating, and encapsulation.
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically...
Low Viscosity Heat Resistant Epoxy System -- EP34CA Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various...
One Component Liquid Epoxy Resin EP36CLV -- EP36CLV Master Bond EP36CLV is a unique one component, high performance epoxy for bonding, sealing, potting and coating featuring electrical insulation, high temperature resistance and exceptionally low viscosity. It varies appreciably...
Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system -- EP39MAOHT Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and...
One Part, NASA Low Outgassing Electrically Conductive Epoxy -- EP3HTS-LO Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for...
One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability -- EP3HTSDA-2 Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance.
One Part Epoxy Adhesive for Underfill Applications -- EP3UF Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as...
Low Viscosity, Thermally Conductive Underfill Epoxy -- EP3UF-1 Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications.
UL 1203 Certified Epoxy for Explosion-Proof & Dust-Ignition-Proof Electrical Equipment -- EP41S-6 Master Bond EP41S-6 is a two part epoxy system that meets UL 1203. Meeting this standard allows EP41S-6 to be used in conjunction with electrical equipment that needs to be...
Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion -- EP42HT-3AO Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and...
Two Component Epoxy Resin System Featuring Excellent Temperature And Chemical Resistance -- EP62-1AO Master Bond EP62-1AO is a two component, flowable epoxy system with an exceptionally long open time at ambient temperature.
High Tensile Strength Epoxy Adhesive Utilizes Renewable Biomaterial -- EP70CN Master Bond EP70CN is a two component, epoxy system for bonding, sealing, coating and potting featuring a natural curing agent.
Two Component, Room Temperature Curing Epoxy For Bonding, Coating, Sealing And Potting -- EP88FL Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting.
Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test -- EP93AOFR Master Bond EP93AOFR is a two component flame retardant epoxy system for bonding, sealing, coating and potting.
Silver Filled, Electrically Conductive Adhesive Film -- FL901S Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration...
B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation -- FLM36 Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. It differs from other heat...
Biocompatible, Nanosilica Filled LED Curable Adhesive -- LED405Med Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets...
Non-Drip, Thermal Conductive One Component Silicone -- MasterSil 705TC Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications...
Two Part, Addition Cured Fluorosilicone Offers Excellent Chemical Resistance -- MasterSil 980 Master Bond MasterSil 980 is a two component fluorosilicone for bonding, sealing, coating and encapsulating. Its most outstanding attribute is enhanced chemical resistance particularly to fuels, oils and solvents.
Silver Conductive, One Part Aqueous Based Sodium Silicate System Available for EMI/RFI Shielding -- MB600S Master Bond MB600S is an aqueous based sodium silicate coating formulated for applications where electromagnetic interference/radio frequency interference (EMI/RFI) shielding is required. Tested according to IEEE 299, 2006 methods, MB600S...
Thermally Conductive Room temperature Curing Epoxy -- EP21AN Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has...
Two Component, Thermally Conductive -- EP21ANHT Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is...
Thermally Conductive, Dimensionally Stable Epoxy -- EP21AO Master Bond Polymer Adhesive EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile...
Thermally Conductive, Room temperature Curing Epoxy -- EP21AOHT Master Bond Polymer Adhesive EP21AOHT is a high temperature resistant, two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or...
Toughened, Shock Resistant, Two Component Epoxy -- EP21TDC Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one...
Room Temperature Curing, Toughened Two Part Epoxy -- EP21TDCHT Master Bond Polymer Adhesive EP21TDCHT is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one...
Non-Drip, Polysulfide Based Two Component Adhesive -- EP21TPND-NV Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100...
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33 Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more...
Room Temperature Curing, Two Component Epoxy -- EP33LV Master Bond Polymer Adhesive EP33LV is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more...
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51 Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio...
Fast Curing, Thermal Cycling Resistant Epoxy Adhesive -- EP51M Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio...
Two Component, Fast Curing Epoxy Adhesive -- EP65 Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly...
Thermally Conductive, Heat Resistant Epoxy System -- EP45AOHT Master Bond Polymer Compound EP45HTAO is a two component thermally conductive epoxy compound for high performance structural bonding, and casting. It is suitable for applications where long term exposure to...
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where...
Radiopaque Two Component Epoxy Compound -- EP21BAS Master Bond Polymer System EP21BAS is a radioopaque two component epoxy compound which cures readily at ambient or more quickly at elevated temperatures. This epoxy polymer system features outstanding physical...
Two Component Polymer System -- EP21CLV Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures,...
Two Component, Room Temperature Curing Epoxy -- EP21ND Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, a very forgiving 1 to 1 mix ratio by weight or volume...
Thermally Conductive, Heat Resistant Epoxy -- EP21TCHT-1 Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100/60...
Two Component Epoxy with Outstanding Flexibility -- EP21TDC-2 Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient...
Two Component, Thermally Conductive Epoxy -- EP21TDC-2AN Master Bond Polymer System EP21TDC-2AN is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient...
Two Component Highly Flexibilized Epoxy -- EP21TDC-2AO Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient...
Two Component, Thermally Conductive Epoxy -- EP21TDC-2LO Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to...
Two Component, Highly Flexible Epoxy -- EP21TDC-4 Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or...
Two Component, Toughened Epoxy Compound -- EP21TDC-4HT Master Bond Polymer System EP21TDC-4HT is a unique two component, toughened epoxy compound for high performance bonding, sealing and casting featuring high peel strength, superior resistance to vibration, impact and...
Highly Flexible Two Part Epoxy -- EP21TDC-7 Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or...
Two Component, Nickel Conductive Epoxy Adhesive -- EP21TDCN Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures.
Two Component Nickel Conductive Epoxy Adhesive -- EP21TDCNFL Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Silver Filled, Electrically Conductive Epoxy -- EP21TDCS Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Two Component, Silver Conductive Epoxy Adhesive -- EP21TDCS-LO Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Medical Grade, Silver Conductive Epoxy Compound -- EP21TDCSMed Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room...
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22 Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more...
Low Exotherm, Two Component Epoxy -- EP29LP Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will...
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function...
Thermally Conductive, Dimensionally Stable Epoxy -- EP30AN Master Bond Polymer System EP30AN is a two component epoxy resin system for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and excellent electrical insulation properties.
Thermally Conductive, Low Outgassing Epoxy -- EP30AN-1 Master Bond Polymer System EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity, excellent electrical insulation properties and NASA low...
Thermally Conductive, Low Viscosity Epoxy -- EP30AO Master Bond Polymer System EP30AO is a two component epoxy resin system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at...
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31 Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many...
Room Temperature Curing, Two Component Epoxy System -- EP34 Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature...
Two Component, Room Temperature Curing Epoxy -- EP34AN Master Bond Polymer System EP34AN is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where very high thermal conductivity is required. It...
Two Component, Room Temperature Curing Epoxy -- EP34AO Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity is required. It is formulated...
One Component, High Temperature Resistant Epoxy -- EP36 Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination...
One Part, Thermally Conductive, Heat Resistant Epoxy -- EP36AO Master Bond Polymer System EP36AO is a truly unique one component high performance flexibilized epoxy system for electrical potting and encapsulation, baked coatings and adhesive applications. It features an outstanding...
Two Part Epoxy Offers High Thermal Conductivity -- EP37-3FLFAN Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures...
Low Outgassing, Thermally Conductive Epoxy -- EP37-3FLFAO Master Bond Polymer System EP37-3FLFAO is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures...
Two Component, Heat Resistant Epoxy -- EP46HT-1 Master Bond Polymer System EP46HT-1 is a two component epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures from -100°F to +550°F is...
Two Part, Rapid Curing, Cryogenic Epoxy -- EP51FL-1 Master Bond Polymer System EP51FL-1 is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very slow curing,...
Fast Curing, High Temperature Resistant Epoxy -- EP65HT Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting...
Fast Curing High Glass Transition Temperature Epoxy -- EP65HT-1 Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting...
Graphite Filled, Electrically Conductive Epoxy -- EP75-1 Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly...
Nickel Filled Electrically Conductive Epoxy System -- EP76M Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly...
Two Component Silver Conductive Epoxy -- EP77M-1 Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Silver Conductive, Fast Curing Epoxy Adhesive -- EP77M-F Master Bond Polymer System EP77M-F is a two component, silver filled, electrically conductive adhesive for high performance bonding formulated to cure very rapidly at room temperature. Unlike the majority of...
Two Component, Silver Coated, Nickel Filled Epoxy -- EP79 Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more...
One Component Thermally Conductive Epoxy Film -- FL901AO Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film...
Heat Curing. Snap Cure Epoxy Supreme -- Supreme 10HTF-1 Master Bond Polymer System Supreme 10HTF-1 is a one-part/no-mix system featuring a unique combination of properties including high shear and peel strength, exceptionally wide service temperature range and very rapid...
Flexibilized Epoxy System -- Supreme 10HTFL Master Bond Polymer System Supreme 10HTFL features a unique blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4K to...
Toughened Epoxy Adhesive/Sealant Supreme -- Supreme 10HTCL Master Bond Supreme 10HTCL features a unique blend of performance properties including both high shear and peel strengths along with convenient handling. This one component system is formulated to cure...
Two Part Epoxy For Bonding, Sealing, Potting And Impregnation -- Supreme 112 Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity.
Thermally Conductive, Electrically Insulative Potting Compound Resists High Temperatures -- Supreme 121AO Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation with a free flowing viscosity.
One Component Toughened Epoxy System For Bonding And Sealing -- Supreme 17HT Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties.
Two Component, High Performance Epoxy -- EP46HT Master Bond System EP46HT is a newly formulated two component high performance heat resistant epoxy resin system with excellent mechanical strength and chemically resistant properties for structural bonding, sealing and...
One Component, Higher Viscosity Uv Curable System For Bonding, Sealing And Coating -- UV10TK40M Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature.
One Part, Thermally Conductive, Elastomer Based System -- X5TC Master Bond X-5TC is an aluminum oxide filled, thermally conductive elastomer-based, one component adhesive for high performance bonding and sealing. This thermally conductive adhesive bonds well in both shear and...
One component primer/adhesive for polyolefins, passes ISO 10993-5 test -- X21Med Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity (<250 cps) solvent based system is easy...
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies...
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157 MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it...
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation.
NASA Low Outgassing, Thermally Conductive Two Part Silicone -- MasterSil 972TC-LO MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU•in/ft²•hr•°F [1.01-1.30 W/(m•K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates,...
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving...
No Mix, Thermally Conductive Epoxy Adhesive -- EP3RR-80 Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation...
New Epoxy Offers Rapid Cures and Chemical Resistance -- EP41S-F Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant...
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional...
Two Part, Low Viscosity Epoxy Offers Long Working Life and High Elongation -- EP29LPHE Optically clear EP29LPHE is a two component epoxy that has notable toughness along with high elongation, which imparts good impact and shock resistance. It bonds well to a wide variety...
Toughened One Part Epoxy for Chip Coating Applications -- Supreme 3HTND-2CCM Primarily used for chip coating, glob top and die attach applications, Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound...
Thermally Conductive One Part Epoxy for Die Attach -- Supreme 3HTND-2DA Single component Supreme 3HTND-2DA offers convenient processing and dispensing with no tailing or bleed out and only requires simple refrigeration for storage. It cures rapidly in 5-10 minutes at 150°C.
Heat Resistant, NASA Low Outgassing Epoxy Adhesive -- Supreme 12AOHT-LO Supreme 12AOHT-LO is a toughened system with superior resistance to aggressive thermal cycling and shock. Cryogenically serviceable, it combines superior thermal conductivity with reliable electrical insulation properties. This dimensionally stable...
Ultra Low Thermal Resistance One Part Epoxy System -- Supreme 18TC Supreme 18TC is a one component conductive epoxy adhesive featuring the same exceptional heat transfer capabilities as EP48TC. This thermal conductive and electrically insulative system meets NASA low outgassing specifications.
One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation -- Supreme 3HTND-2DM Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it...
Thermally Conductive, USP Class VI approved Epoxy Adhesive -- EP21AOLV-2Med Two component EP21AOLV-2Med, passes USP Class VI biocompatibility testing and ISO 10993-5 cytotoxicity requirements. It resists many chemicals including water, oils, fuels and most notably, EtO, radiation and many cold...
Thermally Conductive, High Temperature Resistant Epoxy Passes NASA Low Outgassing Tests -- EP46HT-2AO Black Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range...
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2 Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils,...
One Part Epoxy for Bonding and Glob Top Applications -- Supreme 3HTND-2GT Well suited for glob top or die attach applications, Master Bond Supreme 3HTND-2GT is a one part epoxy system with limited flow for bonding and sealing. Combining outstanding thermal conductivity...
High Temperature Resistant, Thermally Conductive Epoxy -- EP46HT-1AO With exceptional thermal conductivity and electrical insulation properties, EP46HT-1AO is a two component epoxy for high performance bonding and sealing applications. This high temperature resistant system has a glass transition...