Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates. It is thermally conductive and electrically insulative. This moderate viscosity compound has good flow properties and can be cast in sections up to ½ inch thick.
| Master Bond, Inc. | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | EP17HT-100 |
| Product Name | High Temperature Resistant, One Component Epoxy Adhesive |
| Cure / Technology | Thermoset; Single Component; Reactive or Moisture Cured |
| Type / Form | Grease, Paste |
| Substrate Compatibility | Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates |
| Chemical System | Epoxy |
| Composition | Unfilled |
