Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is recommended for high temperature applications where service temperatures may reach 400°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Although room temperature curable, accelerated cures are possible by adding heat. As a thermally conductive adhesive it will adhere to a wide variety of substrates and can offer a tensile shear strength over 1800 psi. Other noteworthy features included superior electrical insulation properties and enhanced dimensional stability. EP21ANHT offers superior resistance to a wide range of chemicals including water, oil, fuels, and some solvents over the temperature range of -60° to +400°F.
| Master Bond, Inc. | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | EP21ANHT |
| Product Name | Two Component, Thermally Conductive |
| Cure / Technology | Thermoset; Two Component |
| Type / Form | Grease, Paste |
| Substrate Compatibility | Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood |
| Chemical System | Epoxy |
| Composition | Filled |
