Master Bond, Inc. Non-Drip Cryogenic Epoxy Offers Electrical and Thermal Insulation EP29LPSPND-3

Description
Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used in cryogenic applications. The system is electrically non-conductive and thermally insulative.
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Description
Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used in cryogenic applications. The system is electrically non-conductive and thermally insulative.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Non-Drip Cryogenic Epoxy Offers Electrical and Thermal Insulation - EP29LPSPND-3 - Master Bond, Inc.
Hackensack, NJ, USA
Non-Drip Cryogenic Epoxy Offers Electrical and Thermal Insulation
EP29LPSPND-3
Non-Drip Cryogenic Epoxy Offers Electrical and Thermal Insulation EP29LPSPND-3
Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used in cryogenic applications. The system is electrically non-conductive and thermally insulative.

Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used in cryogenic applications. The system is electrically non-conductive and thermally insulative.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP29LPSPND-3
Product Name Non-Drip Cryogenic Epoxy Offers Electrical and Thermal Insulation
Cure / Technology Thermoset; Two Component  
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Epoxy
Features High Dielectric; Thermal Insulation
Industry Aerospace; Electronics; Photonics; OEM or Industrial; Semiconductors, IC's
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