Master Bond, Inc. Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability EP5TC-80

Description
EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Request a Quote
Description
EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability - EP5TC-80 - Master Bond, Inc.
Hackensack, NJ, USA
Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability
EP5TC-80
Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability EP5TC-80
EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.

EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP5TC-80
Product Name Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability
Cure / Technology Thermoset; Single Component
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Epoxy
Composition Filled
Features High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
Unlock Full Specs
to access all available technical data

Similar Products

Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion - EP42HT-3AO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
View Details
Epoxy  Has Low Thermal Expansion Coefficient - EP30LTE - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
One Component, High Temperature Resistant Epoxy - EP36 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Single Component
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
One Part, Optically Clear UV Curable System - UV15-42C - Master Bond, Inc.
Specs
Cure / Technology Thermoset; UV or Radiation Cured; Single Component
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details