Master Bond, Inc. No Mix, Thermally Conductive Epoxy Adhesive EP3RR-80

Description
Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2 inch deep. This system has outstanding mechanical strength properties and solid dimensional stability.
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Description
Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2 inch deep. This system has outstanding mechanical strength properties and solid dimensional stability.
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Suppliers

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No Mix, Thermally Conductive Epoxy Adhesive - EP3RR-80 - Master Bond, Inc.
Hackensack, NJ, USA
No Mix, Thermally Conductive Epoxy Adhesive
EP3RR-80
No Mix, Thermally Conductive Epoxy Adhesive EP3RR-80
Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2 inch deep. This system has outstanding mechanical strength properties and solid dimensional stability.

Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2 inch deep. This system has outstanding mechanical strength properties and solid dimensional stability.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP3RR-80
Product Name No Mix, Thermally Conductive Epoxy Adhesive
Cure / Technology Thermoset; Single Component; Reactive or Moisture Cured
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Chemical System Epoxy
Composition Unfilled
Features High Dielectric; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
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