Master Bond, Inc. Low Exotherm, Two Component Epoxy EP29LP

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Low Exotherm, Two Component Epoxy - EP29LP - Master Bond, Inc.
Hackensack, NJ, USA
Low Exotherm, Two Component Epoxy EP29LP
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates including optical fibers and fibrous reinforcements such as glass, aramid, and graphite. In this regard, it should be noted the EP29LP has superb optical clarity and has wide applicability in optical and fiber optic applications. The mixed viscosity is exceptionally low; about 700-800 cps. Peak exotherm for a 200 gram mass is approximately 50°C. These properties make the EP29LP ideally suited for large castings and potting applications. Service temperature range is -60°F to +250°F. Other noteworthy features include good electrical insulation properties and a good chemical resistance profile.
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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP29LP
Product Name Low Exotherm, Two Component Epoxy
Viscosity 700 to 800 cP
Composition Unfilled
Use Temperature -60 to 250 F (-51 to 121 C)
Tensile (Break) 6500 psi (44816 KPa)
Thermal Conductivity 0.1154 W/m-K (0.0667 BTU-ft/hr-ft²-F)
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