Master Bond, Inc. Thermally Conductive, Dimensionally Stable Epoxy EP121AO

Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500°F. it cures readily at elevated temperatures to a tough strong solid with excellent long term durability and chemical resistance even when exposed to adverse environmental conditions. Adhesion to metals and other substrates is excellent. There is no cracking or separation of properly cured EP121AO resin from metal, etc., over a wide temperature range. Physical strength thermal conductivity and electrical insulation properties of the cured EP121AO resin system are significantly superior to those exhibited by typical room temperature and also thermally cured epoxy resin systems. The cured epoxy can meet all service temperatures up to 475°F to 500°F for limited time periods and 400-450F for prolonged exposures. The mix ratio is 100 parts of component A to 80 parts of component B by weight. A typical cure schedule is 2-3 hours at 250°F followed by 5-8 hours at 300°F. A higher, thermally conductive version called EP121AN with similar properties and cure schedule is also available. EP121AO is widely used in electronic, electrical and appliance industries.