Master Bond, Inc. Nanosilica Filled, NASA Low Outgassing, Dual Cure Adhesive UV22DC80-1

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Nanosilica Filled, NASA Low Outgassing, Dual Cure Adhesive - UV22DC80-1 - Master Bond, Inc.
Hackensack, NJ, USA
Nanosilica Filled, NASA Low Outgassing, Dual Cure Adhesive UV22DC80-1
Master Bond UV22DC80-1 is a one part nanosilica filled system for bonding and sealing and coating applications in the aerospace, optical and electronic industries. This video demonstrates the epoxy based system's unique dual curing mechanism of both UV light and heat, allowing it to cure dissimilar substrates and shadowed out areas. This low viscosity epoxy is passes NASA low outgassing testing and features exceptional optical clarity. Having a dual cure mechanism allows those areas not directly exposed to UV light being fully cured with the addition of heat. The thermal part of the cure is achieved at 80°C, which is user friendly when working with heat sensitive plastics. Dual cure systems are particularly useful for rapidly fixturing parts with the UV portion of the cure and then finishing the process by heating. UV22DC80-1 is also a high strength system that bonds well to metals, glass, ceramics and most plastics. It is dimensionally stable and offers superior abrasion resistance.
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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number UV22DC80-1
Product Name Nanosilica Filled, NASA Low Outgassing, Dual Cure Adhesive
Viscosity 1000 to 8000 cP
Composition Filled
Use Temperature -60 to 350 F (-51 to 177 C)
Tensile (Break) 6000 to 8000 psi (41369 to 55158 KPa)
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
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