Master Bond, Inc. One component, heat curing epoxy for structural bonding applications featuring low coefficient of thermal expansion EP13LTE

Description
Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use, doesn't require mixing, and has an unlimited working life at room temperature. It also features high temperature resistance, dimensional stability and is able to withstand 1,000 hours at 85°C/85% RH.
  • One component, heat curing epoxy for structural bonding applications featuring low coefficient of thermal expansion - EP13LTE - Master Bond, Inc.
    Master Bond, Inc.
Request a Quote
Description
Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use, doesn't require mixing, and has an unlimited working life at room temperature. It also features high temperature resistance, dimensional stability and is able to withstand 1,000 hours at 85°C/85% RH.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
One component, heat curing epoxy for structural bonding applications featuring low coefficient of thermal expansion - EP13LTE - Master Bond, Inc.
Master Bond, Inc.
Hackensack, NJ, USA
One component, heat curing epoxy for structural bonding applications featuring low coefficient of thermal expansion
EP13LTE
One component, heat curing epoxy for structural bonding applications featuring low coefficient of thermal expansion EP13LTE
Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use, doesn't require mixing, and has an unlimited working life at room temperature. It also features high temperature resistance, dimensional stability and is able to withstand 1,000 hours at 85°C/85% RH.

Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use, doesn't require mixing, and has an unlimited working life at room temperature. It also features high temperature resistance, dimensional stability and is able to withstand 1,000 hours at 85°C/85% RH.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP13LTE
Product Name One component, heat curing epoxy for structural bonding applications featuring low coefficient of thermal expansion
Cure / Technology Thermoset; Single Component
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Chemical System Epoxy
Composition Unfilled
Unlock Full Specs
to access all available technical data