Master Bond, Inc. One component, high temperature resistant epoxy system for bonding and sealing EP17HTDA-1

Description
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be used in vacuum situations
Request a Quote
Description
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be used in vacuum situations
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
One component, high temperature resistant epoxy system for bonding and sealing - EP17HTDA-1 - Master Bond, Inc.
Hackensack, NJ, USA
One component, high temperature resistant epoxy system for bonding and sealing
EP17HTDA-1
One component, high temperature resistant epoxy system for bonding and sealing EP17HTDA-1
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be used in vacuum situations

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be used in vacuum situations

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP17HTDA-1
Product Name One component, high temperature resistant epoxy system for bonding and sealing
Cure / Technology Thermoset; Single Component
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Chemical System Epoxy
Composition Unfilled
Unlock Full Specs
to access all available technical data

Similar Products

Two Part Epoxy With Chemical, Abrasion and Heat Resistance - Supreme 45HTQ-4 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Reactive or Moisture Cured
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
Quartz Filled Chemical Resistant Two Component Epoxy - Supreme 45HTQ - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Reactive or Moisture Cured
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
Low Outgassing, Optically Clear Two Component Epoxy - EP29LPSP - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
View Details
One Part, NASA Low Outgassing Electrically Conductive Epoxy - EP3HTS-LO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Single Component; Reactive or Moisture Cured
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
View Details