Master Bond, Inc. Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity EP3HTSDA-1

Description
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be used in many other high-tech applications besides die attach. 
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Description
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be used in many other high-tech applications besides die attach. 
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Suppliers

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Product
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Supplier Links
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity - EP3HTSDA-1 - Master Bond, Inc.
Hackensack, NJ, USA
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
EP3HTSDA-1
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity EP3HTSDA-1
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be used in many other high-tech applications besides die attach. 

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be used in many other high-tech applications besides die attach. 

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP3HTSDA-1
Product Name Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
Cure / Technology Thermoset; Single Component
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Chemical System Epoxy
Composition Unfilled
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