Master Bond, Inc. Fast Curing High Glass Transition Temperature Epoxy EP65HT-1

Description
Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85°C, EP65HT-1 has an amazing Tg of over 125°C. In addition, unlike the typical fast cure epoxies, EP65HT-1 retains fast setup times even when mixed in relatively small masses. EP65HT-1 normally will setup in 3-5 minutes in 10 to 20 gram masses. Full cure normally occurs within a few hours with exceptionally high tensile shear strengths approaching 3,000 psi. Service temperature range is -60°F to +400°F. EP65HT-1 offers superior electrical insulating properties and a strong chemical resistance profile. EP65HT-1 has now been qualified to meet NASA low outgassing specifications. EP65HT-1 bonds well to a wide variety of substrates including metals, glass, ceramics, woods, vulcanized rubbers and many plastics. Dispensing of the EP65HT-1 has been tremendously facilitated by the development of a dispensing gun capable of mixing fast setting materials with a 10 to 1 mix ratio. As a consequence, EP65HT-1 is becoming widely used for both manufacturing and prototyping in the electrical, electronic, appliance, computer, optical, automotive and OEM industries.
Request a Quote
Description
Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85°C, EP65HT-1 has an amazing Tg of over 125°C. In addition, unlike the typical fast cure epoxies, EP65HT-1 retains fast setup times even when mixed in relatively small masses. EP65HT-1 normally will setup in 3-5 minutes in 10 to 20 gram masses. Full cure normally occurs within a few hours with exceptionally high tensile shear strengths approaching 3,000 psi. Service temperature range is -60°F to +400°F. EP65HT-1 offers superior electrical insulating properties and a strong chemical resistance profile. EP65HT-1 has now been qualified to meet NASA low outgassing specifications. EP65HT-1 bonds well to a wide variety of substrates including metals, glass, ceramics, woods, vulcanized rubbers and many plastics. Dispensing of the EP65HT-1 has been tremendously facilitated by the development of a dispensing gun capable of mixing fast setting materials with a 10 to 1 mix ratio. As a consequence, EP65HT-1 is becoming widely used for both manufacturing and prototyping in the electrical, electronic, appliance, computer, optical, automotive and OEM industries.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Fast Curing High Glass Transition Temperature Epoxy - EP65HT-1 - Master Bond, Inc.
Hackensack, NJ, USA
Fast Curing High Glass Transition Temperature Epoxy
EP65HT-1
Fast Curing High Glass Transition Temperature Epoxy EP65HT-1
Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85°C, EP65HT-1 has an amazing Tg of over 125°C. In addition, unlike the typical fast cure epoxies, EP65HT-1 retains fast setup times even when mixed in relatively small masses. EP65HT-1 normally will setup in 3-5 minutes in 10 to 20 gram masses. Full cure normally occurs within a few hours with exceptionally high tensile shear strengths approaching 3,000 psi. Service temperature range is -60°F to +400°F. EP65HT-1 offers superior electrical insulating properties and a strong chemical resistance profile. EP65HT-1 has now been qualified to meet NASA low outgassing specifications. EP65HT-1 bonds well to a wide variety of substrates including metals, glass, ceramics, woods, vulcanized rubbers and many plastics. Dispensing of the EP65HT-1 has been tremendously facilitated by the development of a dispensing gun capable of mixing fast setting materials with a 10 to 1 mix ratio. As a consequence, EP65HT-1 is becoming widely used for both manufacturing and prototyping in the electrical, electronic, appliance, computer, optical, automotive and OEM industries.

Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85°C, EP65HT-1 has an amazing Tg of over 125°C. In addition, unlike the typical fast cure epoxies, EP65HT-1 retains fast setup times even when mixed in relatively small masses. EP65HT-1 normally will setup in 3-5 minutes in 10 to 20 gram masses. Full cure normally occurs within a few hours with exceptionally high tensile shear strengths approaching 3,000 psi. Service temperature range is -60°F to +400°F. EP65HT-1 offers superior electrical insulating properties and a strong chemical resistance profile. EP65HT-1 has now been qualified to meet NASA low outgassing specifications. EP65HT-1 bonds well to a wide variety of substrates including metals, glass, ceramics, woods, vulcanized rubbers and many plastics. Dispensing of the EP65HT-1 has been tremendously facilitated by the development of a dispensing gun capable of mixing fast setting materials with a 10 to 1 mix ratio. As a consequence, EP65HT-1 is becoming widely used for both manufacturing and prototyping in the electrical, electronic, appliance, computer, optical, automotive and OEM industries.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP65HT-1
Product Name Fast Curing High Glass Transition Temperature Epoxy
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Chemical System Epoxy
Composition Unfilled
Unlock Full Specs
to access all available technical data

Similar Products

One Part, NASA Low Outgassing Electrically Conductive Epoxy - EP3HTS-LO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Single Component; Reactive or Moisture Cured
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
View Details
Low Viscosity, Non-Yellowing Two Component Epoxy - EP112LS - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
Fast Setting, Two Component Epoxy Color Coded for Proper Mixing - EP51CC - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
Two Component, Low Viscosity Epoxy Features Outstanding Chemical Resistance - EP62-1BF - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
View Details