Master Bond, Inc. Datasheets for Encapsulants and Potting Compounds

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Encapsulants and Potting Compounds: Learn more

Product Name Notes
Solvent Resistant Adhesive Withstands Methylene Cholride -- EP41S-5 Chemical resistant, two part epoxy, EP41S-5 has exemplary resistance to a wide array of chemicals, such as acids, bases, alcohols, fuels and many solvents, including methylene chloride. It is widely...
Low Viscosity, Non-Yellowing Two Component Epoxy -- EP112LS EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55. This electrically insulative system is resistant to chemicals including water, oils, fuels, acids and bases.
Low Viscosity, Two Component Epoxy with Low Exotherm -- EP21LVSP6 EP21LVSP6 is a two component system that is also well suited for potting and encapsulation applications. It offers a very convenient one to one mix ratio, by weight or volume...
Thermally Conductive Epoxy Features Long Working Life -- EP29LPAO EP29LPAO is a two component thermally conductive, electrically insulative epoxy well suited for potting and encapsulating, even in large volumes. This product has low exotherm, a long working life of...
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of...
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1 EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as...
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics.
Solvent Resistant Adhesive Withstands Methylene Cholride, Alcohols and Fuels -- EP41S-5 EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical...
NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance -- EP42-2LV Black EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically...
Two Component, Low Viscosity Epoxy Features Outstanding Chemical Resistance -- EP62-1BF EP62-1BF is a two part epoxy featuring the ability to withstand exposure to aggressive chemicals including acids, bases and solvents, even at high temperatures. This low exotherm system has a...
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests...
Two Component Room Temperature Curing Epoxy -- EP21FRNS-2 Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this...
Epoxy Adhesive with Low Coefficient of Thermal Expansion -- EP42HT-2LTE Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/°C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications. It has outstanding...
One Component, Moderate Viscosity LED Curable -- LED401LV Featuring breakthrough LED curing technology, LED401LV will cure completely tack-free when exposed to a light source emitting 405 nm wavelength in sections of 1/8 inch thick and beyond. Once cured,...
Two Component, Thermally Conductive Urethane Modified Epoxy Gel-Like System -- Super Gel 9AO Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable...
Thermally Conductive Flame Retardant Silicone -- MasterSil 156 Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage...
One component, high temperature resistant epoxy system for bonding and sealing -- EP17HTDA-1 Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear...
Ultra Low Viscosity Biocompatible Epoxy for Medical Electronic Applications -- EP62-1LPSPMed Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a an ultra low viscosity. This makes it makes it ideal for use in...
Nanosilica Filled, Optically Clear Epoxy Adhesive -- EP113 Formulated for potting, coating and sealing applications, EP113 is a two component, nanosilica filled epoxy. The nano particles enhance the dimensional stability and the already exceptionally low shrinkage upon curing.
High Temperature Resistant, One Component Epoxy Adhesive -- EP17HT-100 Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. This low heat...
Two Component Flame Retardant FAR Approved Epoxy Adhesive -- EP90FR-V Formulated for specialty aviation applications, EP90FR-V is a two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy. The most noteworthy applications include interior panels, door frame...
Optically Clear Epoxy Blocks UV Light Transmission -- EP30-2LB Formulated for specific optical applications, Master Bond EP30-2LB blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm. This two part system is optically...
Room Temperature Curing Epoxy Features Low Thermal Resistance -- EP30TC Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88...
Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission -- EP30-2LB Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is...
One Component LED Curable Adhesive System -- LED401 LED401 is a unique single component compound that cures rapidly upon exposure to a 405 nm wavelength light source. This formulation has a good flow, high bond strength and superior...
Optically Clear, Condensation Curing Silicone -- MasterSil 152 Low viscosity MasterSil 152 is a two component, optically clear silicone system that cures when exposed to air at room temperature. It has outstanding electrical insulation properties, making it ideal...
Optically Clear, Low Viscosity Epoxy with a Long Open Time -- EP62-1LPSP Low viscosity, EP62-1LPSP is a two component, heat curing epoxy that features an exceptionally long working life of 12-24 hours at ambient temperatures. Its thin consistency, long open time and...
High Elongation, Two Component Epoxy System with Excellent Thermal Shock Resistance -- EP110F8-3 Master Bond EP110F8-3 is a two component high performance epoxy resin system with a long pot life for potting, sealing, encapsulating and casting.
Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life -- EP110F8-5 Master Bond EP110F8-5 was developed for potting, sealing, encapsulation and casting applications. It is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties, resists...
Thermally Conductive, Dimensionally Stable Epoxy -- EP121AO Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing,...
Thermally Stable Electrically Insulating Epoxy -- EP121CL Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and...
One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications -- EP17HTND-CCM Master Bond EP17HTND-CCM is a single part, heat cured epoxy system for bonding, sealing and glob top applications.
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures.
Thermally Conductive Epoxy Polysulfide Adhesive -- EP21TPFL-1AO Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)]. As a polysulfide based system, it has very good...
Tough Epoxy Polysulfide Adhesive Resists High Temperatures -- EP21TPHT Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems.
Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation -- EP29LPTCHT Master Bond EP29LPTCHT is a two component epoxy system featuring good thermal conductivity combined with electrical insulation.
Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications -- EP30DPBFMed Master Bond EP30DPBFMed is a two part, flexibilized epoxy-urethane hybrid system that can be used for bonding, sealing, coating, and encapsulation.
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2 Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating.
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically...
Low Viscosity Heat Resistant Epoxy System -- EP34CA Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various...
One Component Liquid Epoxy Resin EP36CLV -- EP36CLV Master Bond EP36CLV is a unique one component, high performance epoxy for bonding, sealing, potting and coating featuring electrical insulation, high temperature resistance and exceptionally low viscosity. It varies appreciably...
Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system -- EP39MAOHT Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and...
One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability -- EP3HTSDA-2 Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance.
One Part Epoxy Adhesive for Underfill Applications -- EP3UF Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as...
Low Viscosity, Thermally Conductive Underfill Epoxy -- EP3UF-1 Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications.
Two Component Adhesive for Food Applications -- EP42HT-2FG Master Bond EP42HT-2FG is a room temperature setting, two component epoxy adhesive, sealant and coating specially formulated for food applications. It has been independently tested and certified by one of...
Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion -- EP42HT-3AO Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and...
High Glass Transition Temperature Epoxy System -- EP62-1 Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures.
High Tensile Strength Epoxy Adhesive Utilizes Renewable Biomaterial -- EP70CN Master Bond EP70CN is a two component, epoxy system for bonding, sealing, coating and potting featuring a natural curing agent.
Two Component, Room Temperature Curing Epoxy For Bonding, Coating, Sealing And Potting -- EP88FL Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting.
Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test -- EP93AOFR Master Bond EP93AOFR is a two component flame retardant epoxy system for bonding, sealing, coating and potting.
USP Class VI, One Component, LED Curable System -- LED403Med Master Bond LED403Med is a very special, one part LED curable system that can be used as an adhesive, sealant, coating and encapsulation system. It requires no mixing and has...
Two Part, Addition Cured Fluorosilicone Offers Excellent Chemical Resistance -- MasterSil 980 Master Bond MasterSil 980 is a two component fluorosilicone for bonding, sealing, coating and encapsulating. Its most outstanding attribute is enhanced chemical resistance particularly to fuels, oils and solvents.
Toughened, Shock Resistant, Two Component Epoxy -- EP21TDC Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one...
Oil And Fuel Resistant Polysulfide Based Adhesive -- EP21TP-2NV Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix...
Two Component, Room Temperature Curing Polysulfide -- EP21TPLV-NV Master Bond Polymer Adhesive EP21TPLV is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient temperature and even more rapidly at elevated temperatures...
Fast Curing, Non-Yellowing Two Component Epoxy -- EP30-4 Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated...
High Temperature Resistant, Two Component Epoxy -- EP30HT Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with...
USP Class VI Certified, Two Component Epoxy -- EP30Med Master Bond Polymer Adhesive EP30Med is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily...
Two Component, Optically Clear, Low Viscosity Epoxy -- EP30P Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily...
High Temperature Resistant, Toughened Epoxy -- EP125 Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500°F with truly outstanding chemical resistance. High strength bonds serviceable up to 600°F can...
Low Viscosity Structural Epoxy Adhesive System -- EP112 Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The...
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where...
Two Component, Thermal Shock And Heat Resistant Epoxy System -- EP121 Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal...
High Temperature Resistant, One Component Epoxy System -- EP13 Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at...
One Component, Storage Stable Epoxy -- EP19HT Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and...
One Component, Flexibilized Epoxy Resin -- EP19HTFL Master Bond Polymer System EP19HTFL is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It is a one part, non mix...
One Component, Storage Stable Epoxy Resin -- EP19HTLV Master Bond Polymer System EP19HTLV is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It feature remarkably long shelf life and...
Room Temperature Curing Epoxy System -- EP21 Master Bond Polymer System EP21 is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties and a very forgiving 1 to 1 mix ratio by weight or...
Acid Resistant, Two Component Epoxy -- EP21AR Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance.
Two Component, Acid Resistant Coating/Liner -- EP21ARHT Master Bond Polymer System EP21ARHT is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance.
Two Component Polymer System -- EP21CLV Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures,...
Flexibilized and Toughened Low Viscosity Epoxy -- EP21FL Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature...
High Temperature Resistant Two Component Epoxy -- EP21HT Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating featuring a forgiving 1 to 1 mix ratio and high temperature resistance up...
Low Viscosity, Two Component Epoxy -- EP21LV Master Bond Polymer System EP21LV is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at...
Two Part, Flexible, USP Class VI Epoxy System -- EP21LV3/5Med Master Bond Polymer System EP21LV3/5Med is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readily at...
Two Component Epoxy with Outstanding Flexibility -- EP21TDC-2 Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient...
Two Component, Highly Flexible Epoxy -- EP21TDC-4 Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or...
Highly Flexible Two Part Epoxy -- EP21TDC-7 Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or...
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function...
Optically Clear, Low Viscosity, Two Component Epoxy -- EP30 Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly...
Low Viscosity, Two Component Epoxy -- EP30-1 Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or...
Low Outgassing Two Component Epoxy -- EP30-2 Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly...
Two Component, Thermally Resistant Epoxy -- EP30-3 Master Bond Polymer System EP30-3 is a two component, low viscosity, epoxy resin system featuring optical clarity, high physical strength properties, outstanding chemical resistance and superior high temperature properties. Excellent...
Transparent, Highly Flexible Epoxy Compound -- EP30D-10 Master Bond Polymer System EP30-D10 is a uniquely versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bonding, sealing, casting and encapsulation. It...
Thermally Conductive, Dimensionally Stable Epoxy -- EP30AN Master Bond Polymer System EP30AN is a two component epoxy resin system for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and excellent electrical insulation properties.
Thermally Conductive, Low Outgassing Epoxy -- EP30AN-1 Master Bond Polymer System EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity, excellent electrical insulation properties and NASA low...
Thermally Conductive, Low Viscosity Epoxy -- EP30AO Master Bond Polymer System EP30AO is a two component epoxy resin system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at...
Flexibilized, Abrasion Resistant Epoxy -- EP30D-7 Master Bond Polymer System EP30D-7 is a versatile two component flexibilized epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It...
Cryogenically Serviceable Epoxy Urethane System -- EP30DP-NV Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines...
Liquid Epoxy EP30F Resists Abrasion and Chemicals -- EP30F Master Bond Polymer System EP30F is a new fast curing liquid epoxy resin compound for high perform-ance abrasion and chemical resistant seamless floors. This easy-to-use two component epoxy resin system...
Low Viscosity, Flexibilized Two Component Epoxy -- EP30FL Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated...
Two Component Optically Clear Epoxy Compound -- EP30HV Master Bond Polymer System EP30HV is a low viscosity, two component epoxy system for high performance bonding, sealing, coating and casting. It is formulated to cure at room temperature or...
Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting.
NASA Low Outgassing Approved Epoxy System -- EP30LTE-LO Master Bond Polymer System EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing...
Electrically Insulative, Two Component Epoxy System -- EP30M3LV-NV Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more...
Quartz Filled, Two Component Epoxy -- EP30QF Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting formulated to cure at room temperature or more rapidly at...
Room Temperature Curing, Two Component Epoxy System -- EP34 Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature...
Two Component, Room Temperature Curing Epoxy -- EP34AO Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity is required. It is formulated...
One Component, High Temperature Resistant Epoxy -- EP36 Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination...
One Part, Thermally Conductive, Heat Resistant Epoxy -- EP36AO Master Bond Polymer System EP36AO is a truly unique one component high performance flexibilized epoxy system for electrical potting and encapsulation, baked coatings and adhesive applications. It features an outstanding...
Optically Clear, Impact Resistant Two Component Epoxy -- EP37-3 Master Bond Polymer System EP37-3 is a low viscosity, resilient, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a very...
Highly Flexible Epoxy Features Low Exotherm -- EP37-3FLF Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a...
Two Part Epoxy Offers High Thermal Conductivity -- EP37-3FLFAN Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures...
Low Outgassing, Thermally Conductive Epoxy -- EP37-3FLFAO Master Bond Polymer System EP37-3FLFAO is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures...
Low Viscosity, Fast Curing, Two Component Epoxy -- EP38 Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does...
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2 Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and...
Two Component, Room Temperature Curing Epoxy Resin -- EP39MHT Master Bond Polymer System EP39MHT is a low viscosity, two component, epoxy resin system for high performance potting, encapsulation, sealing and bonding. It cures readily at ambient temperatures to an...
One Part Epoxy System Featuring Low Viscosity -- EP3RRLV Master Bond Polymer System EP3RRLV is a one component, low viscosity tough epoxy for high performance potting, encapsulation and underfill applications featuring rapid curing at temperatures as low as 220-250°F.
Two Component Epoxy EP41S Features Chemical Resistance -- EP41S Master Bond Polymer System EP41S is a two component epoxy resin compound for durable, high performance, tough, high strength coatings, liners and adhesive/sealants with outstanding resistance to organic solvents including...
Two Component, Room Temperature Curable Epoxy -- EP42HT-2 Master Bond Polymer System EP42HT-2 is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding chemical resistance. It is...
High Temperature Resistant Epoxy Compound -- EP45HT Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from...
Two Part, Fast Curing, Cryogenic Epoxy -- EP51FL Master Bond Polymer System EP51FL is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very slow curing,...
USP Class VI Two Component Epoxy Resin System -- EP62-1Med Master Bond Polymer System EP62-1Med is a two component epoxy adhesive, sealant, coating, and encapsulant featuring outstanding temperature and chemical resistance. It has wide applicability for use in medical devices,...
Nickel Filled Electrically Conductive Epoxy System -- EP76M Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly...
One Component, Optically Clear UV Curable System -- UV15-7LRI Master Bond Polymer System UV 15-7LRI is a new one component, optically clear, non-yellowing UV curable polymer system for high performance adhesives, sealants and coatings. It is 100% reactive and...
One Part, Optically Clear UV Curable System -- UV15-42C Master Bond Polymer System UV15-42C is a new one component, high viscosity, optically clear, tough UV curable polymer system with extended capability of -80°F to +300°F. It is fully reactive,...
High Strength, Non-Yellowing UV Curable -- UV15-7NV Master Bond Polymer system UV15-7NV is a new one component, optically clear, non yellowing UV curable polymer system for high performance bonding, sealing and coating. It is 100% reactive and...
One Component UV Curable Compound -- UV15-7SP4 Master Bond Polymer System UV15-7SP4 is a new one component, optically clear, toughened UV and/or curable polymer system with extended service capability of -80°F to +250°F. It is 100% reactive,...
UV Curable Compound UV15-7TK1ANV Features Paste Consistency -- UV15-7TK1ANV Master Bond Polymer System UV15-7TK1ANV is a new one component, high viscosity, optically clear, tough UV curable polymer system with extended capability of -80°F to +300°F. It is fully reactive,...
One Component, UV Curable Glob Top Compound -- UV15X-2GT Master Bond Polymer System UV15X-2GT is a new, easily processable, one component, UV curable glob top, featuring exceptional durability and chemical resistance. UV15X-2GT is a thixotropic paste that handles well...
One Component, High Viscosity UV Curable Compound -- UV15X-5 Master Bond Polymer System UV15X-5 is a newly developed one component, non-yellowing, UV curable urethane elastomer system possessing high flexibility and outstanding abrasion resistance. This high viscosity system can be...
One Component Low Viscosity, Optically Clear UV Curable -- UV19 Master Bond Polymer System UV19 is a newly developed UV curable, low viscosity optically clear compound specifically designed for high performance laminating, sealing, bonding and coating. This remarkable acrylic based...
One Component, Highly Flexible UV Curable Urethane -- UV21 Master Bond Polymer System UV21 is an easy to use one component UV curable urethane elastomer compound. It has been used for bonding, sealing, casting and formed in place high...
One Component, UV Curable, Nanosilica Reinforced Epoxy -- UV22 Master Bond Polymer System UV22 represents a remarkable technological breakthrough in the utilization of nanotechnology in the formulation of a one component UV curable epoxy for coating, sealing, and encapsulation...
Two Part Epoxy For Bonding, Sealing, Potting And Impregnation -- Supreme 112 Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity.
Thermally Conductive, Electrically Insulative Potting Compound Resists High Temperatures -- Supreme 121AO Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation with a free flowing viscosity.
One Component Toughened Epoxy System For Bonding And Sealing -- Supreme 17HT Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties.
One Component, UV Curable Adhesive System -- UV10 Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a...
One Component, Biocompatible UV Curable Adhesive -- UV10Med Master Bond UV10Med is a one component, UV curable system that fully meets USP Class VI specifications. This low viscosity, optically clear system is a superior adhesive, sealant and coating...
One Component, High Viscosity UV Curable Polymer -- UV11-3 Master Bond UV11-3 is an extra-hard, super-abrasion resist-radiation curable coating system for plastic substrates. It is a low viscosity, clear, 100% reactive liquid that can be cured readily by exposure...
High Strength UV Curable Adhesive -- UV15 Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It...
One Component, UV and Heat Curable Epoxy -- UV15DC80 Master Bond UV15DC80 is a very special dual cured (UV/heat) curable system featuring the capacity to cure in shadowed out of areas by supplementary heat curing at 80°C for 15-30...
One Part, Flexiblized UV Curable System -- UV15FL Master Bond UV15FL is a new one component, high strength, low viscosity, flexible UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties.
One Component, Low Viscosity UV Curable System -- UV15LV Master Bond UV15LV is a new one component, high strength UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a...
One Part UV Curable System Resists High Temperatures -- UV15TK Master Bond UV15TK is a new one component, high strength, medium viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It...
One Component, Non-Yellowing UV Curable Adhesive -- UV15X-2 Master Bond UV15X-2 is a new one component, non-yellowing UV curable polymer system for high performance coatings, adhesives and sealants with exceptionally fast response to UV radiation. It is 100%...
High Strength, UV Curable Epoxy System -- UV16 Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It...
One Part, Water & Chemical Resistant Curable System -- UV18 Master Bond UV18 is a new one component, high strength UV curable chemically and water resistant polymer system for coating, sealing, & bonding with exceptionally high performance properties. It is...
USP Class VI, Flexible UV Curable Adhesive -- UV18Med Master Bond UV18Med is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile...
High Strength, Chemically Resistant UV Curable System -- UV18S Master Bond UV18S is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile...
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies...
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157 MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it...
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation.
Low Stress, NASA Low Outgassing Silicone Adhesive -- MasterSil 920-LO MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has...
NASA Low Outgassing, Thermally Conductive Two Part Silicone -- MasterSil 972TC-LO MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU•in/ft²•hr•°F [1.01-1.30 W/(m•K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates,...
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving...
No Mix, Thermally Conductive Epoxy Adhesive -- EP3RR-80 Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation...
New Epoxy Offers Rapid Cures and Chemical Resistance -- EP41S-F Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant...
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional...
Two Part, Low Viscosity Epoxy Offers Long Working Life and High Elongation -- EP29LPHE Optically clear EP29LPHE is a two component epoxy that has notable toughness along with high elongation, which imparts good impact and shock resistance. It bonds well to a wide variety...
NASA Low Outgassing Approved, One Component Epoxy -- EP17HT-LO Passing ASTM E595 testing for NASA low outgassing, EP17HT-LO is widely used in a variety of applications in the aerospace, oil/chemical processing, optical, opto-electronic and specialty OEM industries. This single...
Flexible,Fast Curing Silicone for Medical Device Assemblies -- MasterSil 910Med Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally...
Toughened One Part Epoxy for Chip Coating Applications -- Supreme 3HTND-2CCM Primarily used for chip coating, glob top and die attach applications, Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound...
One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation -- Supreme 3HTND-2DM Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it...
Thermally Conductive, USP Class VI approved Epoxy Adhesive -- EP21AOLV-2Med Two component EP21AOLV-2Med, passes USP Class VI biocompatibility testing and ISO 10993-5 cytotoxicity requirements. It resists many chemicals including water, oils, fuels and most notably, EtO, radiation and many cold...
Thermally Conductive, High Temperature Resistant Epoxy Passes NASA Low Outgassing Tests -- EP46HT-2AO Black Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range...
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2 Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils,...
High Temperature Resistant, Optically Clear, Two Part Epoxy -- EP121CL-LO Two component, low viscosity EP121CL-LO features an extraordinary long open time at room temperature of at least 2-3 days. This heat curable epoxy has excellent adhesion to a wide variety...
Non-Yellowing, Abrasion Resistant UV Curable Adhesive -- UV15X-6NM-2 UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it...
One Part Epoxy for Bonding and Glob Top Applications -- Supreme 3HTND-2GT Well suited for glob top or die attach applications, Master Bond Supreme 3HTND-2GT is a one part epoxy system with limited flow for bonding and sealing. Combining outstanding thermal conductivity...
Thermally Stable, NASA Low Outgassing Two Part Epoxy -- EP30-3LO With a glass transition temperature exceeding 175°C, EP30-3LO combines superior chemical resistance along with passing NASA low outgasing testing requirements. It has an easy to use 100 to 30 mix...
One Component, Moderate Viscosity UV Curable System for High Performance Bonding, Sealing, Coating and Casting -- UV25 With a glass transition temperature exceeding 180°C, UV25 offers impressive thermal stability over the broad service temperature range of -60°F to +500°F. This one part, fast curing, moderate viscosity UV...
Toughened, Optically Clear Two Component Epoxy -- EP38CL With a low viscosity, EP38CL is an optically clear two component epoxy that is used for bonding, sealing, coating and encapsulation in optical, aerospace, opto-electronic and specialty OEM applications. It...