Master Bond, Inc. Flexibilized, Thermally Conductive Epoxy Adhesive EP30FLAO

Master Bond Polymer System EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a ten-to-one (10:1) mix ratio by weight. It has an attractive balance of performance properties including high thermal conductivity, superior dimensional stability, physical properties, toughness and electrical insulation. EP30FLAO is a low viscosity epoxy with excellent flow characteristics making it ideal as a thermally conductive potting compound. EP30FLAO is also an excellent adhesive/sealant forming durable, flexibilized bonds that are resistant to thermal cycling and chemicals including water, oil and most organic solvents. It has a wide service temperature range of -60°F to 250°F. EP30FLAO has a desirably low coefficient of themal expansion making it an excellent choice for many potting applications. Color coding of EP30FLAO makes mixing easy part A is off white, part B is clear. Master Bond EP30FLAO is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where electrical insulation, environmental protection, and heat transfer is required.