EP21TDCAOHT is a two component, flexible, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very convenient mix ratio(1:1), weight or volume, and is serviceable over an exceptionally wide temperature range of -100 to 400°F. As a flexible system, it is an ideal adhesive for bond dissimilar substrates when thermal conductivity is needed. EP21TDCAOHT has superior thermal and mechanical shock resistance and is readily thermally cyclable.
| Master Bond, Inc. | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | EP21TDCAOHT |
| Product Name | Two Component Thermally Conductive Epoxy |
| Cure / Technology | Thermoset; Two Component |
| Type / Form | Liquid |
| Substrate Compatibility | Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood |
| Chemical System | Epoxy; Polyurethane |
| Composition | Filled |
