For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond lines as thin as 10-15 microns. This two part epoxy is particularly useful for applications involving heat sensitive substrates, as EP48TC cures at room temperature. It also features unmatched thermal conductivity of 20-25 BTU•in/ft2•hr•°F [2.88-3.60 W/(m•K)]. EP48TC has first rate electrical insulation properties over the wide service temperature range from -100°F to +300°F.
| Master Bond, Inc. | |
|---|---|
| Product Category | Specialty Adhesives, Sealants, and Compounds |
| Product Number | EP48TC |
| Product Name | Epoxy Adhesive with Ultra Low Thermal Resistance |
| Substrate Compatibility | Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates |
| Chemical System | Epoxy |
| Composition | Filled |
| Cure / Technology | Thermoset; Two Component ; Room Temperature Vulcanizing or Curing |
| Features | High Dielectric; Non-corrosive; Thermally Conductive; Adhesive |
