Master Bond, Inc. Epoxy Adhesive with Ultra Low Thermal Resistance EP48TC

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Epoxy Adhesive with Ultra Low Thermal Resistance - EP48TC - Master Bond, Inc.
Hackensack, NJ, USA
Epoxy Adhesive with Ultra Low Thermal Resistance EP48TC
For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond lines as thin as 10-15 microns. This two part epoxy is particularly useful for applications involving heat sensitive substrates, as EP48TC cures at room temperature. It also features unmatched thermal conductivity of 20-25 BTU•in/ft2•hr•°F [2.88-3.60 W/(m•K)]. EP48TC has first rate electrical insulation properties over the wide service temperature range from -100°F to +300°F.
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Technical Specifications

  Master Bond, Inc.
Product Category Specialty Adhesives, Sealants, and Compounds
Product Number EP48TC
Product Name Epoxy Adhesive with Ultra Low Thermal Resistance
Composition Filled
Use Temperature -100 to 300 F (-73 to 149 C)
Dielectric Strength 400 to 450 kV/in (157 to 177 kV/cm)
Tensile (Break) 6000 to 7000 psi (41369 to 48264 KPa)
Thermal Conductivity 2.88 to 3.6 W/m-K (1.66 to 2.08 BTU-ft/hr-ft²-F)
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