Master Bond, Inc. Datasheets for Specialty Adhesives, Sealants, and Compounds

Specialty adhesives, sealants and compounds are specialized and/or proprietary products with unique chemistries, cure technologies and/or compositions.
Specialty Adhesives, Sealants, and Compounds: Learn more

Product Name Notes
Two Component Thermally Conductive Epoxy System -- EP21TDCANHT EP21TDCANHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally...
Two Component Thermally Conductive Epoxy -- EP21TDCAOHT EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally...
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well...
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1 EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as...
Solvent Resistant Adhesive Withstands Methylene Cholride, Alcohols and Fuels -- EP41S-5 EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical...
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests...
Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications -- EP21TDCN-LO Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and...
Two Part, NASA Low Outgassing, Nickel Conductive Epoxy -- EP21TDCN-LO Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system...
Epoxy Adhesive with Low Coefficient of Thermal Expansion -- EP42HT-2LTE Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/°C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications. It has outstanding...
Epoxy Adhesive with Ultra Low Thermal Resistance -- EP48TC For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system...
Ultra Low Viscosity Biocompatible Epoxy for Medical Electronic Applications -- EP62-1LPSPMed Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a an ultra low viscosity. This makes it makes it ideal for use in...
Optically Clear Epoxy Blocks UV Light Transmission -- EP30-2LB Formulated for specific optical applications, Master Bond EP30-2LB blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm. This two part system is optically...
Room Temperature Curing Epoxy Features Low Thermal Resistance -- EP30TC Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88...
Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission -- EP30-2LB Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is...
Optically Clear, Low Viscosity Epoxy with a Long Open Time -- EP62-1LPSP Low viscosity, EP62-1LPSP is a two component, heat curing epoxy that features an exceptionally long working life of 12-24 hours at ambient temperatures. Its thin consistency, long open time and...
Thermally Conductive, Dimensionally Stable Epoxy -- EP121AO Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing,...
Thermally Stable Electrically Insulating Epoxy -- EP121CL Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and...
One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications -- EP17HTND-CCM Master Bond EP17HTND-CCM is a single part, heat cured epoxy system for bonding, sealing and glob top applications.
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2 Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating.
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically...
Low Viscosity Heat Resistant Epoxy System -- EP34CA Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various...
One Component Liquid Epoxy Resin EP36CLV -- EP36CLV Master Bond EP36CLV is a unique one component, high performance epoxy for bonding, sealing, potting and coating featuring electrical insulation, high temperature resistance and exceptionally low viscosity. It varies appreciably...
Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system -- EP39MAOHT Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and...
One Part, NASA Low Outgassing Electrically Conductive Epoxy -- EP3HTS-LO Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for...
One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability -- EP3HTSDA-2 Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance.
UL 1203 Certified Epoxy for Explosion-Proof & Dust-Ignition-Proof Electrical Equipment -- EP41S-6 Master Bond EP41S-6 is a two part epoxy system that meets UL 1203. Meeting this standard allows EP41S-6 to be used in conjunction with electrical equipment that needs to be...
Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion -- EP42HT-3AO Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and...
Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test -- EP93AOFR Master Bond EP93AOFR is a two component flame retardant epoxy system for bonding, sealing, coating and potting.
Silver Filled, Electrically Conductive Adhesive Film -- FL901S Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration...
Biocompatible, Nanosilica Filled LED Curable Adhesive -- LED405Med Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets...
Thermally Conductive Room temperature Curing Epoxy -- EP21AN Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has...
Two Component, Thermally Conductive -- EP21ANHT Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is...
Thermally Conductive, Dimensionally Stable Epoxy -- EP21AO Master Bond Polymer Adhesive EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile...
Thermally Conductive, Room temperature Curing Epoxy -- EP21AOHT Master Bond Polymer Adhesive EP21AOHT is a high temperature resistant, two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or...
Toughened, Shock Resistant, Two Component Epoxy -- EP21TDC Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one...
Room Temperature Curing, Toughened Two Part Epoxy -- EP21TDCHT Master Bond Polymer Adhesive EP21TDCHT is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one...
Oil And Fuel Resistant Polysulfide Based Adhesive -- EP21TP-2 Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix...
Two Component, Room Temperature Curing Polysulfide -- EP21TPLV Master Bond Polymer Adhesive EP21TPLV is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient temperature and even more rapidly at elevated temperatures...
Non-Drip, Polysulfide Based Two Component Adhesive -- EP21TPND Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100...
Fast Curing, Non-Yellowing Two Component Epoxy -- EP30-4 Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated...
High Temperature Resistant, Two Component Epoxy -- EP30HT Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with...
USP Class VI Certified, Two Component Epoxy -- EP30Med Master Bond Polymer Adhesive EP30Med is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily...
Two Component, Optically Clear, Low Viscosity Epoxy -- EP30P Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily...
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33 Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more...
Room Temperature Curing, Two Component Epoxy -- EP33LV Master Bond Polymer Adhesive EP33LV is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more...
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51 Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio...
Two Componen,t Thermally Conductive Epoxy -- EP51AO Master Bond Polymer Adhesive EP51AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile...
Fast Curing, Thermal Cycling Resistant Epoxy Adhesive -- EP51M Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio...
Two Component, Fast Curing Epoxy Adhesive -- EP65 Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly...
Thermally Conductive, Heat Resistant Epoxy System -- EP45HTAO Master Bond Polymer Compound EP45HTAO is a two component thermally conductive epoxy compound for high performance structural bonding, and casting. It is suitable for applications where long term exposure to...
High Temperature Resistant, Toughened Epoxy -- EP125 Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500°F with truly outstanding chemical resistance. High strength bonds serviceable up to 600°F can...
Low Viscosity Structural Epoxy Adhesive System -- EP112 Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The...
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where...
Two Component, Thermal Shock And Heat Resistant Epoxy System -- EP121 Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal...
Two Component Toughened Epoxy Adhesive -- EP126 Master Bond Polymer System EP126 is a two component toughened epoxy resin based high temperature resistant adhesive system with continuous service capability at 500°F and outstanding chemical resistance. This unique...
High Temperature Resistant, One Component Epoxy System -- EP13 Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at...
High Tensile Strength, One Component Epoxy -- EP15 Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This...
Toughened, One Component, Thermally Resistant Epoxy -- EP17 Master Bond Polymer System EP17 is a toughened one component heat curing epoxy resin system featuring high shear strength and very high temperature resistance. This one component system is formulated...
One Component, Storage Stable Epoxy -- EP19HT Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and...
One Component, Flexibilized Epoxy Resin -- EP19HTFL Master Bond Polymer System EP19HTFL is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It is a one part, non mix...
One Component, Storage Stable Epoxy Resin -- EP19HTLV Master Bond Polymer System EP19HTLV is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It feature remarkably long shelf life and...
Room Temperature Curing Epoxy System -- EP21 Master Bond Polymer System EP21 is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties and a very forgiving 1 to 1 mix ratio by weight or...
Acid Resistant, Two Component Epoxy -- EP21AR Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance.
Two Component, Acid Resistant Coating/Liner -- EP21ARHT Master Bond Polymer System EP21ARHT is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance.
Radiopaque Two Component Epoxy Compound -- EP21BAS Master Bond Polymer System EP21BAS is a radioopaque two component epoxy compound which cures readily at ambient or more quickly at elevated temperatures. This epoxy polymer system features outstanding physical...
Two Component Polymer System -- EP21CLV Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures,...
Flexibilized and Toughened Low Viscosity Epoxy -- EP21FL Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature...
High Temperature Resistant Two Component Epoxy -- EP21HT Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating featuring a forgiving 1 to 1 mix ratio and high temperature resistance up...
Low Viscosity, Two Component Epoxy -- EP21LV Master Bond Polymer System EP21LV is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at...
Two Part, Flexible, USP Class VI Epoxy System -- EP21LV3/5Med Master Bond Polymer System EP21LV3/5Med is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readily at...
Two Component, Room Temperature Curing Epoxy -- EP21ND Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, a very forgiving 1 to 1 mix ratio by weight or volume...
Thermally Conductive, Heat Resistant Epoxy -- EP21TCHT-1 Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100/60...
Two Component Epoxy with Outstanding Flexibility -- EP21TDC-2 Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient...
Two Component, Thermally Conductive Epoxy -- EP21TDC-2AN Master Bond Polymer System EP21TDC-2AN is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient...
Two Component Highly Flexibilized Epoxy -- EP21TDC-2AO Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient...
Two Component, Thermally Conductive Epoxy -- EP21TDC-2LO Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to...
Two Component, Highly Flexible Epoxy -- EP21TDC-4 Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or...
Two Component, Toughened Epoxy Compound -- EP21TDC-4HT Master Bond Polymer System EP21TDC-4HT is a unique two component, toughened epoxy compound for high performance bonding, sealing and casting featuring high peel strength, superior resistance to vibration, impact and...
Highly Flexible Two Part Epoxy -- EP21TDC-7 Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or...
Two Component, Nickel Conductive Epoxy Adhesive -- EP21TDCN Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures.
Two Component Nickel Conductive Epoxy Adhesive -- EP21TDCNFL Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Silver Filled, Electrically Conductive Epoxy -- EP21TDCS Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Two Component, Silver Conductive Epoxy Adhesive -- EP21TDCS-LO Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Medical Grade, Silver Conductive Epoxy Compound -- EP21TDCSMed Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room...
Two Component, Low Viscosity Polysulfide -- EP21TPFL-1 Master Bond Polymer System EP21TPFL-1 is a two component, low viscosity, highly flexible epoxy polysulfide elastomer compound for high performance bonding, sealing and casting offering outstanding resistance to fuels, water,...
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22 Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more...
Low Exotherm, Two Component Epoxy -- EP29LP Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will...
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function...
Optically Clear, Low Viscosity, Two Component Epoxy -- EP30 Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly...
Low Viscosity, Two Component Epoxy -- EP30-1 Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or...
Low Outgassing Two Component Epoxy -- EP30-2 Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly...
Two Component, Thermally Resistant Epoxy -- EP30-3 Master Bond Polymer System EP30-3 is a two component, low viscosity, epoxy resin system featuring optical clarity, high physical strength properties, outstanding chemical resistance and superior high temperature properties. Excellent...
Transparent, Highly Flexible Epoxy Compound -- EP30D-10 Master Bond Polymer System EP30-D10 is a uniquely versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bonding, sealing, casting and encapsulation. It...
Thermally Conductive, Dimensionally Stable Epoxy -- EP30AN Master Bond Polymer System EP30AN is a two component epoxy resin system for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and excellent electrical insulation properties.
Thermally Conductive, Low Outgassing Epoxy -- EP30AN-1 Master Bond Polymer System EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity, excellent electrical insulation properties and NASA low...
Thermally Conductive, Low Viscosity Epoxy -- EP30AO Master Bond Polymer System EP30AO is a two component epoxy resin system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at...
Flexibilized, Abrasion Resistant Epoxy -- EP30D-7 Master Bond Polymer System EP30D-7 is a versatile two component flexibilized epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It...
Cryogenically Serviceable Epoxy Urethane System -- EP30DP Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines...
Liquid Epoxy EP30F Resists Abrasion and Chemicals -- EP30F Master Bond Polymer System EP30F is a new fast curing liquid epoxy resin compound for high perform-ance abrasion and chemical resistant seamless floors. This easy-to-use two component epoxy resin system...
Low Viscosity, Flexibilized Two Component Epoxy -- EP30FL Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated...
Two Component Optically Clear Epoxy Compound -- EP30HV Master Bond Polymer System EP30HV is a low viscosity, two component epoxy system for high performance bonding, sealing, coating and casting. It is formulated to cure at room temperature or...
Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting.
NASA Low Outgassing Approved Epoxy System -- EP30LTE-LO Master Bond Polymer System EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing...
Electrically Insulative, Two Component Epoxy System -- EP30M3LV Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more...
Quartz Filled, Two Component Epoxy -- EP30QF Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting formulated to cure at room temperature or more rapidly at...
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31 Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many...
Room Temperature Curing, Two Component Epoxy System -- EP34 Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature...
Two Component, Room Temperature Curing Epoxy -- EP34AN Master Bond Polymer System EP34AN is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where very high thermal conductivity is required. It...
Two Component, Room Temperature Curing Epoxy -- EP34AO Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity is required. It is formulated...
One Component, High Temperature Resistant Epoxy -- EP36 Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination...
One Part, Thermally Conductive, Heat Resistant Epoxy -- EP36AO Master Bond Polymer System EP36AO is a truly unique one component high performance flexibilized epoxy system for electrical potting and encapsulation, baked coatings and adhesive applications. It features an outstanding...
Optically Clear, Impact Resistant Two Component Epoxy -- EP37-3 Master Bond Polymer System EP37-3 is a low viscosity, resilient, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a very...
Highly Flexible Epoxy Features Low Exotherm -- EP37-3FLF Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a...
Two Part Epoxy Offers High Thermal Conductivity -- EP37-3FLFAN Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures...
Low Outgassing, Thermally Conductive Epoxy -- EP37-3FLFAO Master Bond Polymer System EP37-3FLFAO is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures...
Low Viscosity, Fast Curing, Two Component Epoxy -- EP38 Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does...
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2 Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and...
Two Component, Room Temperature Curing Epoxy Resin -- EP39MHT Master Bond Polymer System EP39MHT is a low viscosity, two component, epoxy resin system for high performance potting, encapsulation, sealing and bonding. It cures readily at ambient temperatures to an...
Fast Curing, One Component Epoxy System -- EP3HT Master Bond Polymer System EP3HT is a one component system featuring high shear strength, good temperature resistance along with a fast cure schedule. Typical curing schedules are 5-10 minutes at...
One Component, Biocompatible Epoxy System EP3HTMED -- EP3HTMed Master Bond Polymer System EP3HTMed represents a breakthrough in epoxy adhesive technology combining the ease of use of a one part, no-mix, fast curing adhesive with high shear strength. This...
One Part Epoxy System Featuring Low Viscosity -- EP3RRLV Master Bond Polymer System EP3RRLV is a one component, low viscosity tough epoxy for high performance potting, encapsulation and underfill applications featuring rapid curing at temperatures as low as 220-250°F.
Two Component Epoxy EP41S Features Chemical Resistance -- EP41S Master Bond Polymer System EP41S is a two component epoxy resin compound for durable, high performance, tough, high strength coatings, liners and adhesive/sealants with outstanding resistance to organic solvents including...
Chemically Resistant, Two Component Epoxy System -- EP41S-1 Master Bond Polymer System EP41S-1 is a two component epoxy resin system designed for durable, high performance bonding, sealing, coating and encapsulating. EP41S-1 is formulated to cure at ambient temperatures...
Two Component, Room Temperature Curable Epoxy -- EP42HT-2 Master Bond Polymer System EP42HT-2 is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding chemical resistance. It is...
High Temperature Resistant Epoxy Compound -- EP45HT Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from...
Heat Resistant, USP Class VI Certified Epoxy -- EP45HTMed Master Bond Polymer System EP45HTMed is a two component heat cured epoxy system for high performance structural bonding, sealing, coating and casting. It is especially designed for the assembly of...
Two Component, Heat Resistant Epoxy -- EP46HT-1 Master Bond Polymer System EP46HT-1 is a two component epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures from -100°F to +550°F is...
Two Part, Fast Curing, Cryogenic Epoxy -- EP51FL Master Bond Polymer System EP51FL is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very slow curing,...
Two Part, Rapid Curing, Cryogenic Epoxy -- EP51FL-1 Master Bond Polymer System EP51FL-1 is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very slow curing,...
USP Class VI Two Component Epoxy Resin System -- EP62-1Med Master Bond Polymer System EP62-1Med is a two component epoxy adhesive, sealant, coating, and encapsulant featuring outstanding temperature and chemical resistance. It has wide applicability for use in medical devices,...
Fast Curing, High Temperature Resistant Epoxy -- EP65HT Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting...
Fast Curing High Glass Transition Temperature Epoxy -- EP65HT-1 Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting...
Graphite Filled, Electrically Conductive Epoxy -- EP75-1 Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly...
Nickel Filled Electrically Conductive Epoxy System -- EP76M Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly...
Two Component Silver Conductive Epoxy -- EP77M-1 Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Silver Conductive, Fast Curing Epoxy Adhesive -- EP77M-F Master Bond Polymer System EP77M-F is a two component, silver filled, electrically conductive adhesive for high performance bonding formulated to cure very rapidly at room temperature. Unlike the majority of...
Two Component, Silver Coated, Nickel Filled Epoxy -- EP79 Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more...
One Component Thermally Conductive Epoxy Film -- FL901AO Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film...
Heat Curing. Snap Cure Epoxy Supreme -- Supreme 10HTF-1 Master Bond Polymer System Supreme 10HTF-1 is a one-part/no-mix system featuring a unique combination of properties including high shear and peel strength, exceptionally wide service temperature range and very rapid...
Flexibilized Epoxy System -- Supreme 10HTFL Master Bond Polymer System Supreme 10HTFL features a unique blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4K to...
Fast Curing Surface Mount Adhesive -- Supreme 3HTND-1SM Master Bond Polymer System Supreme 3HTND-1SM is a one component, exceptionally fast curing surface mount adhesive system with exceptional toughness and durability. It has high shear and peel strength for...
One Component, Optically Clear UV Curable System -- UV15-7LRI Master Bond Polymer System UV 15-7LRI is a new one component, optically clear, non-yellowing UV curable polymer system for high performance adhesives, sealants and coatings. It is 100% reactive and...
One Part, Optically Clear UV Curable System -- UV15-42C Master Bond Polymer System UV15-42C is a new one component, high viscosity, optically clear, tough UV curable polymer system with extended capability of -80°F to +300°F. It is fully reactive,...
High Strength, Non-Yellowing UV Curable -- UV15-7NV Master Bond Polymer system UV15-7NV is a new one component, optically clear, non yellowing UV curable polymer system for high performance bonding, sealing and coating. It is 100% reactive and...
One Component UV Curable Compound -- UV15-7SP4 Master Bond Polymer System UV15-7SP4 is a new one component, optically clear, toughened UV and/or curable polymer system with extended service capability of -80°F to +250°F. It is 100% reactive,...
UV Curable Compound UV15-7TK1ANV Features Paste Consistency -- UV15-7TK1ANV Master Bond Polymer System UV15-7TK1ANV is a new one component, high viscosity, optically clear, tough UV curable polymer system with extended capability of -80°F to +300°F. It is fully reactive,...
One Component, UV Curable Glob Top Compound -- UV15X-2GT Master Bond Polymer System UV15X-2GT is a new, easily processable, one component, UV curable glob top, featuring exceptional durability and chemical resistance. UV15X-2GT is a thixotropic paste that handles well...
One Component, High Viscosity UV Curable Compound -- UV15X-5 Master Bond Polymer System UV15X-5 is a newly developed one component, non-yellowing, UV curable urethane elastomer system possessing high flexibility and outstanding abrasion resistance. This high viscosity system can be...
One Component Low Viscosity, Optically Clear UV Curable -- UV19 Master Bond Polymer System UV19 is a newly developed UV curable, low viscosity optically clear compound specifically designed for high performance laminating, sealing, bonding and coating. This remarkable acrylic based...
One Component, Highly Flexible UV Curable Urethane -- UV21 Master Bond Polymer System UV21 is an easy to use one component UV curable urethane elastomer compound. It has been used for bonding, sealing, casting and formed in place high...
One Component, UV Curable, Nanosilica Reinforced Epoxy -- UV22 Master Bond Polymer System UV22 represents a remarkable technological breakthrough in the utilization of nanotechnology in the formulation of a one component UV curable epoxy for coating, sealing, and encapsulation...
Toughened Epoxy Adhesive/Sealant Supreme -- Supreme 10HTCL Master Bond Supreme 10HTCL features a unique blend of performance properties including both high shear and peel strengths along with convenient handling. This one component system is formulated to cure...
Two Component, High Performance Epoxy -- EP46HT Master Bond System EP46HT is a newly formulated two component high performance heat resistant epoxy resin system with excellent mechanical strength and chemically resistant properties for structural bonding, sealing and...
One Component, UV Curable Adhesive System -- UV10 Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a...
One Component, Biocompatible UV Curable Adhesive -- UV10Med Master Bond UV10Med is a one component, UV curable system that fully meets USP Class VI specifications. This low viscosity, optically clear system is a superior adhesive, sealant and coating...
One Component, High Viscosity UV Curable Polymer -- UV11-3 Master Bond UV11-3 is an extra-hard, super-abrasion resist-radiation curable coating system for plastic substrates. It is a low viscosity, clear, 100% reactive liquid that can be cured readily by exposure...
High Strength UV Curable Adhesive -- UV15 Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It...
One Component, UV and Heat Curable Epoxy -- UV15DC80 Master Bond UV15DC80 is a very special dual cured (UV/heat) curable system featuring the capacity to cure in shadowed out of areas by supplementary heat curing at 80°C for 15-30...
One Part, Flexiblized UV Curable System -- UV15FL Master Bond UV15FL is a new one component, high strength, low viscosity, flexible UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties.
One Component, Low Viscosity UV Curable System -- UV15LV Master Bond UV15LV is a new one component, high strength UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a...
One Part UV Curable System Resists High Temperatures -- UV15TK Master Bond UV15TK is a new one component, high strength, medium viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It...
One Component, Non-Yellowing UV Curable Adhesive -- UV15X-2 Master Bond UV15X-2 is a new one component, non-yellowing UV curable polymer system for high performance coatings, adhesives and sealants with exceptionally fast response to UV radiation. It is 100%...
High Strength, UV Curable Epoxy System -- UV16 Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It...
One Part, Water & Chemical Resistant Curable System -- UV18 Master Bond UV18 is a new one component, high strength UV curable chemically and water resistant polymer system for coating, sealing, & bonding with exceptionally high performance properties. It is...
USP Class VI, Flexible UV Curable Adhesive -- UV18Med Master Bond UV18Med is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile...
High Strength, Chemically Resistant UV Curable System -- UV18S Master Bond UV18S is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile...
Nanosilica Filled, NASA Low Outgassing, Dual Cure Adhesive -- UV22DC80-1 Master Bond UV22DC80-1 is a one part nanosilica filled system for bonding and sealing and coating applications in the aerospace, optical and electronic industries. This video demonstrates the epoxy based...
NASA Low Outgassing Rated UV Curing Adhesive with High Glass Transition Temperature -- UV26 Master Bond UV26 is a one part UV curing system for bonding, coating and sealing. It features very low viscosity and high temperature resistance.
One component primer/adhesive for polyolefins, passes ISO 10993-5 test -- X21Med Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity (<250 cps) solvent based system is easy...
Low Stress, NASA Low Outgassing Silicone Adhesive -- MasterSil 920-LO MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has...
NASA Low Outgassing, Thermally Conductive Two Part Silicone -- MasterSil 972TC-LO MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU•in/ft²•hr•°F [1.01-1.30 W/(m•K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates,...
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving...
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional...
NASA Low Outgassing Approved, One Component Epoxy -- EP17HT-LO Passing ASTM E595 testing for NASA low outgassing, EP17HT-LO is widely used in a variety of applications in the aerospace, oil/chemical processing, optical, opto-electronic and specialty OEM industries. This single...
Thermally Conductive One Part Epoxy for Die Attach -- Supreme 3HTND-2DA Single component Supreme 3HTND-2DA offers convenient processing and dispensing with no tailing or bleed out and only requires simple refrigeration for storage. It cures rapidly in 5-10 minutes at 150°C.
Heat Resistant, NASA Low Outgassing Epoxy Adhesive -- Supreme 12AOHT-LO Supreme 12AOHT-LO is a toughened system with superior resistance to aggressive thermal cycling and shock. Cryogenically serviceable, it combines superior thermal conductivity with reliable electrical insulation properties. This dimensionally stable...
One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation -- Supreme 3HTND-2DM Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it...
Thermally Conductive, High Temperature Resistant Epoxy Passes NASA Low Outgassing Tests -- EP46HT-2AO Black Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range...
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2 Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils,...
High Temperature Resistant, Optically Clear, Two Part Epoxy -- EP121CL-LO Two component, low viscosity EP121CL-LO features an extraordinary long open time at room temperature of at least 2-3 days. This heat curable epoxy has excellent adhesion to a wide variety...
One component, heat curing epoxy for structural bonding applications featuring low coefficient of thermal expansion -- EP13LTE Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use,...
Thermally Stable, NASA Low Outgassing Two Part Epoxy -- EP30-3LO With a glass transition temperature exceeding 175°C, EP30-3LO combines superior chemical resistance along with passing NASA low outgasing testing requirements. It has an easy to use 100 to 30 mix...
High Temperature Resistant, Thermally Conductive Epoxy -- EP46HT-1AO With exceptional thermal conductivity and electrical insulation properties, EP46HT-1AO is a two component epoxy for high performance bonding and sealing applications. This high temperature resistant system has a glass transition...