Master Bond, Inc. Datasheets for Specialty Adhesives, Sealants, and Compounds
Specialty adhesives, sealants and compounds are specialized and/or proprietary products with unique chemistries, cure technologies and/or compositions.
Specialty Adhesives, Sealants, and Compounds: Learn more
| Product Name | Notes |
|---|---|
| Two Component Thermally Conductive Epoxy System -- EP21TDCANHT | EP21TDCANHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally... |
| Two Component Thermally Conductive Epoxy -- EP21TDCAOHT | EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally... |
| B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR | EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of... |
| Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black | EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well... |
| Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1 | EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as... |
| Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med | EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. |
| Solvent Resistant Adhesive Withstands Methylene Cholride, Alcohols and Fuels -- EP41S-5 | EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical... |
| NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance -- EP42-2LV Black | EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically... |
| Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT | EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests... |
| Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications -- EP21TDCN-LO | Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and... |
| Two Part, NASA Low Outgassing, Nickel Conductive Epoxy -- EP21TDCN-LO | Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system... |
| Epoxy Adhesive with Low Coefficient of Thermal Expansion -- EP42HT-2LTE | Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/°C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications. It has outstanding... |
| Epoxy Adhesive with Ultra Low Thermal Resistance -- EP48TC | For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system... |
| Ultra Low Viscosity Biocompatible Epoxy for Medical Electronic Applications -- EP62-1LPSPMed | Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a an ultra low viscosity. This makes it makes it ideal for use in... |
| Optically Clear Epoxy Blocks UV Light Transmission -- EP30-2LB | Formulated for specific optical applications, Master Bond EP30-2LB blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm. This two part system is optically... |
| Room Temperature Curing Epoxy Features Low Thermal Resistance -- EP30TC | Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88... |
| Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission -- EP30-2LB | Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is... |
| Optically Clear, Low Viscosity Epoxy with a Long Open Time -- EP62-1LPSP | Low viscosity, EP62-1LPSP is a two component, heat curing epoxy that features an exceptionally long working life of 12-24 hours at ambient temperatures. Its thin consistency, long open time and... |
| Thermally Conductive, Dimensionally Stable Epoxy -- EP121AO | Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing,... |
| Thermally Stable Electrically Insulating Epoxy -- EP121CL | Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and... |
| One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications -- EP17HTND-CCM | Master Bond EP17HTND-CCM is a single part, heat cured epoxy system for bonding, sealing and glob top applications. |
| Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications -- EP30DPBFMed | Master Bond EP30DPBFMed is a two part, flexibilized epoxy-urethane hybrid system that can be used for bonding, sealing, coating, and encapsulation. |
| Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2 | Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. |
| Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS | Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically... |
| Low Viscosity Heat Resistant Epoxy System -- EP34CA | Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various... |
| One Component Liquid Epoxy Resin EP36CLV -- EP36CLV | Master Bond EP36CLV is a unique one component, high performance epoxy for bonding, sealing, potting and coating featuring electrical insulation, high temperature resistance and exceptionally low viscosity. It varies appreciably... |
| Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system -- EP39MAOHT | Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and... |
| One Part, NASA Low Outgassing Electrically Conductive Epoxy -- EP3HTS-LO | Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for... |
| One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability -- EP3HTSDA-2 | Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance. |
| UL 1203 Certified Epoxy for Explosion-Proof & Dust-Ignition-Proof Electrical Equipment -- EP41S-6 | Master Bond EP41S-6 is a two part epoxy system that meets UL 1203. Meeting this standard allows EP41S-6 to be used in conjunction with electrical equipment that needs to be... |
| Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion -- EP42HT-3AO | Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and... |
| Two Component, Room Temperature Curing Epoxy For Bonding, Coating, Sealing And Potting -- EP88FL | Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. |
| Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test -- EP93AOFR | Master Bond EP93AOFR is a two component flame retardant epoxy system for bonding, sealing, coating and potting. |
| Silver Filled, Electrically Conductive Adhesive Film -- FL901S | Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration... |
| Biocompatible, Nanosilica Filled LED Curable Adhesive -- LED405Med | Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets... |
| Thermally Conductive Room temperature Curing Epoxy -- EP21AN | Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has... |
| Two Component, Thermally Conductive -- EP21ANHT | Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is... |
| Thermally Conductive, Dimensionally Stable Epoxy -- EP21AO | Master Bond Polymer Adhesive EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile... |
| Thermally Conductive, Room temperature Curing Epoxy -- EP21AOHT | Master Bond Polymer Adhesive EP21AOHT is a high temperature resistant, two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or... |
| Toughened, Shock Resistant, Two Component Epoxy -- EP21TDC | Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one... |
| Room Temperature Curing, Toughened Two Part Epoxy -- EP21TDCHT | Master Bond Polymer Adhesive EP21TDCHT is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one... |
| Oil And Fuel Resistant Polysulfide Based Adhesive -- EP21TP-2NV | Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix... |
| Two Component, Room Temperature Curing Polysulfide -- EP21TPLV-NV | Master Bond Polymer Adhesive EP21TPLV is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient temperature and even more rapidly at elevated temperatures... |
| Non-Drip, Polysulfide Based Two Component Adhesive -- EP21TPND-NV | Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100... |
| Fast Curing, Non-Yellowing Two Component Epoxy -- EP30-4 | Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated... |
| High Temperature Resistant, Two Component Epoxy -- EP30HT | Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with... |
| USP Class VI Certified, Two Component Epoxy -- EP30Med | Master Bond Polymer Adhesive EP30Med is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily... |
| Two Component, Optically Clear, Low Viscosity Epoxy -- EP30P | Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily... |
| High Tempreature and Thermal Cycling Resistant Epoxy -- EP33 | Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more... |
| Room Temperature Curing, Two Component Epoxy -- EP33LV | Master Bond Polymer Adhesive EP33LV is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more... |
| Fast Curing, High Bond Strength Epoxy Adhesive -- EP51 | Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio... |
| Two Componen,t Thermally Conductive Epoxy -- EP51AO | Master Bond Polymer Adhesive EP51AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile... |
| Fast Curing, Thermal Cycling Resistant Epoxy Adhesive -- EP51M | Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio... |
| Two Component, Fast Curing Epoxy Adhesive -- EP65 | Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly... |
| Thermally Conductive, Heat Resistant Epoxy System -- EP45AOHT | Master Bond Polymer Compound EP45HTAO is a two component thermally conductive epoxy compound for high performance structural bonding, and casting. It is suitable for applications where long term exposure to... |
| High Temperature Resistant, Toughened Epoxy -- EP125 | Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500°F with truly outstanding chemical resistance. High strength bonds serviceable up to 600°F can... |
| Low Viscosity Structural Epoxy Adhesive System -- EP112 | Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The... |
| Moderate Viscosity Thermally Conductive Epoxy -- EP112AO | Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where... |
| Two Component, Thermal Shock And Heat Resistant Epoxy System -- EP121 | Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal... |
| Two Component Toughened Epoxy Adhesive -- EP126 | Master Bond Polymer System EP126 is a two component toughened epoxy resin based high temperature resistant adhesive system with continuous service capability at 500°F and outstanding chemical resistance. This unique... |
| High Temperature Resistant, One Component Epoxy System -- EP13 | Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at... |
| High Tensile Strength, One Component Epoxy -- EP15 | Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This... |
| Toughened, One Component, Thermally Resistant Epoxy -- EP17 | Master Bond Polymer System EP17 is a toughened one component heat curing epoxy resin system featuring high shear strength and very high temperature resistance. This one component system is formulated... |
| One Component, Storage Stable Epoxy -- EP19HT | Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and... |
| One Component, Flexibilized Epoxy Resin -- EP19HTFL | Master Bond Polymer System EP19HTFL is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It is a one part, non mix... |
| One Component, Storage Stable Epoxy Resin -- EP19HTLV | Master Bond Polymer System EP19HTLV is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It feature remarkably long shelf life and... |
| Room Temperature Curing Epoxy System -- EP21 | Master Bond Polymer System EP21 is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties and a very forgiving 1 to 1 mix ratio by weight or... |
| Acid Resistant, Two Component Epoxy -- EP21AR | Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. |
| Two Component, Acid Resistant Coating/Liner -- EP21ARHT | Master Bond Polymer System EP21ARHT is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. |
| Radiopaque Two Component Epoxy Compound -- EP21BAS | Master Bond Polymer System EP21BAS is a radioopaque two component epoxy compound which cures readily at ambient or more quickly at elevated temperatures. This epoxy polymer system features outstanding physical... |
| Two Component Polymer System -- EP21CLV | Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures,... |
| Flexibilized and Toughened Low Viscosity Epoxy -- EP21FL | Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature... |
| High Temperature Resistant Two Component Epoxy -- EP21HT | Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating featuring a forgiving 1 to 1 mix ratio and high temperature resistance up... |
| Low Viscosity, Two Component Epoxy -- EP21LV | Master Bond Polymer System EP21LV is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at... |
| Two Part, Flexible, USP Class VI Epoxy System -- EP21LV3/5Med | Master Bond Polymer System EP21LV3/5Med is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readily at... |
| Two Component, Room Temperature Curing Epoxy -- EP21ND | Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, a very forgiving 1 to 1 mix ratio by weight or volume... |
| Thermally Conductive, Heat Resistant Epoxy -- EP21TCHT-1 | Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100/60... |
| Two Component Epoxy with Outstanding Flexibility -- EP21TDC-2 | Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient... |
| Two Component, Thermally Conductive Epoxy -- EP21TDC-2AN | Master Bond Polymer System EP21TDC-2AN is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient... |
| Two Component Highly Flexibilized Epoxy -- EP21TDC-2AO | Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient... |
| Two Component, Thermally Conductive Epoxy -- EP21TDC-2LO | Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to... |
| Two Component, Highly Flexible Epoxy -- EP21TDC-4 | Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or... |
| Two Component, Toughened Epoxy Compound -- EP21TDC-4HT | Master Bond Polymer System EP21TDC-4HT is a unique two component, toughened epoxy compound for high performance bonding, sealing and casting featuring high peel strength, superior resistance to vibration, impact and... |
| Highly Flexible Two Part Epoxy -- EP21TDC-7 | Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or... |
| Two Component, Nickel Conductive Epoxy Adhesive -- EP21TDCN | Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures. |
| Two Component Nickel Conductive Epoxy Adhesive -- EP21TDCNFL | Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... |
| Silver Filled, Electrically Conductive Epoxy -- EP21TDCS | Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... |
| Two Component, Silver Conductive Epoxy Adhesive -- EP21TDCS-LO | Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... |
| Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL | Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... |
| Medical Grade, Silver Conductive Epoxy Compound -- EP21TDCSMed | Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room... |
| Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22 | Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more... |
| Low Exotherm, Two Component Epoxy -- EP29LP | Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will... |
| Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP | Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function... |
| Optically Clear, Low Viscosity, Two Component Epoxy -- EP30 | Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly... |
| Low Viscosity, Two Component Epoxy -- EP30-1 | Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or... |
| Low Outgassing Two Component Epoxy -- EP30-2 | Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly... |
| Two Component, Thermally Resistant Epoxy -- EP30-3 | Master Bond Polymer System EP30-3 is a two component, low viscosity, epoxy resin system featuring optical clarity, high physical strength properties, outstanding chemical resistance and superior high temperature properties. Excellent... |
| Transparent, Highly Flexible Epoxy Compound -- EP30D-10 | Master Bond Polymer System EP30-D10 is a uniquely versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bonding, sealing, casting and encapsulation. It... |
| Thermally Conductive, Dimensionally Stable Epoxy -- EP30AN | Master Bond Polymer System EP30AN is a two component epoxy resin system for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and excellent electrical insulation properties. |
| Thermally Conductive, Low Outgassing Epoxy -- EP30AN-1 | Master Bond Polymer System EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity, excellent electrical insulation properties and NASA low... |
| Thermally Conductive, Low Viscosity Epoxy -- EP30AO | Master Bond Polymer System EP30AO is a two component epoxy resin system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at... |
| Flexibilized, Abrasion Resistant Epoxy -- EP30D-7 | Master Bond Polymer System EP30D-7 is a versatile two component flexibilized epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It... |
| Cryogenically Serviceable Epoxy Urethane System -- EP30DP-NV | Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines... |
| Liquid Epoxy EP30F Resists Abrasion and Chemicals -- EP30F | Master Bond Polymer System EP30F is a new fast curing liquid epoxy resin compound for high perform-ance abrasion and chemical resistant seamless floors. This easy-to-use two component epoxy resin system... |
| Low Viscosity, Flexibilized Two Component Epoxy -- EP30FL | Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated... |
| Two Component Optically Clear Epoxy Compound -- EP30HV | Master Bond Polymer System EP30HV is a low viscosity, two component epoxy system for high performance bonding, sealing, coating and casting. It is formulated to cure at room temperature or... |
| Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE | Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. |
| NASA Low Outgassing Approved Epoxy System -- EP30LTE-LO | Master Bond Polymer System EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing... |
| Electrically Insulative, Two Component Epoxy System -- EP30M3LV-NV | Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more... |
| Quartz Filled, Two Component Epoxy -- EP30QF | Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting formulated to cure at room temperature or more rapidly at... |
| High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31 | Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many... |
| Room Temperature Curing, Two Component Epoxy System -- EP34 | Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature... |
| Two Component, Room Temperature Curing Epoxy -- EP34AN | Master Bond Polymer System EP34AN is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where very high thermal conductivity is required. It... |
| Two Component, Room Temperature Curing Epoxy -- EP34AO | Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity is required. It is formulated... |
| One Component, High Temperature Resistant Epoxy -- EP36 | Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination... |
| One Part, Thermally Conductive, Heat Resistant Epoxy -- EP36AO | Master Bond Polymer System EP36AO is a truly unique one component high performance flexibilized epoxy system for electrical potting and encapsulation, baked coatings and adhesive applications. It features an outstanding... |
| Optically Clear, Impact Resistant Two Component Epoxy -- EP37-3 | Master Bond Polymer System EP37-3 is a low viscosity, resilient, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a very... |
| Highly Flexible Epoxy Features Low Exotherm -- EP37-3FLF | Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a... |
| Two Part Epoxy Offers High Thermal Conductivity -- EP37-3FLFAN | Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures... |
| Low Outgassing, Thermally Conductive Epoxy -- EP37-3FLFAO | Master Bond Polymer System EP37-3FLFAO is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures... |
| Low Viscosity, Fast Curing, Two Component Epoxy -- EP38 | Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does... |
| Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2 | Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and... |
| Two Component, Room Temperature Curing Epoxy Resin -- EP39MHT | Master Bond Polymer System EP39MHT is a low viscosity, two component, epoxy resin system for high performance potting, encapsulation, sealing and bonding. It cures readily at ambient temperatures to an... |
| Fast Curing, One Component Epoxy System -- EP3HT | Master Bond Polymer System EP3HT is a one component system featuring high shear strength, good temperature resistance along with a fast cure schedule. Typical curing schedules are 5-10 minutes at... |
| One Component, Biocompatible Epoxy System EP3HTMED -- EP3HTMed | Master Bond Polymer System EP3HTMed represents a breakthrough in epoxy adhesive technology combining the ease of use of a one part, no-mix, fast curing adhesive with high shear strength. This... |
| One Part Epoxy System Featuring Low Viscosity -- EP3RRLV | Master Bond Polymer System EP3RRLV is a one component, low viscosity tough epoxy for high performance potting, encapsulation and underfill applications featuring rapid curing at temperatures as low as 220-250°F. |
| Two Component Epoxy EP41S Features Chemical Resistance -- EP41S | Master Bond Polymer System EP41S is a two component epoxy resin compound for durable, high performance, tough, high strength coatings, liners and adhesive/sealants with outstanding resistance to organic solvents including... |
| Chemically Resistant, Two Component Epoxy System -- EP41S-1 | Master Bond Polymer System EP41S-1 is a two component epoxy resin system designed for durable, high performance bonding, sealing, coating and encapsulating. EP41S-1 is formulated to cure at ambient temperatures... |
| Two Component, Room Temperature Curable Epoxy -- EP42HT-2 | Master Bond Polymer System EP42HT-2 is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding chemical resistance. It is... |
| High Temperature Resistant Epoxy Compound -- EP45HT | Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from... |
| Heat Resistant, USP Class VI Certified Epoxy -- EP45HTMed | Master Bond Polymer System EP45HTMed is a two component heat cured epoxy system for high performance structural bonding, sealing, coating and casting. It is especially designed for the assembly of... |
| Two Component, Heat Resistant Epoxy -- EP46HT-1 | Master Bond Polymer System EP46HT-1 is a two component epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures from -100°F to +550°F is... |
| Two Part, Fast Curing, Cryogenic Epoxy -- EP51FL | Master Bond Polymer System EP51FL is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very slow curing,... |
| Two Part, Rapid Curing, Cryogenic Epoxy -- EP51FL-1 | Master Bond Polymer System EP51FL-1 is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very slow curing,... |
| USP Class VI Two Component Epoxy Resin System -- EP62-1Med | Master Bond Polymer System EP62-1Med is a two component epoxy adhesive, sealant, coating, and encapsulant featuring outstanding temperature and chemical resistance. It has wide applicability for use in medical devices,... |
| Fast Curing, High Temperature Resistant Epoxy -- EP65HT | Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting... |
| Fast Curing High Glass Transition Temperature Epoxy -- EP65HT-1 | Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting... |
| Graphite Filled, Electrically Conductive Epoxy -- EP75-1 | Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly... |
| Nickel Filled Electrically Conductive Epoxy System -- EP76M | Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly... |
| Two Component Silver Conductive Epoxy -- EP77M-1 | Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... |
| Silver Conductive, Fast Curing Epoxy Adhesive -- EP77M-F | Master Bond Polymer System EP77M-F is a two component, silver filled, electrically conductive adhesive for high performance bonding formulated to cure very rapidly at room temperature. Unlike the majority of... |
| Two Component, Silver Coated, Nickel Filled Epoxy -- EP79 | Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more... |
| One Component Thermally Conductive Epoxy Film -- FL901AO | Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film... |
| Heat Curing. Snap Cure Epoxy Supreme -- Supreme 10HTF-1 | Master Bond Polymer System Supreme 10HTF-1 is a one-part/no-mix system featuring a unique combination of properties including high shear and peel strength, exceptionally wide service temperature range and very rapid... |
| Flexibilized Epoxy System -- Supreme 10HTFL | Master Bond Polymer System Supreme 10HTFL features a unique blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4K to... |
| Fast Curing Surface Mount Adhesive -- Supreme 3HTND-1SM | Master Bond Polymer System Supreme 3HTND-1SM is a one component, exceptionally fast curing surface mount adhesive system with exceptional toughness and durability. It has high shear and peel strength for... |
| One Component, Optically Clear UV Curable System -- UV15-7LRI | Master Bond Polymer System UV 15-7LRI is a new one component, optically clear, non-yellowing UV curable polymer system for high performance adhesives, sealants and coatings. It is 100% reactive and... |
| One Part, Optically Clear UV Curable System -- UV15-42C | Master Bond Polymer System UV15-42C is a new one component, high viscosity, optically clear, tough UV curable polymer system with extended capability of -80°F to +300°F. It is fully reactive,... |
| High Strength, Non-Yellowing UV Curable -- UV15-7NV | Master Bond Polymer system UV15-7NV is a new one component, optically clear, non yellowing UV curable polymer system for high performance bonding, sealing and coating. It is 100% reactive and... |
| One Component UV Curable Compound -- UV15-7SP4 | Master Bond Polymer System UV15-7SP4 is a new one component, optically clear, toughened UV and/or curable polymer system with extended service capability of -80°F to +250°F. It is 100% reactive,... |
| UV Curable Compound UV15-7TK1ANV Features Paste Consistency -- UV15-7TK1ANV | Master Bond Polymer System UV15-7TK1ANV is a new one component, high viscosity, optically clear, tough UV curable polymer system with extended capability of -80°F to +300°F. It is fully reactive,... |
| One Component, UV Curable Glob Top Compound -- UV15X-2GT | Master Bond Polymer System UV15X-2GT is a new, easily processable, one component, UV curable glob top, featuring exceptional durability and chemical resistance. UV15X-2GT is a thixotropic paste that handles well... |
| One Component, High Viscosity UV Curable Compound -- UV15X-5 | Master Bond Polymer System UV15X-5 is a newly developed one component, non-yellowing, UV curable urethane elastomer system possessing high flexibility and outstanding abrasion resistance. This high viscosity system can be... |
| One Component Low Viscosity, Optically Clear UV Curable -- UV19 | Master Bond Polymer System UV19 is a newly developed UV curable, low viscosity optically clear compound specifically designed for high performance laminating, sealing, bonding and coating. This remarkable acrylic based... |
| One Component, Highly Flexible UV Curable Urethane -- UV21 | Master Bond Polymer System UV21 is an easy to use one component UV curable urethane elastomer compound. It has been used for bonding, sealing, casting and formed in place high... |
| One Component, UV Curable, Nanosilica Reinforced Epoxy -- UV22 | Master Bond Polymer System UV22 represents a remarkable technological breakthrough in the utilization of nanotechnology in the formulation of a one component UV curable epoxy for coating, sealing, and encapsulation... |
| Toughened Epoxy Adhesive/Sealant Supreme -- Supreme 10HTCL | Master Bond Supreme 10HTCL features a unique blend of performance properties including both high shear and peel strengths along with convenient handling. This one component system is formulated to cure... |
| Thermally Conductive, Electrically Insulative Potting Compound Resists High Temperatures -- Supreme 121AO | Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation with a free flowing viscosity. |
| One Component Toughened Epoxy System For Bonding And Sealing -- Supreme 17HT | Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. |
| Two Component, High Performance Epoxy -- EP46HT | Master Bond System EP46HT is a newly formulated two component high performance heat resistant epoxy resin system with excellent mechanical strength and chemically resistant properties for structural bonding, sealing and... |
| One Component, UV Curable Adhesive System -- UV10 | Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a... |
| One Component, Biocompatible UV Curable Adhesive -- UV10Med | Master Bond UV10Med is a one component, UV curable system that fully meets USP Class VI specifications. This low viscosity, optically clear system is a superior adhesive, sealant and coating... |
| One Component, High Viscosity UV Curable Polymer -- UV11-3 | Master Bond UV11-3 is an extra-hard, super-abrasion resist-radiation curable coating system for plastic substrates. It is a low viscosity, clear, 100% reactive liquid that can be cured readily by exposure... |
| High Strength UV Curable Adhesive -- UV15 | Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It... |
| One Component, UV and Heat Curable Epoxy -- UV15DC80 | Master Bond UV15DC80 is a very special dual cured (UV/heat) curable system featuring the capacity to cure in shadowed out of areas by supplementary heat curing at 80°C for 15-30... |
| One Part, Flexiblized UV Curable System -- UV15FL | Master Bond UV15FL is a new one component, high strength, low viscosity, flexible UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. |
| One Component, Low Viscosity UV Curable System -- UV15LV | Master Bond UV15LV is a new one component, high strength UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a... |
| One Part UV Curable System Resists High Temperatures -- UV15TK | Master Bond UV15TK is a new one component, high strength, medium viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It... |
| One Component, Non-Yellowing UV Curable Adhesive -- UV15X-2 | Master Bond UV15X-2 is a new one component, non-yellowing UV curable polymer system for high performance coatings, adhesives and sealants with exceptionally fast response to UV radiation. It is 100%... |
| High Strength, UV Curable Epoxy System -- UV16 | Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It... |
| One Part, Water & Chemical Resistant Curable System -- UV18 | Master Bond UV18 is a new one component, high strength UV curable chemically and water resistant polymer system for coating, sealing, & bonding with exceptionally high performance properties. It is... |
| USP Class VI, Flexible UV Curable Adhesive -- UV18Med | Master Bond UV18Med is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile... |
| High Strength, Chemically Resistant UV Curable System -- UV18S | Master Bond UV18S is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile... |
| Nanosilica Filled, NASA Low Outgassing, Dual Cure Adhesive -- UV22DC80-1 | Master Bond UV22DC80-1 is a one part nanosilica filled system for bonding and sealing and coating applications in the aerospace, optical and electronic industries. This video demonstrates the epoxy based... |
| NASA Low Outgassing Rated UV Curing Adhesive with High Glass Transition Temperature -- UV26 | Master Bond UV26 is a one part UV curing system for bonding, coating and sealing. It features very low viscosity and high temperature resistance. |
| One component primer/adhesive for polyolefins, passes ISO 10993-5 test -- X21Med | Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity (<250 cps) solvent based system is easy... |
| Low Stress, NASA Low Outgassing Silicone Adhesive -- MasterSil 920-LO | MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has... |
| NASA Low Outgassing, Thermally Conductive Two Part Silicone -- MasterSil 972TC-LO | MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU•in/ft²•hr•°F [1.01-1.30 W/(m•K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates,... |
| Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO | MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving... |
| Dual Curing, Thixotropic Adhesive -- UV22DC80-10F | One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional... |
| NASA Low Outgassing Approved, One Component Epoxy -- EP17HT-LO | Passing ASTM E595 testing for NASA low outgassing, EP17HT-LO is widely used in a variety of applications in the aerospace, oil/chemical processing, optical, opto-electronic and specialty OEM industries. This single... |
| Thermally Conductive One Part Epoxy for Die Attach -- Supreme 3HTND-2DA | Single component Supreme 3HTND-2DA offers convenient processing and dispensing with no tailing or bleed out and only requires simple refrigeration for storage. It cures rapidly in 5-10 minutes at 150°C. |
| Heat Resistant, NASA Low Outgassing Epoxy Adhesive -- Supreme 12AOHT-LO | Supreme 12AOHT-LO is a toughened system with superior resistance to aggressive thermal cycling and shock. Cryogenically serviceable, it combines superior thermal conductivity with reliable electrical insulation properties. This dimensionally stable... |
| One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation -- Supreme 3HTND-2DM | Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it... |
| Thermally Conductive, High Temperature Resistant Epoxy Passes NASA Low Outgassing Tests -- EP46HT-2AO Black | Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range... |
| Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2 | Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils,... |
| High Temperature Resistant, Optically Clear, Two Part Epoxy -- EP121CL-LO | Two component, low viscosity EP121CL-LO features an extraordinary long open time at room temperature of at least 2-3 days. This heat curable epoxy has excellent adhesion to a wide variety... |
| One component, heat curing epoxy for structural bonding applications featuring low coefficient of thermal expansion -- EP13LTE | Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use,... |
| Thermally Stable, NASA Low Outgassing Two Part Epoxy -- EP30-3LO | With a glass transition temperature exceeding 175°C, EP30-3LO combines superior chemical resistance along with passing NASA low outgasing testing requirements. It has an easy to use 100 to 30 mix... |
| High Temperature Resistant, Thermally Conductive Epoxy -- EP46HT-1AO | With exceptional thermal conductivity and electrical insulation properties, EP46HT-1AO is a two component epoxy for high performance bonding and sealing applications. This high temperature resistant system has a glass transition... |