Master Bond, Inc. Two Component, Fast Curing Epoxy Adhesive EP65

Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10 minutes, shorter lives at higher temperatures for maximum bond strength. Tensile lap shear strengths in excess of 3000 psi are readily obtained together with good impact resistance. Master Bond Polymer Adhesive EP65 produces only exceptionally good performance bonds for service in the remarkably wide temperature range of below -80°F to over 300°F. It offers superior resistance to thermal shock, vibration and stress fatigue cracking while maintaining the moisture, creep, corrosion and thermal resistance typical of epoxy resin adhesives. Master Bond Polymer Adhesive EP65 is 100% reactive and does not contain any diluents or solvents. Master Bond Polymer Adhesive EP65 produces durable high strength exceptionally tough bonds which are remarkably resistant to thermal cycling and any chemicals including water, oil, fuels and most organic solvents even upon prolonged exposures. Unlike any other epoxy adhesives, it's performance is relatively insensitive to changes in the cure schedule or substrate cleaning procedures. Adhesion to metal, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is a superior electrical insulator. Master Bond Polymer Adhesive EP65 offers the convenience of a fast room temperature cure and very favorable bonding performance for even the most difficult applications in the electrical/electroni c, audio, computer, appliance, automotive and chemical industries.