Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme 3HTND-2DM has superior dimensional stability and a tensile strength of 6,000-7,500 psi at room temperature. It also maintains its Shore D hardness of 85 after withstanding 1,000 hours at 85°C/85% RH.
| Master Bond, Inc. | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | Supreme 3HTND-2DM |
| Product Name | One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation |
| Cure / Technology | Thermoset; Single Component |
| Type / Form | Grease, Paste |
| Substrate Compatibility | Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates |
| Chemical System | Epoxy |
| Composition | Unfilled |
