Master Bond, Inc. One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation Supreme 3HTND-2DM

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One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation - Supreme 3HTND-2DM - Master Bond, Inc.
Hackensack, NJ, USA
One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation
Supreme 3HTND-2DM
One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation Supreme 3HTND-2DM
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme 3HTND-2DM has superior dimensional stability and a tensile strength of 6,000-7,500 psi at room temperature. It also maintains its Shore D hardness of 85 after withstanding 1,000 hours at 85°C/85% RH.

Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme 3HTND-2DM has superior dimensional stability and a tensile strength of 6,000-7,500 psi at room temperature. It also maintains its Shore D hardness of 85 after withstanding 1,000 hours at 85°C/85% RH.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number Supreme 3HTND-2DM
Product Name One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
Composition Unfilled
Use Temperature -100 to 400 F (-73 to 204 C)
Dielectric Strength 45 to ? kV/in (17.72 to ? kV/cm)
Chemical System Epoxy
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