Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)]. As a polysulfide based system, it has very good chemical resistance, particularly to fuels, oils, hydraulic fluids and related compounds. With an elongation of 150-200%, EP21TPFL-1AO offers a high degree of flexibility and it can withstand intense thermal cycling and mechanical shock. Its low viscosity makes it well suited for potting/encapsulatio
| Master Bond, Inc. | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | EP21TPFL-1AO |
| Product Name | Thermally Conductive Epoxy Polysulfide Adhesive |
| Cure / Technology | Thermoset; Two Component ; Room Temperature Vulcanizing or Curing |
| Type / Form | Liquid |
| Substrate Compatibility | Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates |
| Chemical System | Polyphenylene Sulfide; Epoxy |
| Composition | Unfilled |
