Master Bond, Inc. Thermally Conductive, Flowable Epoxy Meets NASA Low Outgassing EP53TC

Description
Master Bond EP53TC is a thermally conductive, electrically insulating two part epoxy that combines good physical properties and the ability to transfer heat rapidly and effectively.
Request a Quote
Description
Master Bond EP53TC is a thermally conductive, electrically insulating two part epoxy that combines good physical properties and the ability to transfer heat rapidly and effectively.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Thermally Conductive, Flowable Epoxy Meets NASA Low Outgassing - EP53TC - Master Bond, Inc.
Hackensack, NJ, USA
Thermally Conductive, Flowable Epoxy Meets NASA Low Outgassing
EP53TC
Thermally Conductive, Flowable Epoxy Meets NASA Low Outgassing EP53TC
Master Bond EP53TC is a thermally conductive, electrically insulating two part epoxy that combines good physical properties and the ability to transfer heat rapidly and effectively.

Master Bond EP53TC is a thermally conductive, electrically insulating two part epoxy that combines good physical properties and the ability to transfer heat rapidly and effectively.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP53TC
Product Name Thermally Conductive, Flowable Epoxy Meets NASA Low Outgassing
Cure / Technology Thermoset; Two Component  
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Epoxy
Composition Filled
Features High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Thermally Conductive
Unlock Full Specs
to access all available technical data

Similar Products

One Component, Biocompatible UV Curable Adhesive - UV10Med - Master Bond, Inc.
Specs
Cure / Technology Thermoset; UV or Radiation Cured; Single Component
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
Toughened One Part Epoxy for Chip Coating Applications - Supreme 3HTND-2CCM - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Single Component
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
View Details
Two Component, Room Temperature Curing Epoxy Resin - EP39MHT - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
USP Class VI Certified, Two Component Epoxy - EP30Med - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details