Advantech Datasheets for DRAM Modules
DRAM memory modules are collections of DRAM cells assembled on a circuit board.
DRAM Modules: Learn more
Product Name | Notes |
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16G DDR4 2400 288Pin 2GX4 Registered VLP 1.2V -40~85℃ Samsung Chip DDR4-2400 Registered DIMM Very Low Profile Wide temperature 30μ" gold plating thickness 1.2V Power Consumption Provides better reliability, availability... | |
4G DDR4 2400 288Pin 512MBX8 Registered VLP 1.2V -40~85℃ Samsung Chip DDR4-2400 Registered DIMM Very Low Profile Wide temperature 30μ" gold plating thickness 1.2V Power Consumption Provides better reliability, availability... | |
8G DDR3-1600 240Pin 512MX8 1.5V VLP ECC Micron Chip DDR3-1600 ECC VLP DIMM 240-Pin 512MX8 Micron Chip | |
8G DDR3-1600 240Pin 512MX8 1.5V VLP Unbuffered Micron Chip DDR3-1600 Unbuffered VLP DIMM 240-Pin 512MX8 Micron Chip | |
8G DDR4 2400 288Pin 1GX8 Registered VLP 1.2V -40~85℃ Samsung Chip DDR4-2400 Registered DIMM Very Low Profile Wide temperature 30μ" gold plating thickness 1.2V Power Consumption Provides better reliability, availability... | |
8G SO-DDR3-1600 204Pin 512MX8 1.5V Unbuffered Micron Chip DDR3-1600 Unbuffered SO-DIMM 204-Pin 512MX8 Micron Chip | |
Advantech 16G DDR4-2400 260Pin 1GX8 1.2V ECC Hynix Chip DDR4 2400 ECC SO DIMM 30μ" gold plating thickness (IPC-2221 Standard) 1.2V Power Consumption Serial presence detect with EEPROM Support ECC... | |
Advantech 16G DDR4-2400 288Pin 1GX8 1.2V ECC Hynix Chip DDR4-2400 ECC DIMM 30μ" gold plating thickness (IPC-2221 standard) 1.2V power consumption Serial presence detect with EEPROM Support ECC error detection... | |
Advantech 16G DDR4-2400 288Pin 1GX8 1.2V Registered Hynix Chip DDR4-2400 Registered DIMM 30μ" gold plating thickness (IPC-2221 standard) 1.2V power consumption Serial presence detect with EEPROM Support ECC error detection... | |
Advantech 1G SO-DDR2-800 200Pin 128MX8 1.8V Unbuffered Samsung Chip DDR2-800 SO-DIMM 200-Pin 128MX8 Samsung Chip | |
Advantech 4G DDR4-2400 288Pin 512MX8 1.2V ECC Hynix Chip DDR4-2400 ECC DIMM 30μ" gold plating thickness (IPC-2221 standard) 1.2V power consumption Serial presence detect with EEPROM Support ECC error detection... | |
Advantech 4G DDR4-2400 288Pin 512X8 1.2V Registered Hynix Chip DDR4-2400 Registered DIMM 30μ" gold plating thickness (IPC-2221 standard) 1.2V power consumption Serial presence detect with EEPROM Support ECC error detection... | |
Advantech 4G SO-DDR4-2400 260Pin 512MX8 1.2V ECC Hynix Chip DDR4 2400 ECC SO DIMM 30μ" gold plating thickness (IPC-2221 Standard) 1.2V Power Consumption Serial presence detect with EEPROM Support ECC... | |
Advantech 8G DDR4-2400 288Pin 1GX8 1.2V ECC Hynix Chip DDR4-2400 ECC DIMM 30μ" gold plating thickness (IPC-2221 standard) 1.2V power consumption Serial presence detect with EEPROM Support ECC error detection... | |
Advantech 8G DDR4-2400 288Pin 1GX8 1.2V Registered Hynix Chip DDR4-2400 Registered DIMM 30μ" gold plating thickness (IPC-2221 standard) 1.2V power consumption Serial presence detect with EEPROM Support ECC error detection... | |
Advantech 8G SO-DDR4-2400 260Pin 1GX8 1.2V ECC Hynix Chip DDR4 2400 ECC SO DIMM 30μ" gold plating thickness (IPC-2221 Standard) 1.2V Power Consumption Serial presence detect with EEPROM Support ECC... | |
Industrial Grade DRAM memory which is designed with original IC chip and provide ECC(Error-Correcting Code) function for IOT applications Original memory chips (Samsun/Hynix) ECC function support Fixed BOM Wide Temperature... | |
SQRAM deliver reliable quality and high compatibility DRAM memory products by strict burn-in test program for industrial market Samsung Original memory IC FIXED BOM 3yrs longevity & lifetime warranty Undergo... | |
SQRAM is Industrial Grade DRAM memory which is designed with original IC chip and adopt a rigorous test program to ensure durable and reliable quality. SQRAM are fixed DIE for... | |
SQRAM is Industrial Grade DRAM memory. all of SQRAM are designed with original IC chip and adopt a rigorous test program to ensure durable and reliable quality. SQRAM are fixed... | |
SQRAM is Industrial Grade DRAM memory. All SQRAM are designed with original IC chip and adopt a rigorous test program to ensure durable and reliable quality. Extended temperature -20~85C support. | |
SQRAM is Industrial Grade DRAM memory. All SQRAM are designed with original IC chip and adopt a rigorous test program to ensure durable and reliable quality. SQR Mi-grade is developing... | |
SQRAM is Industrial Grade DRAM memory. All SQRAM are designed with original IC chip and adopt a rigorous test program to ensure durable and reliable quality. SQRAM are fixed IC... | |
SQRAM is Industrial Grade DRAM memory. All SQRAM are designed with original IC chip and adopt a rigorous test program to ensure durable and reliable quality. Wide temperature -40~85C support. | |
16GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance ECC | |
16GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Rigister | |
16GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered | |
32GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance ECC | |
32GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Rigister | |
32GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered | |
4GB DDR 4 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered | |
4GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered | |
8GB DDR 4 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered | |
8GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance ECC | |
8GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Rigister | |
8GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered | |
DDR1-400 SO-DIMM 200-Pin 64MX64 Micron Chip | |
DDR1-400 SO-DIMM 200-Pin 64MX8 Micron Chip | |
DDR1-400 SO-DIMM 200-Pin 64MX8 Promos Chip | |
DDR1-400 200-Pin 64MBX8 Promos Chip | |
DDR2-667 SO-DIMM 200-Pin 64MX8 Samsung Chip | |
DDR2-667 Unbuffered DIMM 240-Pin 128MX8 Samsung Chip | |
DDR2-667 Unbuffered VLP 240-Pin 64MX8 Samsung Chip | |
DDR2-800 SO-DIMM 200-Pin 128MX8 Samsung Chip | |
DDR2-800 Unbuffered DIMM 240-Pin 128MX8 Samsung Chip | |
DDR2-800 Unbuffered SO-DIMM 200-Pin 128MX8 Samsung Chip | |
DDR2-800 Unbuffered VLP 240-Pin 128MX8 Samsung Chip | |
DDR3 1600Mhz Unbuffered DIMM 30μ" gold plating thickness 1.35V power consumption Samsung original chip | |
DDR3 1600Mhz Unbuffered SO-DIMM 30μ" gold plating thickness 1.35V power consumption Samsung original chip | |
DDR3-1333 SO-DIMM 204-Pin 128MX8 Samsung Chip | |
DDR3-1600 ECC Registered VLP 240-Pin 512MX8 Samsung Chip | |
DDR3-1600 ECC Registered 240-Pin 512MX8 Samsung Chip | |
DDR3-1600 ECC SO-DIMM 204-Pin 512MX8 Samsung Chip | |
DDR3-1600 ECC 240-Pin 256MX8 Samsung Chip | |
DDR3-1600 ECC 240-Pin 512MX8 Samsung Chip | |
DDR3-1600 SO-DIMM 204-Pin 256MX8 Samsung Chip | |
DDR3-1600 SO-DIMM 204-Pin 512MX8 Hynix Chip | |
DDR3-1600 SO-DIMM 204-Pin 512MX8 Micron Chip | |
DDR3-1600 Unbuffered SO-DIMM Supports wide temperature -40 ~ 85°C Anti-sulfur resistor 30μ" gold plating thickness 1.35V power consumption 100% tested for stability, compatibility and performance Micron original chip | |
DDR3-1600 240-Pin 256MX8 Samsung | |
DDR3-1600 240-Pin 512MX8 Hynix Chip | |
DDR3-1600 240-Pin 512MX8 Micron Chip | |
DDR3-1866 Unbuffered DIMM 30μ" gold plating thickness 1.35V power consumption Micron original chip | |
DDR4 2400 ECC DIMM • 30μ" gold plating thickness (IPC-2221 standard) • 1.2V power consumption • Serial presence detect with EEPROM • Support ECC error detection and correction • 100%... | |
DDR4 2400 ECC DIMM 30μ" gold plating thickness (IPC-2221 standard) 1.2V power consumption Serial presence detect with EEPROM Support ECC error detection and correction 100% tested for stability, compatibility and... | |
DDR4 2400 ECC SO-DIMM 30μ" gold plating thickness (IPC-2221 standard) 1.2V power consumption Serial presence detect with EEPROM Support ECC error detection and correction 100% tested for stability, compatibility and... | |
DDR4 2400Mhz Unbuffered SO-DIMM Supports wide temperature -40 ~ 85°C Anti-sulfur resistor 30μ" gold plating thickness 1.2V power consumption 100% tested for stability, compatibility and performance Hynix original chip | |
DDR4 2400Mhz Unbuffered SO-DIMM Supports wide temperature -40 ~ 85°C Anti-sulfur resistor 30μ" gold plating thickness 1.2V power consumption 100% tested for stability, compatibility and performance Samsung original chip | |
DDR4 2666 Registered DIMM. – Standard height 30u Golden Coating Thickness (IPC-2221 Standard) 1.2V Power Consumption Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves... | |
DDR4 2666Mhz Registered DIMM – Standard height 30μ" gold plating thickness Anti-sulfur resistor 1.2V power consumption 100% tested for stability, compatibility and performance Samsung original chip | |
DDR4 2666Mhz Registered DIMM. – Standard height Supports ECC error detection and correction 1.2V Power Consumption Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves... | |
DDR4 2666Mhz SO-DIMM / UDIMM with ECC 30μ" gold plating thickness Anti-sulfuration resistor Serial presence detect with EEPROM Support ECC error detection and correction 100% tested for stability, compatibility and... | |
DDR4 2666Mhz Unbuffered SO-DIMM 30μ" gold plating thickness 1.2V power consumption 100% tested for stability, compatibility and performance Samsung original chip | |
DDR4 2666Mhz Unbuffered UDIMM 30μ" gold plating thickness 1.2V power consumption 100% tested for stability, compatibility and performance Samsung original chip | |
DDR4 2933Mhz Registered DIMM Supports ECC error detection and correction 1.2V Power Consumption Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity | |
DDR4 3200Mhz Unbuffered DIMM 1.2V Power Consumption Low-power auto self- refresh (LPASR) Data bus inversion (DBI) for data bus Nominal and dynamic on-die termination (ODT) for data, strobe, and mask... | |
DDR4 3200Mhz Unbuffered DIMM SODIMM 260pin / UDIMM 288pin 1.2V Power Consumption Low-power auto self- refresh (LPASR) Data bus inversion (DBI) for data bus Nominal and dynamic on-die termination (ODT)... | |
DDR4-2400 Registered DIMM – standard height 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data... | |
DDR4-2400 Registered DIMM. – Standard height & Very Low Profile 30μ" gold plating thickness (IPC-2221 Standard) 1.2V Power Consumption Provides better reliability, availability and serviceability (RAS) and improves data integrity... | |
DDR4-2400 Registered DIMM. – standard height 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data... | |
DDR4-2400 Unbuffered DIMM 30μ" gold plating thickness (IPC-2221 Standard) 1.2V Power Consumption RoHS compliant Hynix Original Chip | |
DDR4-2400 Unbuffered DIMM 30μ" gold plating thickness 1.2V power consumption Samsung original chip | |
DDR4-2400 Unbuffered SO-DIMM 30μ" gold plating thickness (IPC-2221 Standard) 1.2V Power Consumption RoHS compliant Hynix Original Chip | |
DDR4-2400 Unbuffered SO-DIMM 30μ" gold plating thickness 1.2V power consumption Samsung original chip | |
Increased Bandwidth, up to 2600 Mbps Industrial Stand 30u Gold Plating Enhanced Power Efficiency RoHS compliant & Complies with JEDEC standards Up to 32GB | |
Micron DRAM Chip DDR4 Spec Registered DIMM Gold edge contacts 64GB | |
Nanya DRAM Chip DDR2 Long DIMM Unbuffered 1GB | |
Nanya DRAM Chip DDR2 Long DIMM Unbuffered 2GB | |
Nanya DRAM Chip DDR3 So-DIMM Unbuffered 1GB | |
Nanya DRAM Chip DDR4 So-DIMM Unbuffered 2GB | |
Samsung DRAM Chip DDR3 Spec Unbuffered DIMM 30μ" gold plating thickness 2GB | |
Samsung DRAM Chip DDR4 Spec Unbuffered DIMM 30μ" gold plating thickness 4GB |