Advantech Datasheets for DRAM Modules
DRAM memory modules are collections of DRAM cells assembled on a circuit board.
DRAM Modules: Learn more
| Product Name | Notes |
|---|---|
| 16G DDR4-3200 1GX8 1.2V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration SEMI Wide-temp Support -20~85℃ | |
| 16G DDR5-5600 2GX8 1.1V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration Semi Wide-temp Support -20~85℃ | |
| 16G SO-DDR4-3200 1GX8 1.2V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration Semi Wide-temp Support -20~85℃ | |
| 16G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration Semi Wide-temp Support -20~85℃ | |
| 16GB DDR5-5600 2GX8 1.1V SAM SAM Original Chip PCB: 30μ gold finger Anti-sulfuration On-die ECC for Enhanced RAS Operating Temperature: 0°C ~ 85°C | |
| 16GB ECC DDR5-5600 2GX8 1.1V SAM SAM Original Chip Anti-sulfuration PCB: 30μ gold finger Independent Power Management IC build-in ECC function support | |
| 16GB ECC SO-DDR5-5600 2GX8 1.1V SAM SAM Original Chip Anti-sulfuration PCB: 30μ gold finger Independent Power Management IC build-in ECC function support | |
| 16GB R-DDR5 5600 R-Dimm 2GX8 1.1V SAM SAM Original Chip Industrial Design for Improved Reliability Compatible with server platform 30u” golden finger Operating Temperature: 0°C ~ 85°C | |
| 16GB SO-DDR5-5600 2GX8 1.1V SAM SAM Original Chip PCB: 30μ gold finger Anti-sulfuration On-die ECC for Enhanced RAS Operating Temperature: 0°C ~ 85°C | |
| 1G SO-DDR1-400 200Pin 64MX8 2.5V Unbuffered Promos Chip DDR1-400 200-Pin 64MBX8 Promos Chip | |
| 32G DDR4-3200 2GX8 1.2V SAM-20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration SEMI Wide-temp Support -20~85℃ | |
| 32G DDR5-5600 2GX8 1.1V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration Semi Wide-temp Support -20~85℃ | |
| 32G SO-DDR4-3200 2GX8 1.2V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration Semi Wide-temp Support -20~85℃ | |
| 32G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration Semi Wide-temp Support -20~85℃ | |
| 32GB DDR5-5600 2GX8 1.1V SAM SAM Original Chip PCB: 30μ gold finger Anti-sulfuration On-die ECC for Enhanced RAS Operating Temperature: 0°C ~ 85°C | |
| 32GB ECC DDR5-5600 2GX8 1.1V SAM SAM Original Chip Anti-sulfuration PCB: 30μ gold finger Independent Power Management IC build-in ECC function support | |
| 32GB ECC SO-DDR5-5600 2GX8 1.1V SAM SAM Original Chip Anti-sulfuration PCB: 30μ gold finger Independent Power Management IC build-in ECC function support | |
| 32GB R-DDR5 5600 R-Dimm 2GX8 1.1V SAM SAM Original Chip Industrial Design for Improved Reliability Compatible with server platform 30u” golden finger Operating Temperature: 0°C ~ 85°C | |
| 32GB SO-DDR5-5600 2GX8 1.1V SAM SAM Original Chip PCB: 30μ gold finger Anti-sulfuration On-die ECC for Enhanced RAS Operating Temperature: 0°C ~ 85°C | |
| 4G DDR3-1600 512X8 1.35V&1.5V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration Semi Wide-temp Support -20~85℃ | |
| 4G DDR4-3200 512X16 1.2V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration Semi Wide-temp Support -20~85℃ | |
| 4G DDR4-3200 512X16 1.2V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration SEMI Wide-temp Support -20~85C | |
| 4G SO-DDR3-1600 512X8 1.35V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration Semi Wide-temp Support -20~85℃ | |
| 4G SO-DDR3-1600 512X8 1.35V SAM -40~85C 30u" Gold Plating Thickness Anti-sulfurization resistance Samsung original chip Wide Temp. -40C to +85C 100% tested for stability, compatibility and performance | |
| 8G DDR3-1600 512X8 1.35V&1.5V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration Semi Wide-temp Support -20~85℃ | |
| 8G DDR4-3200 1GX8 1.2V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration SEMI Wide-temp Support -20~85℃ | |
| 8G DDR5-5600 1GX16 1.1V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration Semi Wide-temp Support -20~85℃ | |
| 8G SO-DDR3-1600 512X8 1.35V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration Semi Wide-temp Support -20~85℃ | |
| 8G SO-DDR3-1600 512X8 1.35V SAM -40~85C 30u" Gold Plating Thickness Anti-sulfurization resistance Samsung original chip Wide Temp. -40C to +85C 100% tested for stability, compatibility and performance | |
| 8G SO-DDR4-3200 1GX8 1.2V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration Semi Wide-temp Support -20~85℃ | |
| 8G SO-DDR5-5600 1GX16 1.1V SAM -20~85℃ SAM Original Chip Industrial Design for Improved Reliability PCB: 30μ gold finger Anti-sulfuration Semi Wide-temp Support -20~85℃ | |
| 8GB DDR5-5600 1GX16 1.1V SAM SAM Original Chip PCB: 30μ gold finger Anti-sulfuration On-die ECC for Enhanced RAS Operating Temperature: 0°C ~ 85°C | |
| 8GB SO-DDR5-5600 1GX16 1.1V SAM SAM Original Chip PCB: 30μ gold finger Anti-sulfuration On-die ECC for Enhanced RAS Operating Temperature: 0°C ~ 85°C | |
| Advantech 16G DDR4-3200 1GbX8 1.2V SAM -40~85C DDR4 3200Mhz Unbuffered DIMM 30u" Gold Plating Thickness Anti-sulfurization resistance 1.2V power consumption Samsung original chip 100% tested for stability, compatibility and performance... | |
| Advantech 16G DDR4-3200 1GbX8 1.2V SAM -40~85C DDR4 3200Mhz Unbuffered DIMM 30u" Gold Plating Thickness Anti-sulfurization resistance 1.2V power consumption Samsung original chip wide temperatures from -40° to 85°C | |
| Advantech 16G DDR5-4800 288Pin 2GX8 1.1V Registered Samsung Chip Samsung Original Chip Dual 32-bit Subchannels Increased Banks and Burst Length DDR5 4.8GT/s Same-Bank Refresh On-die ECC for Enhanced RAS | |
| Advantech 16G DDR5-4800 288Pin 2GX8 1.1V Unbuffered Samsung Chip Samsung Original Chip Increased Banks and Burst Length DDR5 4.8GT/s Same-Bank Refresh On-die ECC for Enhanced RAS | |
| Advantech 16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C Registered DIMM 30u" Gold Plating Thickness Anti-sulfurization resistance 1.2V power consumption Samsung original chip wide temperatures from -40° to 85°C | |
| Advantech 16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C DDR4 3200Mhz Unbuffered SO-DIMM 30u" Gold Plating Thickness Anti-sulfurization resistance 1.2V power consumption Samsung original chip 100% tested for stability, compatibility and performance... | |
| Advantech 16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C DDR4 3200Mhz Unbuffered SO-DIMM 30u" Gold Plating Thickness Anti-sulfurization resistance 1.2V power consumption Samsung original chip wide temperatures from -40° to 85°C | |
| Advantech 16GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip 16GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance ECC | |
| Advantech 16GB DDR4-3200 1GbX8 1.2V Samsung Chip 16GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered | |
| Advantech 16GB DDR5-5600 288Pin 2GX8 1.1V Unbuffered Hynix Chip Hynix Original Chip Increased Banks and Burst Length DDR5 5.6GT/s Same-Bank Refresh On-die ECC for Enhanced RAS | |
| Advantech 16GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip 16GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance ECC | |
| Advantech 16GB SO-DDR4-3200 1GbX8 1.2V Samsung Chip 16GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered | |
| Advantech 16GB SO-DIMM DDR5-4800 262Pin 2GX8 1.1V Unbuffered Samsung Chip Samsung Original Chip Dual 32-bit Subchannels Increased Banks and Burst Length DDR5 4.8GT/s Same-Bank Refresh On-die ECC for Enhanced RAS... | |
| Advantech 16GB SO-DIMM DDR5-5600 262Pin 2GX8 1.1V Unbuffered Hynix Chip Hynix Original Chip Increased Banks and Burst Length DDR5 5.6GT/s Same-Bank Refresh On-die ECC for Enhanced RAS | |
| Advantech 32G DDR4-3200 2GbX8 1.2V SAM -40~85C DDR4 3200Mhz Unbuffered DIMM 30u" Gold Plating Thickness Anti-sulfurization resistance 1.2V power consumption Samsung original chip 100% tested for stability, compatibility and performance... | |
| Advantech 32G DDR4-3200 2GbX8 1.2V SAM -40~85C DDR4 3200Mhz Unbuffered DIMM 30u" Gold Plating Thickness Anti-sulfurization resistance 1.2V power consumption Samsung original chip wide temperatures from -40° to 85°C | |
| Advantech 32G DDR5-4800 288Pin 2GX8 1.1V Registered Samsung Chip Samsung Original Chip Increased Banks and Burst Length DDR5 4.8GT/s Same-Bank Refresh On-die ECC for Enhanced RAS | |
| Advantech 32G DDR5-4800 288Pin 2GX8 1.1V Unbuffered Samsung Chip Samsung Original Chip Increased Banks and Burst Length DDR5 4.8GT/s Same-Bank Refresh On-die ECC for Enhanced RAS | |
| Advantech 32G R-DDR4-3200 2GX8 1.2V Samsung Chip -40~85C Registered DIMM 30u" Gold Plating Thickness Anti-sulfurization resistance 1.2V power consumption Samsung original chip wide temperatures from -40° to 85°C | |
| Advantech 32G SO-DDR4-3200 2GbX8 1.2V SAM -40~85C DDR4 3200Mhz Unbuffered SO-DIMM 30μ" gold plating thickness Anti-sulfuration resistor 1.2V power consumption Samsung original chip wide temperatures from -40° to 85°C | |
| Advantech 32G SO-DDR4-3200 2GbX8 1.2V SAM -40~85C DDR4 3200Mhz Unbuffered SO-DIMM 30u" Gold Plating Thickness Anti-sulfurization resistance 1.2V power consumption Samsung original chip 100% tested for stability, compatibility and performance... | |
| Advantech 32GB DDR4-3200 2GbX8 1.2V ECC Samsung Chip 32GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance ECC | |
| Advantech 32GB DDR4-3200 2GbX8 1.2V Samsung Chip 32GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered | |
| Advantech 32GB DDR5-5600 288Pin 2GX8 1.1V Unbuffered Hynix Chip Hynix Original Chip Increased Banks and Burst Length DDR5 5.6GT/s Same-Bank Refresh On-die ECC for Enhanced RAS | |
| Advantech 32GB SO-DDR4-3200 2GbX8 1.2V ECC Samsung Chip 32GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance ECC | |
| Advantech 32GB SO-DDR4-3200 2GbX8 1.2V Samsung Chip 32GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered | |
| Advantech 32GB SO-DIMM DDR5-4800 262Pin 2GX8 1.1V Unbuffered Samsung Chip Samsung Original Chip Dual 32-bit Subchannels Increased Banks and Burst Length DDR5 4.8GT/s Same-Bank Refresh On-die ECC for Enhanced RAS... | |
| Advantech 32GB SO-DIMM DDR5-5600 262Pin 2GX8 1.1V Unbuffered Hynix Chip Hynix Original Chip Increased Banks and Burst Length DDR5 5.6GT/s Same-Bank Refresh On-die ECC for Enhanced RAS | |
| Advantech 4G DDR3-1600 240Pin 512MX8 1.35V ECC Samsung Chip DDR3-1600 ECC 240-Pin 512MX8 Samsung Chip | |
| Advantech 4G DDR3-1600 240Pin 512MX8 1.35V Unbuffered Samsung Chip DDR3 1600Mhz Unbuffered DIMM 30μ" gold plating thickness 1.35V power consumption Samsung original chip | |
| Advantech 4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip DDR4-2400 Registered DIMM. – standard height 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption Low-power auto self- refresh (LPASR)... | |
| Advantech 4G SO-DDR3-1600 204Pin 512MX8 1.35V ECC Samsung Chip DDR3-1600 ECC SO-DIMM 204-Pin 512MX8 Samsung Chip | |
| Advantech 4G SO-DDR3-1600 204Pin 512MX8 1.35V Unbuffered Samsung Chip DDR3 1600Mhz Unbuffered SO-DIMM 30μ" gold plating thickness 1.35V power consumption Samsung original chip | |
| Advantech 4G SO-DDR4-3200 512Mx16 1.2V SAM -40~85C DDR4 3200Mhz Unbuffered SO-DIMM 30u" Gold Plating Thickness Anti-sulfurization resistance 1.2V power consumption Samsung original chip wide temperatures from -40° to 85°C | |
| Advantech 8G DDR3-1600 240Pin 512MX8 1.35V ECC Samsung Chip DDR3-1600 ECC 240-Pin 512MX8 Samsung Chip | |
| Advantech 8G DDR3-1600 240Pin 512MX8 1.35V Unbuffered Samsung Chip DDR3 1600Mhz Unbuffered DIMM 30μ" gold plating thickness 1.35V power consumption Samsung original chip | |
| Advantech 8G DDR4-3200 1GbX8 1.2V SAM -40~85C DDR4 3200Mhz Unbuffered DIMM 30u" Gold Plating Thickness Anti-sulfurization resistance 1.2V power consumption Samsung original chip 100% tested for stability, compatibility and performance... | |
| Advantech 8G DDR4-3200 1GbX8 1.2V SAM -40~85C DDR4 3200Mhz Unbuffered DIMM 30u" Gold Plating Thickness Anti-sulfurization resistance 1.2V power consumption Samsung original chip wide temperatures from -40° to 85°C | |
| Advantech 8G DDR5-4800 288Pin 1GX16 1.1V Unbuffered Samsung Chip Samsung Original Chip Increased Banks and Burst Length DDR5 4.8GT/s Same-Bank Refresh On-die ECC for Enhanced RAS | |
| Advantech 8G SO-DDR3-1600 204Pin 512MX8 1.35V ECC Samsung Chip DDR3-1600 ECC SO-DIMM 204-Pin 512MX8 Samsung Chip | |
| Advantech 8G SO-DDR3-1600 204Pin 512MX8 1.35V Unbuffered Samsung Chip DDR3 1600Mhz Unbuffered SO-DIMM 30μ" gold plating thickness 1.35V power consumption Samsung original chip | |
| Advantech 8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C DDR4 3200Mhz Unbuffered SO-DIMM 30u" Gold Plating Thickness Anti-sulfurization resistance 1.2V power consumption Samsung original chip 100% tested for stability, compatibility and performance... | |
| Advantech 8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C DDR4 3200Mhz Unbuffered SO-DIMM 30u" Gold Plating Thickness Anti-sulfurization resistance 1.2V power consumption Samsung original chip wide temperatures from -40° to 85°C | |
| Advantech 8GB DDR4 SODIMM-3200 1GbX8 SAM DDR4 3200Mhz Unbuffered SO-DIMM 30u" Gold Plating Thickness Anti-sulfurization resistance 1.2V power consumption Samsung original chip 100% tested for stability, compatibility and performance | |
| Advantech 8GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip 8GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance ECC | |
| Advantech 8GB DDR4-3200 1GbX8 1.2V Samsung Chip 8GB DDR 4 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered | |
| Advantech 8GB DDR5-5600 288Pin 1GX16 1.1V Unbuffered Hynix Chip Hynix Original Chip Increased Banks and Burst Length DDR5 5.6GT/s Same-Bank Refresh On-die ECC for Enhanced RAS | |
| Advantech 8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip 8GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance ECC | |
| Advantech 8GB SO-DIMM DDR5-4800 262Pin 1GX16 1.1V Unbuffered Samsung Chip Samsung Original Chip Dual 32-bit Subchannels Increased Banks and Burst Length DDR5 4.8GT/s Same-Bank Refresh On-die ECC for Enhanced RAS... | |
| Advantech 8GB SO-DIMM DDR5-5600 262Pin 1GX16 1.1V Unbuffered Hynix Chip Hynix Original Chip Increased Banks and Burst Length DDR5 5.6GT/s Same-Bank Refresh On-die ECC for Enhanced RAS | |
| ECC SODIMM DDR4 2133/2400/2666 260pin SODIMM ECC DIMM Data transfer rate: 2133/2400/2666 MT/sCapacity: 2GB~16GB Original IC chip (Samsung/Hynix) ECC function support Wide temperature range support -40oC~85oC | |
| Micron 8G DDR4 3200 288PIN 1GbX8 REG 1.2V DDR4-3200 Registered ECC DIMM 1.2V power consumption Supports ECC error detection and correction Data bus inversion (DBI) for data bus Low-power auto... | |
| Rugged SODIMM DDR4 2666/3200 Wide Temperature Robust PCB designed with Mounting Hole with Military MIL-810G verified Extreme Data Transfer rate up to 3200 MT/s Capacity: up to 32GB Wide Temperature... | |
| SODIMM DDR4 3200MT/s Original Hynix IC chips adopted Data transfer rate: 3200MT/s Capacity: 4/8/16/32GB Operating temperature: 0 °C ~ 85 °C Lifetime warranty | |
| SODIMM DDR4 Original IC chips adopted Data transfer rate: 3200MT/s Capacity: 4/8/16/32GB Operating temperature: 0 °C ~ 85 °C 3years longevity, Fixed BOM, Lifetime warranty | |
| SQRAM is Industrial Grade DRAM memory. all of SQRAM are designed with original IC chip and adopt a rigorous test program to ensure durable and r 288-pin Dual In-Line Memory... | |
| UDIMM DDR4 2400/2666/3200 288-pin Dual In-Line Memory Module Data Transfer Rate: 2400/2666/3200 MT/s Capacity: 2GB/4GB/8GB/16GB Operating Temperature: 0°C ~ 85°C Fixed BOM / Lifetime warranty | |
| Original Samsung/Micron IC chips adapted Data transfer rate: 1600MHz Operating Temperature: 0 °C ~ 85 °C 30u” golden finger and Fixed BOM Free Intelligent software monitor DRAM real time information... |