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Advantech Datasheets for DRAM Modules

DRAM memory modules are collections of DRAM cells assembled on a circuit board.
DRAM Modules: Learn more

Product Name Notes
16G DDR4 2400 288Pin 2GX4 Registered VLP 1.2V -40~85℃ Samsung Chip DDR4-2400 Registered DIMM Very Low Profile Wide temperature 30μ" gold plating thickness 1.2V Power Consumption Provides better reliability, availability...
4G DDR4 2400 288Pin 512MBX8 Registered VLP 1.2V -40~85℃ Samsung Chip DDR4-2400 Registered DIMM Very Low Profile Wide temperature 30μ" gold plating thickness 1.2V Power Consumption Provides better reliability, availability...
8G DDR3-1600 240Pin 512MX8 1.5V VLP ECC Micron Chip DDR3-1600 ECC VLP DIMM 240-Pin 512MX8 Micron Chip
8G DDR3-1600 240Pin 512MX8 1.5V VLP Unbuffered Micron Chip DDR3-1600 Unbuffered VLP DIMM 240-Pin 512MX8 Micron Chip
8G DDR4 2400 288Pin 1GX8 Registered VLP 1.2V -40~85℃ Samsung Chip DDR4-2400 Registered DIMM Very Low Profile Wide temperature 30μ" gold plating thickness 1.2V Power Consumption Provides better reliability, availability...
8G SO-DDR3-1600 204Pin 512MX8 1.5V Unbuffered Micron Chip DDR3-1600 Unbuffered SO-DIMM 204-Pin 512MX8 Micron Chip
Advantech 16G DDR4-2400 260Pin 1GX8 1.2V ECC Hynix Chip DDR4 2400 ECC SO DIMM 30μ" gold plating thickness (IPC-2221 Standard) 1.2V Power Consumption Serial presence detect with EEPROM Support ECC...
Advantech 16G DDR4-2400 288Pin 1GX8 1.2V ECC Hynix Chip DDR4-2400 ECC DIMM 30μ" gold plating thickness (IPC-2221 standard) 1.2V power consumption Serial presence detect with EEPROM Support ECC error detection...
Advantech 16G DDR4-2400 288Pin 1GX8 1.2V Registered Hynix Chip DDR4-2400 Registered DIMM 30μ" gold plating thickness (IPC-2221 standard) 1.2V power consumption Serial presence detect with EEPROM Support ECC error detection...
Advantech 1G SO-DDR2-800 200Pin 128MX8 1.8V Unbuffered Samsung Chip DDR2-800 SO-DIMM 200-Pin 128MX8 Samsung Chip
Advantech 4G DDR4-2400 288Pin 512MX8 1.2V ECC Hynix Chip DDR4-2400 ECC DIMM 30μ" gold plating thickness (IPC-2221 standard) 1.2V power consumption Serial presence detect with EEPROM Support ECC error detection...
Advantech 4G DDR4-2400 288Pin 512X8 1.2V Registered Hynix Chip DDR4-2400 Registered DIMM 30μ" gold plating thickness (IPC-2221 standard) 1.2V power consumption Serial presence detect with EEPROM Support ECC error detection...
Advantech 4G SO-DDR4-2400 260Pin 512MX8 1.2V ECC Hynix Chip DDR4 2400 ECC SO DIMM 30μ" gold plating thickness (IPC-2221 Standard) 1.2V Power Consumption Serial presence detect with EEPROM Support ECC...
Advantech 8G DDR4-2400 288Pin 1GX8 1.2V ECC Hynix Chip DDR4-2400 ECC DIMM 30μ" gold plating thickness (IPC-2221 standard) 1.2V power consumption Serial presence detect with EEPROM Support ECC error detection...
Advantech 8G DDR4-2400 288Pin 1GX8 1.2V Registered Hynix Chip DDR4-2400 Registered DIMM 30μ" gold plating thickness (IPC-2221 standard) 1.2V power consumption Serial presence detect with EEPROM Support ECC error detection...
Advantech 8G SO-DDR4-2400 260Pin 1GX8 1.2V ECC Hynix Chip DDR4 2400 ECC SO DIMM 30μ" gold plating thickness (IPC-2221 Standard) 1.2V Power Consumption Serial presence detect with EEPROM Support ECC...
Industrial Grade DRAM memory which is designed with original IC chip and provide ECC(Error-Correcting Code) function for IOT applications Original memory chips (Samsun/Hynix) ECC function support Fixed BOM Wide Temperature...
SQRAM deliver reliable quality and high compatibility DRAM memory products by strict burn-in test program for industrial market Samsung Original memory IC FIXED BOM 3yrs longevity & lifetime warranty Undergo...
SQRAM is Industrial Grade DRAM memory which is designed with original IC chip and adopt a rigorous test program to ensure durable and reliable quality. SQRAM are fixed DIE for...
SQRAM is Industrial Grade DRAM memory. all of SQRAM are designed with original IC chip and adopt a rigorous test program to ensure durable and reliable quality. SQRAM are fixed...
SQRAM is Industrial Grade DRAM memory. All SQRAM are designed with original IC chip and adopt a rigorous test program to ensure durable and reliable quality. Extended temperature -20~85C support.
SQRAM is Industrial Grade DRAM memory. All SQRAM are designed with original IC chip and adopt a rigorous test program to ensure durable and reliable quality. SQR Mi-grade is developing...
SQRAM is Industrial Grade DRAM memory. All SQRAM are designed with original IC chip and adopt a rigorous test program to ensure durable and reliable quality. SQRAM are fixed IC...
SQRAM is Industrial Grade DRAM memory. All SQRAM are designed with original IC chip and adopt a rigorous test program to ensure durable and reliable quality. Wide temperature -40~85C support.
16GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance ECC
16GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Rigister
16GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered
32GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance ECC
32GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Rigister
32GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered
4GB DDR 4 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered
4GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered
8GB DDR 4 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered
8GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance ECC
8GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Rigister
8GB Speed 3200MHz 30u" Gold Plating Thickness Anti-sulfurization resistance Unbuffered
DDR1-400 SO-DIMM 200-Pin 64MX64 Micron Chip
DDR1-400 SO-DIMM 200-Pin 64MX8 Micron Chip
DDR1-400 SO-DIMM 200-Pin 64MX8 Promos Chip
DDR1-400 200-Pin 64MBX8 Promos Chip
DDR2-667 SO-DIMM 200-Pin 64MX8 Samsung Chip
DDR2-667 Unbuffered DIMM 240-Pin 128MX8 Samsung Chip
DDR2-667 Unbuffered VLP 240-Pin 64MX8 Samsung Chip
DDR2-800 SO-DIMM 200-Pin 128MX8 Samsung Chip
DDR2-800 Unbuffered DIMM 240-Pin 128MX8 Samsung Chip
DDR2-800 Unbuffered SO-DIMM 200-Pin 128MX8 Samsung Chip
DDR2-800 Unbuffered VLP 240-Pin 128MX8 Samsung Chip
DDR3 1600Mhz Unbuffered DIMM 30μ" gold plating thickness 1.35V power consumption Samsung original chip
DDR3 1600Mhz Unbuffered SO-DIMM 30μ" gold plating thickness 1.35V power consumption Samsung original chip
DDR3-1333 SO-DIMM 204-Pin 128MX8 Samsung Chip
DDR3-1600 ECC Registered VLP 240-Pin 512MX8 Samsung Chip
DDR3-1600 ECC Registered 240-Pin 512MX8 Samsung Chip
DDR3-1600 ECC SO-DIMM 204-Pin 512MX8 Samsung Chip
DDR3-1600 ECC 240-Pin 256MX8 Samsung Chip
DDR3-1600 ECC 240-Pin 512MX8 Samsung Chip
DDR3-1600 SO-DIMM 204-Pin 256MX8 Samsung Chip
DDR3-1600 SO-DIMM 204-Pin 512MX8 Hynix Chip
DDR3-1600 SO-DIMM 204-Pin 512MX8 Micron Chip
DDR3-1600 Unbuffered SO-DIMM Supports wide temperature -40 ~ 85°C Anti-sulfur resistor 30μ" gold plating thickness 1.35V power consumption 100% tested for stability, compatibility and performance Micron original chip
DDR3-1600 240-Pin 256MX8 Samsung
DDR3-1600 240-Pin 512MX8 Hynix Chip
DDR3-1600 240-Pin 512MX8 Micron Chip
DDR3-1866 Unbuffered DIMM 30μ" gold plating thickness 1.35V power consumption Micron original chip
DDR4 2400 ECC DIMM • 30μ" gold plating thickness (IPC-2221 standard) • 1.2V power consumption • Serial presence detect with EEPROM • Support ECC error detection and correction • 100%...
DDR4 2400 ECC DIMM 30μ" gold plating thickness (IPC-2221 standard) 1.2V power consumption Serial presence detect with EEPROM Support ECC error detection and correction 100% tested for stability, compatibility and...
DDR4 2400 ECC SO-DIMM 30μ" gold plating thickness (IPC-2221 standard) 1.2V power consumption Serial presence detect with EEPROM Support ECC error detection and correction 100% tested for stability, compatibility and...
DDR4 2400Mhz Unbuffered SO-DIMM Supports wide temperature -40 ~ 85°C Anti-sulfur resistor 30μ" gold plating thickness 1.2V power consumption 100% tested for stability, compatibility and performance Hynix original chip
DDR4 2400Mhz Unbuffered SO-DIMM Supports wide temperature -40 ~ 85°C Anti-sulfur resistor 30μ" gold plating thickness 1.2V power consumption 100% tested for stability, compatibility and performance Samsung original chip
DDR4 2666 Registered DIMM. – Standard height 30u Golden Coating Thickness (IPC-2221 Standard) 1.2V Power Consumption Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves...
DDR4 2666Mhz Registered DIMM – Standard height 30μ" gold plating thickness Anti-sulfur resistor 1.2V power consumption 100% tested for stability, compatibility and performance Samsung original chip
DDR4 2666Mhz Registered DIMM. – Standard height Supports ECC error detection and correction 1.2V Power Consumption Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves...
DDR4 2666Mhz SO-DIMM / UDIMM with ECC 30μ" gold plating thickness Anti-sulfuration resistor Serial presence detect with EEPROM Support ECC error detection and correction 100% tested for stability, compatibility and...
DDR4 2666Mhz Unbuffered SO-DIMM 30μ" gold plating thickness 1.2V power consumption 100% tested for stability, compatibility and performance Samsung original chip
DDR4 2666Mhz Unbuffered UDIMM 30μ" gold plating thickness 1.2V power consumption 100% tested for stability, compatibility and performance Samsung original chip
DDR4 2933Mhz Registered DIMM Supports ECC error detection and correction 1.2V Power Consumption Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity
DDR4 3200Mhz Unbuffered DIMM 1.2V Power Consumption Low-power auto self- refresh (LPASR) Data bus inversion (DBI) for data bus Nominal and dynamic on-die termination (ODT) for data, strobe, and mask...
DDR4 3200Mhz Unbuffered DIMM SODIMM 260pin / UDIMM 288pin 1.2V Power Consumption Low-power auto self- refresh (LPASR) Data bus inversion (DBI) for data bus Nominal and dynamic on-die termination (ODT)...
DDR4-2400 Registered DIMM – standard height 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data...
DDR4-2400 Registered DIMM. – Standard height & Very Low Profile 30μ" gold plating thickness (IPC-2221 Standard) 1.2V Power Consumption Provides better reliability, availability and serviceability (RAS) and improves data integrity...
DDR4-2400 Registered DIMM. – standard height 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data...
DDR4-2400 Unbuffered DIMM 30μ" gold plating thickness (IPC-2221 Standard) 1.2V Power Consumption RoHS compliant Hynix Original Chip
DDR4-2400 Unbuffered DIMM 30μ" gold plating thickness 1.2V power consumption Samsung original chip
DDR4-2400 Unbuffered SO-DIMM 30μ" gold plating thickness (IPC-2221 Standard) 1.2V Power Consumption RoHS compliant Hynix Original Chip
DDR4-2400 Unbuffered SO-DIMM 30μ" gold plating thickness 1.2V power consumption Samsung original chip
Increased Bandwidth, up to 2600 Mbps Industrial Stand 30u Gold Plating Enhanced Power Efficiency RoHS compliant & Complies with JEDEC standards Up to 32GB
Micron DRAM Chip DDR4 Spec Registered DIMM Gold edge contacts 64GB
Nanya DRAM Chip DDR2 Long DIMM Unbuffered 1GB
Nanya DRAM Chip DDR2 Long DIMM Unbuffered 2GB
Nanya DRAM Chip DDR3 So-DIMM Unbuffered 1GB
Nanya DRAM Chip DDR4 So-DIMM Unbuffered 2GB
Samsung DRAM Chip DDR3 Spec Unbuffered DIMM 30μ" gold plating thickness 2GB
Samsung DRAM Chip DDR4 Spec Unbuffered DIMM 30μ" gold plating thickness 4GB