Indium Corporation Datasheets for Filler Alloys and Consumables
Filler metal alloys and consumables used in welding, brazing or soldering include items in rod sheet, wire spool, coated stick, weld stud, powder, preform or paste forms.
Filler Alloys and Consumables: Learn more
| Product Name | Notes |
|---|---|
| Product Description: Indium-tin ribbon has fair wettability on non-metals; good low temperature malleability. Alloy: 52In 48Sn Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 118ºC Eutectic Solidus... | |
| Product Description: Indium-tin wire has fair wettability on non-metals; good low temperature malleability. Alloy: 52ln 48Sn Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 118ºC Eutectic Solidus Melting Temperature:... | |
| #1210 Battery Flux was specially formulated for high volume cast-on-strap manufacturing where rapid evaporation of solvent is necessary. This fl ux contains no chlorides, heavy metals or organic acids, which... | |
| 1075 VOC-FREE is a resin/rosin-free fl ux specifi cally developed for wave soldering, surface mount, mixedtechnology and through-hole electronic assemblies. 1075 VOC-FREE is a water-based, non-fl ammable formulation eliminating special... | |
| 1075-EX 30 is a resin/rosin-free flux specifically developed for wave soldering, surface-mount, mixed-technology and through-hole electronic assemblies. 1075-EX 30 is a water-based, non-flammable formulation, eliminating special storage requirements, and reducing... | |
| 1075-EX VOC-Free is a resin/rosin-free fl ux specifi cally developed for wave soldering surface-mount, mixedtechnology and through-hole electronic assemblies. 1075-EX VOC-Free is a water-based, non-fl ammable formulation, which eliminates special... | |
| 1075-EXR 30 VOC-Free is a non-halide, synthetic resin flux specifically developed for wave soldering of surface-mount, mixed-technology and through-hole electronic assemblies. 1075-EXR 30 VOC-Free is a water based, non-flammable formulation... | |
| 1075-EXR-40 is a non-halide, synthetic resin flux specifically developed for wave soldering surface mount, mixed technology and through-hole electronic assemblies. 1075-EXR-40 is a water based, non-flammable formulation eliminating special storage... | |
| 1095-NF 1095-NF water-soluble fl ux is a neutral pH formulation water-soluble flux is a neutral pH formulation with a high level of activity for wave soldering through-hole, mixed-technology and surface-mount... | |
| 14 Rosin Flux is an alcohol-based, high solids, high activity flux that is ideal for soldering difficult-to-solder metals. | |
| 2036 is a non-activated rosin flux blended with pure alcohol and water white rosin. This flux is best suited for easy to solder applications where high-reliability of the assembly is... | |
| 2205 Rosin Flux is an alcohol-based flux that is ideal for soldering all surface finishes. It can be used to test solderability according to IPC J-STD-003 and IPC J-STD-002. | |
| 2206 Rosin Flux is an alcohol-based flux that is ideal for soldering all surface finishes. It can be used to test solderability according to IPC J-STD-003 and IPC J-STD-002. | |
| 2632 is an alcohol-based flux developed for soldering can seams. 2632 provides fast wetting for dependable soldering and excellent seam-fill on tin-plated cans. | |
| 3541 No-Clean is a low-solids fl ux specially formulated to be used for wave soldering where the solder cleaning process has been eliminated. This fl ux contains a small amount... | |
| 3590-T is a low solids, non-halide rosin/resin free fl ux designed to eliminate post-cleaning operations. The effective fl ux activators provide superior solderability of surface mount, mixed technology, and through-hole... | |
| 3592 Wave Soldering Flux is a low solids, rosin/ resin-free formulation designed to leave a no-residue appearance. This fl ux contains very effective fl ux activators that provide excellent solderability... | |
| 42-SS is a water-based inorganic salt formulation developed for soldering stainless steel and other difficultto- solder metals. 42-SS provides fast wetting and effective oxide removal for dependable soldering. | |
| 42-SS is a water-based inorganic salt formulation developed for soldering stainless steel and other difficultto-solder metals. 42-SS provides fast wetting and effective oxide removal for dependable soldering. | |
| 5RMA-RC and 5RA-RC are heat-stabilized rosin fluxes designed for soldering with preforms or wire. They are formulated for use with a wide range of temperatures and metallizations. Both fluxes are... | |
| 615 IR Fusing Fluid is an organic, biodegradable liquid formulation developed for use in reflow of solder-plated printed circuit boards by infra-red fusing equipment. 615 IR Fusing Fluid adequately reduces... | |
| 80 Battery Flux is specially formulated for cast-on-strap manufacturing of batteries. This flux offers a wide process window at various temperatures and an extended life. 80 Battery Flux does not... | |
| 80 Battery Flux is specially formulated for cast-on-strap manufacturing of batteries. This flux offers a wide process window at various temperatures and an extended life. 80 Battery Flux does not... | |
| Indalloy Flux #1 is a non-acid*, non toxic*, Pb-free, amber colored paste flux for use on copper, brass, galvanized iron, lead, zinc, tin, silver, nickel, mild steel, terne plate and... | |
| Indalloy Flux #2 is a specialty acid based liquid flux formulated for the purpose of soldering high chromium containing alloys including stainless steel. Indalloy Flux #2 also has proven to... | |
| A low temperature lead-free alloy that is more malleable than BiSn. Alloy: 57Bi 42Sn 1.0Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 140ºC Solidus Melting Temperature:... | |
| As a leader in soldering technology, Indium Corporation offers a number of solder pastes for SnPb circuit board assembly. With proven flux technology, these solder pastes will provide the highest... | |
| Bar Solder Chips are small pieces of Indium Corporation’s electronic-grade bar solder, typically used to fill smaller solder pots or to quicken the melting of solder in a new solder... | |
| Benefits Compatibility with common conformal coatings Clear, benign residue Superior stencil life Exceptional wetting in air reflow Outstanding print characteristics Halide-free | |
| Benefits Excellent cleanability, residue can be removed with room temperature water Can be used for printing, dipping, and pin transfer deposition Offers high yields in BGA bumping process Excellent solderability... | |
| BiAgX® is a true solder paste technology. It reflows, solders, wets, and solidifies, just like any other solder paste. When converting from a standard high-Pb solder paste-based process, minimal process... | |
| Bismuth (Bi) is being used more and more as a replacement for lead in solder alloys because it is non-toxic. Although the melting temperature of pure bismuth is 271°C, the... | |
| Bismuth-tin wire is a good low temperature lead-free alloy. Alloy: 58Bi 42Sn Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 138ºC Eutectic Solidus Melting Temperature: 138ºC Eutectic Pb-Free: Yes... | |
| Bismuth-tin wire is a good low temperature lead-free alloy.Alloy: 57Bi 42Sn 1AgDiameter: .030"Quantity: 3 ft SpoolLiquidus Melting Temperature: 140ºC EutecticSolidus Melting Temperature: 139ºC EutecticPb-Free: Yes | |
| BP-3106 is a nitrogen reflow, no-clean solder paste with type 3 powder specifically formulated for BGA bumping applications. The flux is specifically formulated for Sn/Pb alloy systems. This product provides... | |
| CORE 230 wire solder is cored with a no-clean flux fully compatible with Indium’s NC-SMQ230 Pb-Free solder paste. It contains a heat-stabilized rosin that provides excellent wetting and solder spread... | |
| CORE 92 no-clean cored wire solder is manufactured to demanding quality standards. It is an excellent complementary product for rework with NC-SMQ92J and Indium5.8LS solder pastes. | |
| CU 12 Copper Cleaner is an acid-based water-soluble cleaner formulated to remove copper oxide, leaving a clean, solderable surface. This product prepares copper surfaces for soldering without causing scratches created... | |
| CW-301 wire solder is cored with a high reliability water-soluble fl ux that is compatible with Indium's full line of Pb-Free soldering materials. It provides excellent solder spread with minimal... | |
| CW-807 is Indium Corporation’s best selling flux-cored wire primarily because it is compatible with all Indium Corporation no-clean solder pastes, wave fluxes, and all common soft solder alloys. It also... | |
| CW-901 wire solder is cored with an inorganic acid flux for industrial applications. It is highly active to accomplish rapid soldering at controlled conditions for most metals, including copper, brass,... | |
| CW-908 Aluminum-Cored Solder Wire is specifically designed for soldering to aluminum and aluminum alloys. Aluminum is a metal that it is hard to solder due to the high surface tension... | |
| Epoxy fluxes are often used in no-clean SMT component attach applications. The solder bumps on wafer level CSP, micro BGA or BGA packages are dipped in epoxy fluxes, or the... | |
| Excellent choice for die-attach and can be used in reducing atmospheres such as 12% hydrogen. Alloy: 92.5Pb 5In 2.5Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 310ºC Solidus... | |
| Features: • Eliminates defects due to package-warping • Air-reflow • Rheology optimized for both dipping and package-retention • Designed for use with SAC305 and Sn63/Pb37 alloys • Excellent solderability • | |
| Features: Halogen-free – no intentionally added (NIA) halogens Flux rheology applicable for all sphere sizes Suitable for Pb-free applications Uniform pin transfer over extended periods Low voiding No “missing ball” | |
| Features: Halogen-free – no intentionally added (NIA) halogens Flux rheology applicable for all sphere sizes Suitable for Pb-free or SnPb applications Uniform pin transfer over extended periods Proven high yields... | |
| Features Application by dipping or dispensing Halide-free Optimized for Pb-Free (SAC alloy) applications Excellent solderability with Cu-OSP, Au/Ni, and Immersion Ag fi nishes Air refl ow • Bubble-free packaging Introduction... | |
| Features Application by dipping or dispensing Halogen-free (no intentionally-added halides) Optimized for Pb-free (SAC alloy) applications Excellent solderability with Cu-OSP, AuNi, and immersion Ag finishes Air reflow Bubble-free packaging Introduction... | |
| Features Application by dipping or dispensing Optimized for Pb-Free (SAC alloy) applications Excellent solderability with Cu-OSP, Au/Ni, and Immersion Ag fi nishes Air reflow Bubble-free packaging Introduction PoP Flux 89-LV... | |
| Features Application by dipping or dispensing Optimized for Pb-free (SAC alloy) applications Excellent solderability with Cu-OSP, AuNi, and immersion Ag finishes Air or nitrogen reflow Air-free packaging Introduction PoP Flux... | |
| Features Application by dipping or dispensing Optimized for Pb-free (SAC alloy)applications Excellent solderability with Cu-OSP, AuNi, and immersion Ag finishes Air reflow Air-free packaging Introduction PoP Flux 89LV-B is a... | |
| Features AuSn (gold-tin) alloy provides great joint strength AuSn alloy offers superior resistance to corrosion and superior thermal conductivity when compared to standard solders AuSn alloy is compatible with precious... | |
| Features Designed for ball-attach pin-transfer applications Flux rheology applicable for all sphere sizes Excellent solderability on a wide range of surfaces Water-soluble Does not stain substrates or wash equipment Introduction... | |
| Features Designed for copper-pillar flip-chip dipping applications Tackiness suitable for holding multicore die during assembly Compatible with underfills No wetting onto die surface Dipping with minimal bridging Bubble-free airless packaging... | |
| Features Designed for flip-chip dipping applications Tackiness suitable for holding die during assembly Bubble-free airless packaging Ultra-low residue Halogen-free No-clean Introduction Flip-Chip Flux NC-26-A is a halogen-free, no-clean flipchip dipping... | |
| Features Designed for flip-chip dipping applications Tackiness suitable for holding large die during assembly Bubble-free packaging Red color for ease of detection Introduction Flip-Chip Flux WS-446 is a water soluble... | |
| Features Eliminates defects due to package-warping Air-reflow Rheology optimized for both dipping and package-retention Designed for use with SAC305 Excellent solderability Long pot life Suitable for use down to 0.4mm... | |
| Features Excellent cleanability, residue can be removed with room temperature DI water Stencil-printable, high tack Offers high yields in BGA bumping process Halide-free with excellent solderability Wide process window Introduction... | |
| Features Excellent cleanability; residue can be removed with room temperature water Pin-transfer and stencil printable Offers high yields in BGA bumping process Halide-free with excellent solderability Wide process window Suitable... | |
| Features Excellent Surface Wetting Eliminates Cleaning Wide Process Window Use with Pb-Free and Sn/Pb Introduction Tabbing Flux GS-1414 is a no-clean fl ux specifi cally developed for Pb-free solar tabbing/stringing... | |
| Features Excellent Surface Wetting Good for high temperature processes Cleaning not required for most applications 725-M is an alcohol based activated rosin flux developed for soldering through-hole assemblies. It uses... | |
| Features Flux rheology applicable for all sphere sizes Suitable for Pb-Free or Sn/Pb applications Uniform pin transfer over extended periods Red color for ease of detection Proven high yields in... | |
| Features Flux rheology applicable for all sphere sizes Suitable for Pb-free or SnPb applications Uniform pin transfer over extended periods Red color for ease of detection Proven high yields in... | |
| Features Halogen-free – no intentionally added (NIA) halogens Designed for flip-chip dipping applications Excellent solderability on a variety of metallizations Reduces flip-chip voids • Uniform dipping performance over extended periods... | |
| Features Halogen-free – no intentionally added (NIA) halogens Designed for flip-chip dipping applications Suitable for both Sn63 and Pb-free applications Excellent solderability on a variety of metallizations Reduces flip-chip voids... | |
| Features Halogen-free – no intentionally added (NIA) halogens Suitable for Pb-free or SnPb alloys Designed for flip-chip dipping applications Ultralow residue Compatible with underfills Bubble-free (airless) packaging Introduction Flip Chip... | |
| Features Halogen-free – no intentionally added (NIA) halogens Uniform dipping volumes over long periods Proven high yields in copper-pillar (Cu-pillar) flip-chip TCB (thermocompression bonding) reflow on interposer Designed for SnAg... | |
| Features Halogen-free (no intentionally-added halogens) Viscosity suitable for 150-300mm wafers Solvent clean Nitrogen reflow atmosphere Suitable for high-Pb, SnPb, and Pb-free solder applications Introduction Wafer Flux SC 5R is a... | |
| Features Halogen-free per EN14582 test method High transfer efficiency through small apertures (≤ 0.66AR) Eliminates hot and cold slump High oxidation resistance Wets well to oxidized BGA and pad surfaces... | |
| Features Halogen-free, no-clean residue Suitable for pin-grid array and standard ball-grid array applications Airless packaging Excellent solderability to all common surface metallizations Can be used for printing, dipping, pin transfer... | |
| Features Halogen-free Air refl ow Designed for Pb-Free applications Excellent solderability on a variety of surfaces Water wash Bubble-free packaging Flux rheology applicable for spheres 50-762microns Uniform pin-transfer over extended... | |
| Features Halogen-free Air reflow Designed for Pb-Free applications Excellent solderability on a variety of surfaces Water wash • Bubble-free packaging Flux rheology applicable for spheres 50-762microns Uniform pin-transfer over extended... | |
| Features No-clean Compatible with epoxy-based underfi ll materials and conformal coatings Excellent wetting of standard Pb-Free alloys onto standard pad metallizations Fast curing Halogen-free Introduction Flip-Chip Epoxy Flux PK-005 is... | |
| Features Rheology optimized for dipping and package-holding Holds packages up to 25mm x 25mm in outline Long pot life/working life Excellent solderability with Cu-OSP and Au/Ni finishes Optimized for Pb-Free... | |
| Features Semiconductor-grade Water-soluble Viscosity suitable for 150-300mm wafers No residue Halogen-free Promotes uniform solder bump formation Suitable for Sn/Pb and Pb-Free solder applications Introduction Wafer Flux WS-3543-A is a low... | |
| Features Specifically designed for laser reflow Low solder ball and solder splattering Consistent fine pitch print deposition No-clean residue Meets RMA criteria ( QQ-S-571F) Superior tack strength Works in both... | |
| Features Specifically designed for laser reflow Very fine pitch print deposition Excellent wetting on multiple surfaces (OSP, Immersion Ag, Immersion Sn, ENIG) No-clean residue Works in both air and nitrogen... | |
| Features Sprayable and dispensable Excellent wetting ability Wide refl ow temperature ranges Introduction FC-WS-HT-A1 is a water-washable, halide-free, sprayable liquid fl ux designed for Sn/Pb and Pb-Free wafer level solder... | |
| Features Suitable for Pin-Grid Array and standard Ball Grid Array applications Airless Packaging Excellent solderability to all common surface metallizations No-clean residue Can be used for printing, dipping, and pin... | |
| Features Ultra-low residue Excellent wetting No-clean Sprayable and dispensible Introduction FC-NC-HT-A1 is no-clean, halide-free, sprayable liquid fl ux designed for fl ip-chip attachment. It can be used in a nitrogen... | |
| Features Uniform pin transfer over extended periods Proven high yields in ball-attach process Suitable for Pb-Free or Sn/Pb applications Flux rheology applicable for all sphere sizes Red color for ease... | |
| Features Water-soluble Halogen-free (not intentionally added) Suitable for spray applications Suitable for SnPb and Pb-free applications Non-corrosive to underbump metallization Introduction Flip-Chip Flux WS-575-SP is a liquid flux specifically designed... | |
| Features Water-soluble Halogen-free: no intentionally added halogens Suitable for spray or dipping Suitable for Sn/Pb, Pb-Free, and high-Pb alloy applications Non-corrosive to underbump metallization Introduction Flip-Chip Flux WS-3555 is a... | |
| Features Water-soluble Viscosity suitable for 150–300 mm wafers as a damming flux No residue after multiple reflow/cleaning cycles Uniform bump shape Halogen-free Suitable for SnPb and Pb-free, and high temperature... | |
| Features Water-soluble Viscosity suitable for 150–300 mm wafers No residue after multiple reflow/cleaning cycles Uniform bump shape Halide-free Suitable for SnPb and Pb-free, and high temperature applications Non-corrosive to underbump... | |
| Features Water-soluble Viscosity suitable for 150–300mm wafers No residue • Halide-free Promotes uniform solder bump formation Suitable for SnPb and Pb-free solder applications Introduction Wafer Flux WS-3518 is a low... | |
| Features Water-soluble Viscosity suitable for 150–300mm wafers No residue Halide-free Promotes uniform solder bump formation Suitable for SnPb and Pb-free solder applications Introduction Wafer Flux WS-3543 is a low viscosity... | |
| Flux-coated solder preforms give you exact, repeatable amounts of solder for your manufacturing process without adding an extra step for applying flux. Both the solder preforms and flux are made... | |
| High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs. Additional diameters... | |
| High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs. | |
| High quality Solder Ribbon and Foil manufactured by Indium Corporation is available in many standard alloys and sizes. Material can also be custom made to your unique material and dimensional... | |
| Indalloy 182 (80Au/20Sn) has a melting point of 280°C (556°F). It can be made into solder paste form with various options to address specific applications. Gold-tin solder paste is generally... | |
| Indalloy Flux #3 is a high viscosity liquid flux formulated for the purpose of soldering aluminum. Indalloy Flux #3 also has proven to be an effective flux for soldering to... | |
| Indalloy Flux #4-OA is a clear liquid flux formulated for the purpose of soldering moderately easy to difficult metallizations such as nickel, oxidized copper, Kovar and brass. This flux contains... | |
| Indalloy Flux #5-OA is a clear liquid flux formulated for the purpose of soldering moderately easy to difficult metallizations such as nickel, oxidized copper, Kovar and brass. This flux contains... | |
| Indalloy® 182 (80Au/20Sn) has a melting point of 280°C (556°F). It can be made into solder preforms with various options to address specific applications. Gold-tin solder preforms are generally used... | |
| Indalloy®272 is a SAC solder with the addition of Bi and Sb. The exact composition is available upon request. It provides high-reliability solder joints for automotive applications. Currently, it is... | |
| Indium Corporation bar solder is a high purity material manufactured to provide consistent and reliable performance manufactured per J-STD. Bars are rectangular in shape (1.66 lbs./ each). 15 bars per... | |
| Indium Corporation bar solder is a high purity material manufactured to provide consistent and reliable performance manufactured per J-STD. Bars are triangular in shape (1.4 lbs./bar) packed 18 bars/box 25... | |
| Indium Corporation has developed a range of flux-cored wire solutions to meet the needs of virtually every assembly and rework operation. Flux-cored wire solutions are created when the desired alloy,... | |
| Indium Corporation has developed a range of flux-cored wire solutions to meet the needs of virtually every electrical and non-critical electronic assembly and rework operation. Flux-cored wire solutions are created... | |
| Indium Corporation has developed a range of flux-cored wire solutions to meet the needs of virtually every electronic assembly and rework operation. Flux-cored wire solutions are created when the desired... | |
| Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing... | |
| Indium Corporation is quickly becoming known as one of the highest quality, full line suppliers of flux-cored wire solder. Indium Corporation uses only "conflict-free" and grade A (per ASTM B32)... | |
| Indium Corporation is the leading global supplier of commercial indium, high purity indium, indium fabrications, alloys, and chemicals. Indium metal is extracted from indium-bearing ore and is refined to various... | |
| Indium Corporation manufactures a complete line of TACFlux® , which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT... | |
| Indium Corporation manufactures a complete line of TACFlux® which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT... | |
| Indium Corporation manufactures a complete line of TACFlux® which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT component... | |
| Indium Corporation manufactures bar solder specifically to surpass the strict quality demands of the surface mount industry in order to provide more consistent and reliable performance. Bar solder is available... | |
| Indium Corporation now offers a full line of flux pens in standard industry packaging. The technologically advanced pen has exceptional leak control and dispensing capability. Each pen contains 10ml of... | |
| Indium Corporation produces spheres with accurate diameters; bright, shiny surface finishes; and highly spherical shapes. Our spheres are made in dedicated manufacturing cells supported by Statistical Process Controls (SPC). | |
| Indium Corporation’s “Power-Safe” NC-SMQ®75 is the world’s first and only solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach. The ultra-low flux residue, combined with... | |
| Indium Corporation’s new WF-9955 soldering flux is an updated version of Indium’s best-selling WF-9942, designed to conform to the more rigorous standards of J-STD-004B Type ORL0. It has no intentionally... | |
| Indium Corporation’s new WF-9958 soldering flux is an updated version of Indium’s best-selling WF-9942, designed to conform to the more rigorous standards of J-STD-004B Type ORM0. It has no intentionally... | |
| Indium Corporation’s no-clean flux coatings are formulated specifically for solder preforms, combining the latest flux technologies to satisfy the most recent requirements for no-clean and RoHS- and REACH-compliant materials. Flux-coated... | |
| Indium Corporation’s Ultra-Low and Near-Zero Residue (ULR/NZR) Flip-Chip Fluxes are halogenfree, no-clean dipping fluxes, designed to leave a very small amount of a benign, solid, clear residue after reflow. By... | |
| Indium Corporation's Flux #2 effectively reduces the oxides on the nickel and titanium of Nitinol. The recommended solder for use with this is Indalloy #121 (96.5Sn 3.5Ag) which is available... | |
| Indium Corporation's Flux #3 is a more viscous flux that works best with tin-containing alloys. It has a high boiling point and works well with higher temperature solders. The Flux... | |
| Indium Corporation's Wafer Pastes are a nitrogen refl ow, no-clean solder pastes using Type 5 and Type 6 powder, which are specifi cally formulated for fl ip-chip attachment and CSP... | |
| Indium Hi Grade Wave Solder Flux 1075 VOC-Free is a non-halide, rosin/resin free flux specifically developed for wave soldering, surface mount, mixed technology and through-hole electronic assembly. | |
| Indium Hi Grade Wave Solder Flux 3590-TX No Residue is a non-halide, rosin/resin free designed to eliminate post-cleaning operations. Very effective flux activators provide superior solderability reduced defects and shiny... | |
| Indium-lead ribbon minimizes gold leaching characteristics and has good thermal fatigue properties. Alloy: 60In 40Pb Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 181ºC Solidus Melting Temperature:... | |
| Indium-lead wire minimizes gold leaching characteristics and has good thermal fatigue properties. Alloy: 60In 40Pb Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 181ºC Solidus Melting Temperature: 173ºC Pb-Free:... | |
| Indium-lead wire minimizes gold leaching characteristics and has good thermal fatigue properties. Alloy: 60Pb 40In Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 231ºC Eutectic Solidus Melting Temperature: 197ºC... | |
| Indium-lead wire minimizes gold leaching characteristics and has good thermal fatigue properties. Alloy: 70In 30Pb Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 175ºC Solidus Melting Temperature: 165ºC Pb-Free:... | |
| Indium-lead wire minimizes gold leaching characteristics and has good thermal fatigue properties. Indium-lead wire also has very good resistance to alkaline corrosion. Alloy: 50In 50Pb Diameter: .030" Quantity: 3 ft... | |
| Indium-lead-silver ribbon is good for soldering to gold because it minimizes gold leaching. It also has good thermal fatigue properties. Alloy: 80In 15Pb 5Ag Size: 1.00" x .002" Quantity: 3... | |
| Indium-lead-silver wire is good for soldering to gold because it minimizes gold leaching. It also has good thermal fatigue properties. Alloy: 80In 15Pb 5Ag Diameter: .030" Quantity: 3 ft Spool... | |
| Indium-silver ribbon has nearly the wettability, thermal conductivity, and low temperature malleability of indium. Good for thermal interfaces requiring more creep resistance than pure indium. Alloy: 97In 3Ag Size: 1.00"... | |
| Indium-silver wire has nearly the wettability, thermal conductivity, and low temperature malleability of indium. Good for thermal interfaces requiring more creep resistance than pure indium. Alloy: 97In 3Ag Diameter: .030"... | |
| Indium10.1 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu and other Pb-free alloy systems favored by the electronics... | |
| Indium10.2HF is a no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. The flux residue is formulated to be hard and... | |
| Indium10.5HF is no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. Flux residues remain soft, pliable, yet non-tacky after reflow in... | |
| Indium10.8HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry... | |
| Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems. This... | |
| Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, SnSb, and other Pb-free alloy systems. This... | |
| Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems. This... | |
| Indium5.7LT is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using eutectic SnBi and SnBiAg alloys. This paste is a moderate residue product with exceptional wetting capabilities. | |
| Indium6.3 is a halide free, low voiding, water soluble solder paste. Indium6.3 has excellent wetting and solder joint appearance, exceptional printing and response to pause with a wide reflow profile... | |
| Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. This... | |
| Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the... | |
| Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu,Sn/Ag, and other alloy systems favored by the electronics industry to... | |
| Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry... | |
| Indium8.9HF (T5) is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics... | |
| Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry... | |
| Indium8.9HF Pb-Free Solder Paste is Halogen-Free per EN14582 test method. Eliminates hot and cold slump, high oxidation resistance, wets well to oxidized BGA and pad surface. Indium8.9HF has a high... | |
| Indium8.9HF-1 is an air reflow, no-clean solder paste. Indium8.9HF-1 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of... | |
| Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to... | |
| Indium8.9LDA is specially designed for IGBT manufacturing. The formulation has been optimized for vacuum reflow soldering of large area die. Ultra-low total voids are possible (typically <0.5%) using a variety... | |
| Indium9.0E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry... | |
| Indium9.52 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent... | |
| Indium9.72 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent... | |
| Indium9.72-HF is a dispensing solder paste designed and formulated specifi cally for die attach processes. The fl ux vehicle is completely free of halides and halogens to eliminate halogen-corrosion of... | |
| InFORMS® are fabrications in which a copper mesh is embedded into a solder preform. This process produces a reinforced solder fabrication with improved strength and creates a more consistent bondline... | |
| InTEGRATED® Solder Preforms are joined in a matrix by fine, precise strands of solder which, during the soldering process, melt and flow to adjacent pads to give you complete preform... | |
| Lead (Pb)-containing solders have been used for many years for wafer and substrate-bumping applications. Most recently, these solders have been replaced by Sn-based Pb-free solders; however, the majority of cutting-edge... | |
| LED TACFlux® 007 is the leading die-attach flux for the light-emitting diode (LED) industry. It was specifically designed for die-to-sub-mount applications with sputtered film or solder preform alloys, with melting... | |
| MicroDispense solder pastes include no-clean (NC) and water-soluble (WS) solder pastes and are used with SnAgCu and SnPb alloy systems. These pastes are designed for microdispense and jetting applications. The... | |
| Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 183ºC... | |
| Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting... | |
| NanoFoil®, a nanotechnology material, is manufactured in a variety of forms including sheets and preforms. NanoFoil® sheets are available as standard or plated with solder. Common foil thicknesses are 40um,... | |
| NanoFoil®, a nanotechnology material, is used to simplify the sputtering target bonding process in a process called NanoBonding®. NanoBonding allows target bonders and target manufacturers to make reliable and repeatable... | |
| NC-771 is a halogen-free, low-residue, all-purpose liquid flux that passes the SIR test in the un-reflowed state. It can be used in a standard SnPb or Pb-free rework or soldering... | |
| NC-SMQ® 80 is a halide-free, no-clean solder paste formulated for use with indium-based alloys. Indium-containing alloys offer the benefits of reduced leaching/scavenging of metallizations of precious metals like gold or... | |
| NC-SMQ®71 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent... | |
| NC-SMQ®75 is a halogen-free, no-clean solder paste formulated to leave a completely benign, invisible residue of 0.4% of paste or <5% of flux vehicle. It is designed for reflow in... | |
| NC-SMQ92J is a halide free, air reflow, no-clean solder paste formulated to leave a benign, probe testable residue. The residue is easily penetrated and will not clog multi-point probes. In... | |
| Non-activated flux-cored wire CW-102 is a type “R” flux to be used with legacy military contracts requiring a flux-cored wire meeting QQ-S-571F (or predecessor). CW-102 contains pure Grade WW gum... | |
| Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing. However, miniaturization trends, such as the reduction of stencil thickness and more tightly... | |
| Our fluxes for flip-chip bonding applications are halide-free. They are designed for both air and nitrogen reflow and may be purchased individually or in a research kit. The no-clean and... | |
| Package-on-Package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped... | |
| PoP Flux 89HF-LV is a thixotropic no-clean flux designed for package-on-package applications with Pb-free solders. PoP Flux 89HF-LV has a unique halogen-free activator system. Features: Application by dipping or dispensing... | |
| PoP Paste Indium5.79 is a no-clean solder paste designed for use in package-on-package and finerpitch (0.4mm and larger) BGA rework applications. PoP Paste Indium5.79 has a rheology designed to provide... | |
| PoP Paste Indium9.88-HF is a no-clean solder paste designed for use in package-on-package (0.4mm and larger) applications. PoP Paste Indium9.88-HF has a rheology designed to provide a long-lasting dipping process. | |
| PoP Paste Indium9.91 is a no-clean solder paste designed for use in package-on-package (0.3mm and larger) applications. PoP Paste Indium9.91 has a rheology designed to provide a long-lasting dipping process. | |
| Preforms are precise shapes of solder that are manufactured to tight tolerances to give repeatable, accurate solder amounts that are efficiently introduced into the manufacturing process. Adding the flux directly... | |
| Proven in PV module assembly processes, Indium Corporation's No-Clean Liquid Solar Tabbing Fluxes are non-corrosive, non-conductive, and provide excellent solderability on all types of silver metallizations. Formulated to provide a... | |
| Pure indium ribbon is ideal for sealing, cryogenic applications, and joining many non-metals. Indium ribbon also makes an excellent thermal interface and allows for CTE mismatch. It can easily be... | |
| Pure indium wire is ideal for sealing, cryogenic applications, and joining many non-metals. Allows for CTE mismatch. Indium wire also makes an excellent thermal interface. Alloy: 99.99 lndium Diameter: .030"... | |
| RMA-155 is an air reflow, RMA solder paste formulated to accommodate a variety of alloys for electronics assembly. RMA-155 has balanced performance to accommodate the widest variety of processes including:... | |
| Rosin Flux #784 is a specially formulated activated rosin flux exhibiting excellent wetting power. The solvent system keeps evaporation losses to a minimum on continuous exposure to aeration and working... | |
| Several low melting point Indalloy® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing... | |
| Shot are tear-dropped shaped pieces of metal that are typcially used to weigh quantities of other alloys. Examples include: filling vapor deposition crucibles or filling anode baskets with indium for... | |
| SMQ®51-SC is a dispensing solder paste designed and formulated specifically for die-attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size... | |
| Sn992 Pb-Free solder is a low cost alternative to traditional SAC305. In addition to the lower cost, this cobalt- and bismuth-doped Sn/Cu alloy produces smoother, shinier joints and lower dross... | |
| Sn995 Cobalt-Doped Pb-Free Soldering Alloy is a cobalt-doped Sn/Cu alloy that provides a low cost alternative to traditional SAC305. In addition to its low cost, it produces smoother, shinier joints... | |
| Solder Fortification® preforms are used in conjunction with solder paste to give more volume (and therefore more strength) to the solder join that can be achieved through the printing process. | |
| Solder preforms are used in a variety of applications that require precise amounts of solder. Preforms come in standard shapes such as squares, rectangles, washers, and discs. Typical sizes range... | |
| Solder wire from Indium Corporation is manufactured to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation and research quantities to full-scale production volumes. | |
| SR-7 Solder Paste is a halogen-free, no-clean solder paste formulated for ultra low residue. It will also yield accurate, repeatable dispensing performance on both pneumatic and positive displacement dispensing equipment. | |
| Tabbing Flux GS-5454 is a no-clean fl ux specifi cally developed for solar tabbing/stringing applications. It is formulated to provide a wide process window and can be used with Sn/Cu,... | |
| TACFlux 026 is no-clean and halide-free fl ux designed especially for fl ip-chip and CSP (chip scale package) attachment. It can be also used for 3D packages (POP). TACFlux 026... | |
| TACFlux® 25 is a water soluble flux designed to be used in rework and repair, SMT component attachment, and virtually all applications where fluxes are required. | |
| TACFlux® 007, 018 and 023 are tacky fluxes designed for ball mounting onto BGA and BGA sockets. | |
| TACFlux® 008 is an electronics-grade no-clean creamy flux. Its many uses include: rework and repair of various electronics assemblies and components, die-attach, SMT component-attach (including BGAs & flip-chips), BGA ball-attach,... | |
| TACFlux® 020B is a no-clean flux formulated for both Sn/Pb and Pb-free soldering. TACFlux® 020B is halogen-free and passes SIR in the unreflowed state. | |
| TACFlux® 055 is an air reflow, halogen-free, no-clean flux used with Sn/Bi and Sn/Bi/Ag alloys. TACFlux® 055 provides excellent wetting in air and nitrogen and provides the low activation temperature... | |
| TACFlux® 089 is a no-clean flux formulated for Sn/Ag/Cu and Sn/Ag solders (also compatible with Sn/Pb solder). TACFlux® 089 provides excellent wetting in air or nitrogen atmospheres. The flux residue... | |
| TACFlux® 089HF is a no-clean flux formulated for Sn/Ag/ Cu and Sn/Ag solders (also compatible with Sn/Pb solder). TACFlux® 089HF provides excellent wetting in air or nitrogen atmospheres. The flux... | |
| TACFlux® 10 is a no-clean flux designed to be used in rework and repair, SMT component attachment, and virtually all applications where flux is required. | |
| TACFlux® 26S is a NIA halogen-free, no-clean rework flux, which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing... | |
| TACFlux® 483 is a no-clean flux formulated for SnPb solders. TACFlux® 483 provides excellent wetting (Air or Nitrogen atmosphere) to many surfaces, including Ni. Its many uses include rework/repair and... | |
| TACFlux®057 is an air reflow, halogen-free, no-clean flux used with SnBi and SnBiAg alloys. TACFlux®057 provides excellent wetting in air and nitrogen and provides the low activation temperature necessar y... | |
| The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the... | |
| The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting ("flipping") them and placing them onto a substrate. The substrate may be... | |
| The need for high-temperature solders is growing as RF and power semiconductor devices continue to get smaller, with power density increasing both as a consequence of the shrink and as... | |
| This alloy has excellent thermal fatigue properties. Good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting Temperature: 221ºC... | |
| This alloy has excellent thermal fatigue properties; good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting... | |
| Traditional solders have reflow temperatures in the range of 183°C to 221°C. However, advancements in components, substrates, and electronics design have driven the need for solder that will reflow in... | |
| Very popular lead-free solder alloy. Alloy: 96.5Sn 3.0Ag 0.5Cu Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 220ºC Solidus Melting Temperature: 217ºC Pb-Free: Yes | |
| Very popular lead-free solder alloy. Alloy: 96.5Sn 3.0Ag 0.5Cu Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 220ºC Solidus Melting Temperature: 217ºC Pb-Free: Yes | |
| Wave Solder Flux #1010 is a versatile VOC-Free water-soluble wave fl ux that provides excellent solderability on diffi cult to solder assemblies. Wave Solder Flux #1010 is biodegradable and cleans... | |
| Wave Solder Flux #66 was developed specifically for hot-dip tinning of brass and copper strip, ribbon, or tape. Wave Solder Flux #66 is considered a concentrate and may be diluted... | |
| Wave Solder Flux #NR-10-D is a low solids, rosin/ resin-free fl ux. It is specially formulated to be used for wave soldering where the cleaning process has been eliminated. Any... | |
| Wave Solder Flux 1025 is a high activity, versatile, water-soluble wave soldering fl ux formulated to maximize yields and reduce defects on surface-mount and mixed-technology assemblies. It has a broad... | |
| Wave Solder Flux 1072 is a halide-free, VOC-free, rosin flux specifically developed for wave soldering, surface mount, mixed technology and through-hole electronic assemblies. This unique formulation is a new advancement... | |
| WAVE SOLDER FLUX 1075-EXR 44 is specifically developed for Pb-Free and Sn/Pb wave soldering of surface-mount, mixed-technology and through-hole electronic assemblies. 1075-EXR 44 is water-based and non-flammable, eliminating special storage... | |
| WAVE SOLDER FLUX 1076-30 is a rosin/resin-free flux specifically developed for wave soldering, surface-mount, mixed-technology and through-hole electronic assemblies. 1076-30 is water-based and non-flammable, eliminating special storage requirements, and reducing... | |
| Wave Solder Flux 1081 is a water wash organic flux suitable for all conventional tin-lead alloys. 1081 exhibits excellent solderability with low ionic residues after aqueous cleaning | |
| Wave Solder Flux 1081-T is a water wash organic solder flux suitable for all conventional tin-lead alloys. 1081-T exhibits excellent solderability with low ionic residues after aqueous cleaning. | |
| WAVE SOLDER FLUX 1085 is a water-soluble fl ux specifi cally developed for soldering surface-mount, mixed-technology and through-hole electronic assemblies. 1085 is biodegradable and cleans readily in water to low... | |
| Wave Solder Flux 3577-TF is a low-solids flux especially formulated to eliminate post-cleaning operations. This flux contains a small amount of resin, which enhances the wetting properties. 3577-TF is activated... | |
| Wave Solder Flux 3590-TX No-Residue is a low solids, nonhalide rosin/resin-free fl ux designed to eliminate post-cleaning operations. Very effective fl ux activators provide superior solderability, reduced defects, and shiny... | |
| Wave Soldering Flux Series #2212 is designed to meet current no-clean and historic QQ-S-571F flux specifications. These fluxes are particularly effective for soldering large and thick circuit boards or for... | |
| Wave soldering is still preferred for many kinds of assembly operations, and often complements reflow assembly. Wave soldering is particularly suited to continuous production. Changes to board sizes and configurations... | |
| WF-7742 is a VOC-free, no-clean fl ux specifi cally developed for Pb-free wave soldering of surface-mount, mixed-technology and through-hole electronics assemblies. WF-7742 is a water-based, nonfl ammable formulation dramatically reducing... | |
| WF-7745 is a water-based, VOC-free, halogen-free, no-clean wave solder flux designed for wave soldering through-hole, bottom-side surface mount and mixed-technology circuit boards. It performs well with both Pb-free and SnPb... | |
| WF-9940 is Indium Corporation’s most active and heat stable low solids rosin-containing no-clean wave solder flux. WF-9940 was developed to meet the original requirements of J-STD-004 as an ROL1 and... | |
| WF-9942 is a highly active no-clean wave solder flux designed for use with through-hole and mixedtechnology assemblies. It has been effectively used in both tin-lead and lead-free soldering operations. WF-9942... | |
| WF-9945 is a halogen-free no-clean flux developed for wave soldering mixed-technology and through-hole electronics assemblies. WF-9945 is formulated to provide excellent wetting and superior hole-fill under a wide variety of... | |
| WF-9948 is a fourth generation high-performance no-clean wave solder flux designed for use with through-hole and mixed-technology assemblies. It performs well with both tin-lead and lead-free solders. While only containing... | |
| Widely used solder for electronics. Good for silver metallization. Has improved strength and fatigue properties. Alloy: 62Sn 36Pb 2Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 179ºC Eutectic... | |
| Widely used solder for electronics. Good for silver metallization. Has improved strength and fatigue properties. Alloy: 62Sn 36Pb 2Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature:... | |
| With the increased demand for flux coatings that have lower voiding, Indium Corporation has developed the next generation of flux coatings. The LV-Series of flux coatings offers low voiding, especially... |