Indium Corporation Solder Ribbon Tin-Lead Ribbon - 63Sn 37Pb

Description
Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 183ºC Eutectic Solidus Melting Temperature: 183ºC Eutectic Pb-Free: No
  • Solder Ribbon - Tin-Lead Ribbon - 63Sn 37Pb - Indium Corporation
    Indium Corporation
Description
Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 183ºC Eutectic Solidus Melting Temperature: 183ºC Eutectic Pb-Free: No

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Solder Ribbon - Tin-Lead Ribbon - 63Sn 37Pb - Indium Corporation
Indium Corporation
Clinton, NY, USA
Solder Ribbon
Tin-Lead Ribbon - 63Sn 37Pb
Solder Ribbon Tin-Lead Ribbon - 63Sn 37Pb
Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 183ºC Eutectic Solidus Melting Temperature: 183ºC Eutectic Pb-Free: No

Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns.
Alloy: 63Sn 37Pb
Size: 1.00" x .002"
Quantity: 3 ft Spool
Liquidus Melting Temperature: 183ºC Eutectic
Solidus Melting Temperature: 183ºC Eutectic
Pb-Free: No

Supplier's Site

Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number Tin-Lead Ribbon - 63Sn 37Pb
Product Name Solder Ribbon
Joining Process / Product Form Strip, sheet or foil
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