Bar Solder Chips are small pieces of Indium Corporation’s electronic-grade bar solder, typically used to fill smaller solder pots or to quicken the melting of solder in a new solder pot. The greater surface area of the chips allows for better heat transfer between the solder pot and the metal and quickens the melting process.
Chips are made by cutting bar solder into smaller pieces and they have the same properties as Indium Corporation’s electronic-grade bar solder. The tin used to produce the chips has a minimum purity of 99.93%.
By extruding the bar from continually cast, closed chamber billets, oxides that would normally form during a cast solder bar solidification process are greatly reduced, yielding lower dross and better joint formation.
Indium Corporation’s selection of SnPb, Pb-free SAC, and Pb-free SAC alternative alloys meets the needs of virtually every customer.
| Indium Corporation | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Name | Bar Solder Chips |
| Joining Process / Product Form | Chips |
