Features
Specifically designed for laser reflow
Low solder ball and solder splattering
Consistent fine pitch print deposition
No-clean residue
Meets RMA criteria ( QQ-S-571F)
Superior tack strength
Works in both air and nitrogen
Halogen-containing
Indium Corporation
Done
Description
Features
Specifically designed for laser reflow
Low solder ball and solder splattering
Consistent fine pitch print deposition
No-clean residue
Meets RMA criteria ( QQ-S-571F)
Superior tack strength
Works in both air and nitrogen
Halogen-containing
Features
Specifically designed for laser reflow
Low solder ball and solder splattering
Consistent fine pitch print deposition
No-clean residue
Meets RMA criteria ( QQ-S-571F)
Superior tack strength
Works in both air and nitrogen
Halogen-containing
Joining Process / Product Form
Braze or solder in the form of a paste. (optional feature); Powder (optional feature); Strip, sheet or foil (optional feature); Solid wire or rod (optional feature)
