Indium Corporation Solder Paste Indium509L Solder Paste

Description
Features Specifically designed for laser reflow Low solder ball and solder splattering Consistent fine pitch print deposition No-clean residue Meets RMA criteria ( QQ-S-571F) Superior tack strength Works in both air and nitrogen Halogen-containing
Description
Features Specifically designed for laser reflow Low solder ball and solder splattering Consistent fine pitch print deposition No-clean residue Meets RMA criteria ( QQ-S-571F) Superior tack strength Works in both air and nitrogen Halogen-containing

Suppliers

Company
Product
Description
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Features Specifically designed for laser reflow Low solder ball and solder splattering Consistent fine pitch print deposition No-clean residue Meets RMA criteria ( QQ-S-571F) Superior tack strength Works in both air and nitrogen Halogen-containing

Features

  • Specifically designed for laser reflow
  • Low solder ball and solder splattering
  • Consistent fine pitch print deposition
  • No-clean residue
  • Meets RMA criteria ( QQ-S-571F)
  • Superior tack strength
  • Works in both air and nitrogen
  • Halogen-containing
Supplier's Site

Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number Indium509L Solder Paste
Product Name Solder Paste
Joining Process / Product Form Braze or solder in the form of a paste.
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