Features
No-clean
Compatible with epoxy-based underfi ll materials and conformal coatings
Excellent wetting of standard Pb-Free alloys onto standard pad metallizations
Fast curing
Halogen-free
Introduction
Flip-Chip Epoxy Flux PK-005 is designed for use in direct chip-attach (DCA)/fl ip-chip and may also be used in ball-attach applications where high shear strength and/or compatibility with underfi ll is required. Made for the higher temperatures associated with Pb-Free alloys, PK-005 can also provide fl ux and adhesion performance at the lower temperatures required for Sn/Pb soldering. PK-005 provides two functions: a fl ux AND an encapsulant. As a fl ux, PK-005 provides a powerful metal surface oxide cleaning capability during refl ow, promoting good solderability. As an encapsulant, it cures after refl ow to form a strong, adherent polymer layer surrounding the solder connections, providing not only excellent protection against environmental variations, but also reinforcement against lifting of bond pads under stressed conditions.
Features
- No-clean
- Compatible with epoxy-based underfi ll materials and conformal coatings
- Excellent wetting of standard Pb-Free alloys onto standard pad metallizations
- Fast curing
- Halogen-free
Introduction
Flip-Chip Epoxy Flux PK-005 is designed for use in direct chip-attach (DCA)/fl ip-chip and may also be used in ball-attach applications where high shear strength and/or compatibility with underfi ll is required. Made for the higher temperatures associated with Pb-Free alloys, PK-005 can also provide fl ux and adhesion performance at the lower temperatures required for Sn/Pb soldering. PK-005 provides two functions: a fl ux AND an encapsulant. As a fl ux, PK-005 provides a powerful metal surface oxide cleaning capability during refl ow, promoting good solderability. As an encapsulant, it cures after refl ow to form a strong, adherent polymer layer surrounding the solder connections, providing not only excellent protection against environmental variations, but also reinforcement against lifting of bond pads under stressed conditions.
