MicroDispense solder pastes include no-clean (NC) and water-soluble (WS) solder pastes and are used with SnAgCu and SnPb alloy systems. These pastes are designed for microdispense and jetting applications. The MicroDispense pastes are compatible with their corresponding printable solder pastes, as identified in the table below. It is important that they only be used with the matched printable solder paste.
These products are designed for reflow in air or in a nitrogen atmosphere of 100-ppm oxygen or less. MicroDispense solder pastes are specifically formulated for fine-pitch and ultra-fine dispensing for various applications as well as giving reliable dispensing of a consistent size deposit in automated dispensing or jetting equipment.
| Indium Corporation | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | MicroDispense Solder Paste Series |
| Product Name | Solder Paste |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
