Indium Corporation Solder Paste Indium10.2HF Pb-Free Solder Paste

Description
Indium10.2HF is a no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. The flux residue is formulated to be hard and fast breaking, yet non-tacky after reflow, in order to provide extraordinary flying probe and in-circuit testing (ICT) performance. Indium10.2HF provides excellent head-in-pillow (HIP) and non-wet-open (NWO) resistance along with offering unprecedented stencil print transfer efficiency to work in the broadest range of processes.
  • Solder Paste - Indium10.2HF Pb-Free Solder Paste - Indium Corporation
    Indium Corporation
Description
Indium10.2HF is a no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. The flux residue is formulated to be hard and fast breaking, yet non-tacky after reflow, in order to provide extraordinary flying probe and in-circuit testing (ICT) performance. Indium10.2HF provides excellent head-in-pillow (HIP) and non-wet-open (NWO) resistance along with offering unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Suppliers

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Product
Description
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Solder Paste - Indium10.2HF Pb-Free Solder Paste - Indium Corporation
Indium Corporation
Clinton, NY, USA
Solder Paste
Indium10.2HF Pb-Free Solder Paste
Solder Paste Indium10.2HF Pb-Free Solder Paste
Indium10.2HF is a no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. The flux residue is formulated to be hard and fast breaking, yet non-tacky after reflow, in order to provide extraordinary flying probe and in-circuit testing (ICT) performance. Indium10.2HF provides excellent head-in-pillow (HIP) and non-wet-open (NWO) resistance along with offering unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Indium10.2HF is a no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. The flux residue is formulated to be hard and fast breaking, yet non-tacky after reflow, in order to provide extraordinary flying probe and in-circuit testing (ICT) performance. Indium10.2HF provides excellent head-in-pillow (HIP) and non-wet-open (NWO) resistance along with offering unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Supplier's Site

Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number Indium10.2HF Pb-Free Solder Paste
Product Name Solder Paste
Joining Process / Product Form Braze or solder in the form of a paste.
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