PoP Paste Indium9.88-HF is a no-clean solder paste designed for use in package-on-package (0.4mm and larger) applications. PoP Paste Indium9.88-HF has a rheology designed to provide a long-lasting dipping process.
| Indium Corporation | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | PoP Paste Indium9.88-HF |
| Product Name | Semiconductor Solder Paste |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
