Indium Corporation No-Clean RMA-Based Flux TACFlux® 026

Description
TACFlux 026 is no-clean and halide-free fl ux designed especially for fl ip-chip and CSP (chip scale package) attachment. It can be also used for 3D packages (POP). TACFlux 026 is designed to accommodate a wide range of refl ow temperatures, and is suitable for all Sn/Pb, Pb-Free and high-Pb processes.
Description
TACFlux 026 is no-clean and halide-free fl ux designed especially for fl ip-chip and CSP (chip scale package) attachment. It can be also used for 3D packages (POP). TACFlux 026 is designed to accommodate a wide range of refl ow temperatures, and is suitable for all Sn/Pb, Pb-Free and high-Pb processes.

Suppliers

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Product
Description
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No-Clean RMA-Based Flux - TACFlux® 026 - Indium Corporation
Clinton, NY, USA
No-Clean RMA-Based Flux
TACFlux® 026
No-Clean RMA-Based Flux TACFlux® 026
TACFlux 026 is no-clean and halide-free fl ux designed especially for fl ip-chip and CSP (chip scale package) attachment. It can be also used for 3D packages (POP). TACFlux 026 is designed to accommodate a wide range of refl ow temperatures, and is suitable for all Sn/Pb, Pb-Free and high-Pb processes.

TACFlux 026 is no-clean and halide-free fl ux designed especially for fl ip-chip and CSP (chip scale package) attachment. It can be also used for 3D packages (POP). TACFlux 026 is designed to accommodate a wide range of refl ow temperatures, and is suitable for all Sn/Pb, Pb-Free and high-Pb processes.

Supplier's Site

Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number TACFlux® 026
Product Name No-Clean RMA-Based Flux
Fluxes & Cleaners Soldering Flux / Rosin; Halide Free
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