Indium Corporation Datasheets for Solder
Solders include low melting point metal alloys usually in wire, powder, preform or paste forms. Solders are metal alloys with low melting points that are used to join metals together.
Solder: Learn more
| Product Name | Notes |
|---|---|
| Product Description: Indium-tin ribbon has fair wettability on non-metals; good low temperature malleability. Alloy: 52In 48Sn Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 118ºC Eutectic Solidus... | |
| Product Description: Indium-tin wire has fair wettability on non-metals; good low temperature malleability. Alloy: 52ln 48Sn Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 118ºC Eutectic Solidus Melting Temperature:... | |
| A low temperature lead-free alloy that is more malleable than BiSn. Alloy: 57Bi 42Sn 1.0Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 140ºC Solidus Melting Temperature:... | |
| As a leader in soldering technology, Indium Corporation offers a number of solder pastes for SnPb circuit board assembly. With proven flux technology, these solder pastes will provide the highest... | |
| Bar Solder Chips are small pieces of Indium Corporation’s electronic-grade bar solder, typically used to fill smaller solder pots or to quicken the melting of solder in a new solder... | |
| Benefits Compatibility with common conformal coatings Clear, benign residue Superior stencil life Exceptional wetting in air reflow Outstanding print characteristics Halide-free | |
| BiAgX® is a true solder paste technology. It reflows, solders, wets, and solidifies, just like any other solder paste. When converting from a standard high-Pb solder paste-based process, minimal process... | |
| Bismuth (Bi) is being used more and more as a replacement for lead in solder alloys because it is non-toxic. Although the melting temperature of pure bismuth is 271°C, the... | |
| Bismuth-tin wire is a good low temperature lead-free alloy. Alloy: 58Bi 42Sn Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 138ºC Eutectic Solidus Melting Temperature: 138ºC Eutectic Pb-Free: Yes... | |
| Bismuth-tin wire is a good low temperature lead-free alloy.Alloy: 57Bi 42Sn 1AgDiameter: .030"Quantity: 3 ft SpoolLiquidus Melting Temperature: 140ºC EutecticSolidus Melting Temperature: 139ºC EutecticPb-Free: Yes | |
| BP-3106 is a nitrogen reflow, no-clean solder paste with type 3 powder specifically formulated for BGA bumping applications. The flux is specifically formulated for Sn/Pb alloy systems. This product provides... | |
| CORE 230 wire solder is cored with a no-clean flux fully compatible with Indium’s NC-SMQ230 Pb-Free solder paste. It contains a heat-stabilized rosin that provides excellent wetting and solder spread... | |
| CORE 92 no-clean cored wire solder is manufactured to demanding quality standards. It is an excellent complementary product for rework with NC-SMQ92J and Indium5.8LS solder pastes. | |
| CW-301 wire solder is cored with a high reliability water-soluble fl ux that is compatible with Indium's full line of Pb-Free soldering materials. It provides excellent solder spread with minimal... | |
| CW-807 is Indium Corporation’s best selling flux-cored wire primarily because it is compatible with all Indium Corporation no-clean solder pastes, wave fluxes, and all common soft solder alloys. It also... | |
| CW-901 wire solder is cored with an inorganic acid flux for industrial applications. It is highly active to accomplish rapid soldering at controlled conditions for most metals, including copper, brass,... | |
| CW-908 Aluminum-Cored Solder Wire is specifically designed for soldering to aluminum and aluminum alloys. Aluminum is a metal that it is hard to solder due to the high surface tension... | |
| Excellent choice for die-attach and can be used in reducing atmospheres such as 12% hydrogen. Alloy: 92.5Pb 5In 2.5Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 310ºC Solidus... | |
| Features: • Eliminates defects due to package-warping • Air-reflow • Rheology optimized for both dipping and package-retention • Designed for use with SAC305 and Sn63/Pb37 alloys • Excellent solderability • | |
| Features AuSn (gold-tin) alloy provides great joint strength AuSn alloy offers superior resistance to corrosion and superior thermal conductivity when compared to standard solders AuSn alloy is compatible with precious... | |
| Features Eliminates defects due to package-warping Air-reflow Rheology optimized for both dipping and package-retention Designed for use with SAC305 Excellent solderability Long pot life Suitable for use down to 0.4mm... | |
| Features Halogen-free per EN14582 test method High transfer efficiency through small apertures (≤ 0.66AR) Eliminates hot and cold slump High oxidation resistance Wets well to oxidized BGA and pad surfaces... | |
| Features Specifically designed for laser reflow Low solder ball and solder splattering Consistent fine pitch print deposition No-clean residue Meets RMA criteria ( QQ-S-571F) Superior tack strength Works in both... | |
| Features Specifically designed for laser reflow Very fine pitch print deposition Excellent wetting on multiple surfaces (OSP, Immersion Ag, Immersion Sn, ENIG) No-clean residue Works in both air and nitrogen... | |
| High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs. Additional diameters... | |
| High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs. | |
| High quality Solder Ribbon and Foil manufactured by Indium Corporation is available in many standard alloys and sizes. Material can also be custom made to your unique material and dimensional... | |
| Indalloy 182 (80Au/20Sn) has a melting point of 280°C (556°F). It can be made into solder paste form with various options to address specific applications. Gold-tin solder paste is generally... | |
| Indalloy® 182 (80Au/20Sn) has a melting point of 280°C (556°F). It can be made into solder preforms with various options to address specific applications. Gold-tin solder preforms are generally used... | |
| Indalloy®272 is a SAC solder with the addition of Bi and Sb. The exact composition is available upon request. It provides high-reliability solder joints for automotive applications. Currently, it is... | |
| Indium Corporation bar solder is a high purity material manufactured to provide consistent and reliable performance manufactured per J-STD. Bars are rectangular in shape (1.66 lbs./ each). 15 bars per... | |
| Indium Corporation bar solder is a high purity material manufactured to provide consistent and reliable performance manufactured per J-STD. Bars are triangular in shape (1.4 lbs./bar) packed 18 bars/box 25... | |
| Indium Corporation has developed a range of flux-cored wire solutions to meet the needs of virtually every assembly and rework operation. Flux-cored wire solutions are created when the desired alloy,... | |
| Indium Corporation has developed a range of flux-cored wire solutions to meet the needs of virtually every electrical and non-critical electronic assembly and rework operation. Flux-cored wire solutions are created... | |
| Indium Corporation has developed a range of flux-cored wire solutions to meet the needs of virtually every electronic assembly and rework operation. Flux-cored wire solutions are created when the desired... | |
| Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing... | |
| Indium Corporation is quickly becoming known as one of the highest quality, full line suppliers of flux-cored wire solder. Indium Corporation uses only "conflict-free" and grade A (per ASTM B32)... | |
| Indium Corporation is the leading global supplier of commercial indium, high purity indium, indium fabrications, alloys, and chemicals. Indium metal is extracted from indium-bearing ore and is refined to various... | |
| Indium Corporation manufactures bar solder specifically to surpass the strict quality demands of the surface mount industry in order to provide more consistent and reliable performance. Bar solder is available... | |
| Indium Corporation produces spheres with accurate diameters; bright, shiny surface finishes; and highly spherical shapes. Our spheres are made in dedicated manufacturing cells supported by Statistical Process Controls (SPC). | |
| Indium Corporation’s “Power-Safe” NC-SMQ®75 is the world’s first and only solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach. The ultra-low flux residue, combined with... | |
| Indium Corporation's Wafer Pastes are a nitrogen refl ow, no-clean solder pastes using Type 5 and Type 6 powder, which are specifi cally formulated for fl ip-chip attachment and CSP... | |
| Indium-lead ribbon minimizes gold leaching characteristics and has good thermal fatigue properties. Alloy: 60In 40Pb Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 181ºC Solidus Melting Temperature:... | |
| Indium-lead wire minimizes gold leaching characteristics and has good thermal fatigue properties. Alloy: 60In 40Pb Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 181ºC Solidus Melting Temperature: 173ºC Pb-Free:... | |
| Indium-lead wire minimizes gold leaching characteristics and has good thermal fatigue properties. Alloy: 60Pb 40In Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 231ºC Eutectic Solidus Melting Temperature: 197ºC... | |
| Indium-lead wire minimizes gold leaching characteristics and has good thermal fatigue properties. Alloy: 70In 30Pb Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 175ºC Solidus Melting Temperature: 165ºC Pb-Free:... | |
| Indium-lead wire minimizes gold leaching characteristics and has good thermal fatigue properties. Indium-lead wire also has very good resistance to alkaline corrosion. Alloy: 50In 50Pb Diameter: .030" Quantity: 3 ft... | |
| Indium-lead-silver ribbon is good for soldering to gold because it minimizes gold leaching. It also has good thermal fatigue properties. Alloy: 80In 15Pb 5Ag Size: 1.00" x .002" Quantity: 3... | |
| Indium-lead-silver wire is good for soldering to gold because it minimizes gold leaching. It also has good thermal fatigue properties. Alloy: 80In 15Pb 5Ag Diameter: .030" Quantity: 3 ft Spool... | |
| Indium-silver ribbon has nearly the wettability, thermal conductivity, and low temperature malleability of indium. Good for thermal interfaces requiring more creep resistance than pure indium. Alloy: 97In 3Ag Size: 1.00"... | |
| Indium-silver wire has nearly the wettability, thermal conductivity, and low temperature malleability of indium. Good for thermal interfaces requiring more creep resistance than pure indium. Alloy: 97In 3Ag Diameter: .030"... | |
| Indium10.1 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu and other Pb-free alloy systems favored by the electronics... | |
| Indium10.2HF is a no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. The flux residue is formulated to be hard and... | |
| Indium10.5HF is no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. Flux residues remain soft, pliable, yet non-tacky after reflow in... | |
| Indium10.8HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry... | |
| Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems. This... | |
| Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, SnSb, and other Pb-free alloy systems. This... | |
| Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems. This... | |
| Indium5.7LT is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using eutectic SnBi and SnBiAg alloys. This paste is a moderate residue product with exceptional wetting capabilities. | |
| Indium6.3 is a halide free, low voiding, water soluble solder paste. Indium6.3 has excellent wetting and solder joint appearance, exceptional printing and response to pause with a wide reflow profile... | |
| Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. This... | |
| Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the... | |
| Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu,Sn/Ag, and other alloy systems favored by the electronics industry to... | |
| Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry... | |
| Indium8.9HF (T5) is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics... | |
| Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry... | |
| Indium8.9HF Pb-Free Solder Paste is Halogen-Free per EN14582 test method. Eliminates hot and cold slump, high oxidation resistance, wets well to oxidized BGA and pad surface. Indium8.9HF has a high... | |
| Indium8.9HF-1 is an air reflow, no-clean solder paste. Indium8.9HF-1 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of... | |
| Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to... | |
| Indium8.9LDA is specially designed for IGBT manufacturing. The formulation has been optimized for vacuum reflow soldering of large area die. Ultra-low total voids are possible (typically <0.5%) using a variety... | |
| Indium9.0E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry... | |
| Indium9.52 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent... | |
| Indium9.72 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent... | |
| Indium9.72-HF is a dispensing solder paste designed and formulated specifi cally for die attach processes. The fl ux vehicle is completely free of halides and halogens to eliminate halogen-corrosion of... | |
| InFORMS® are fabrications in which a copper mesh is embedded into a solder preform. This process produces a reinforced solder fabrication with improved strength and creates a more consistent bondline... | |
| InTEGRATED® Solder Preforms are joined in a matrix by fine, precise strands of solder which, during the soldering process, melt and flow to adjacent pads to give you complete preform... | |
| Lead (Pb)-containing solders have been used for many years for wafer and substrate-bumping applications. Most recently, these solders have been replaced by Sn-based Pb-free solders; however, the majority of cutting-edge... | |
| MicroDispense solder pastes include no-clean (NC) and water-soluble (WS) solder pastes and are used with SnAgCu and SnPb alloy systems. These pastes are designed for microdispense and jetting applications. The... | |
| Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 183ºC... | |
| Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting... | |
| NanoFoil®, a nanotechnology material, is manufactured in a variety of forms including sheets and preforms. NanoFoil® sheets are available as standard or plated with solder. Common foil thicknesses are 40um,... | |
| NanoFoil®, a nanotechnology material, is used to simplify the sputtering target bonding process in a process called NanoBonding®. NanoBonding allows target bonders and target manufacturers to make reliable and repeatable... | |
| NC-SMQ® 80 is a halide-free, no-clean solder paste formulated for use with indium-based alloys. Indium-containing alloys offer the benefits of reduced leaching/scavenging of metallizations of precious metals like gold or... | |
| NC-SMQ®71 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent... | |
| NC-SMQ®75 is a halogen-free, no-clean solder paste formulated to leave a completely benign, invisible residue of 0.4% of paste or <5% of flux vehicle. It is designed for reflow in... | |
| NC-SMQ92J is a halide free, air reflow, no-clean solder paste formulated to leave a benign, probe testable residue. The residue is easily penetrated and will not clog multi-point probes. In... | |
| Non-activated flux-cored wire CW-102 is a type “R” flux to be used with legacy military contracts requiring a flux-cored wire meeting QQ-S-571F (or predecessor). CW-102 contains pure Grade WW gum... | |
| Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing. However, miniaturization trends, such as the reduction of stencil thickness and more tightly... | |
| PoP Flux 89HF-LV is a thixotropic no-clean flux designed for package-on-package applications with Pb-free solders. PoP Flux 89HF-LV has a unique halogen-free activator system. Features: Application by dipping or dispensing... | |
| PoP Paste Indium5.79 is a no-clean solder paste designed for use in package-on-package and finerpitch (0.4mm and larger) BGA rework applications. PoP Paste Indium5.79 has a rheology designed to provide... | |
| PoP Paste Indium9.88-HF is a no-clean solder paste designed for use in package-on-package (0.4mm and larger) applications. PoP Paste Indium9.88-HF has a rheology designed to provide a long-lasting dipping process. | |
| PoP Paste Indium9.91 is a no-clean solder paste designed for use in package-on-package (0.3mm and larger) applications. PoP Paste Indium9.91 has a rheology designed to provide a long-lasting dipping process. | |
| Pure indium ribbon is ideal for sealing, cryogenic applications, and joining many non-metals. Indium ribbon also makes an excellent thermal interface and allows for CTE mismatch. It can easily be... | |
| Pure indium wire is ideal for sealing, cryogenic applications, and joining many non-metals. Allows for CTE mismatch. Indium wire also makes an excellent thermal interface. Alloy: 99.99 lndium Diameter: .030"... | |
| RMA-155 is an air reflow, RMA solder paste formulated to accommodate a variety of alloys for electronics assembly. RMA-155 has balanced performance to accommodate the widest variety of processes including:... | |
| Several low melting point Indalloy® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing... | |
| Shot are tear-dropped shaped pieces of metal that are typcially used to weigh quantities of other alloys. Examples include: filling vapor deposition crucibles or filling anode baskets with indium for... | |
| SMQ®51-SC is a dispensing solder paste designed and formulated specifically for die-attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size... | |
| Sn992 Pb-Free solder is a low cost alternative to traditional SAC305. In addition to the lower cost, this cobalt- and bismuth-doped Sn/Cu alloy produces smoother, shinier joints and lower dross... | |
| Sn995 Cobalt-Doped Pb-Free Soldering Alloy is a cobalt-doped Sn/Cu alloy that provides a low cost alternative to traditional SAC305. In addition to its low cost, it produces smoother, shinier joints... | |
| Solder Fortification® preforms are used in conjunction with solder paste to give more volume (and therefore more strength) to the solder join that can be achieved through the printing process. | |
| Solder preforms are used in a variety of applications that require precise amounts of solder. Preforms come in standard shapes such as squares, rectangles, washers, and discs. Typical sizes range... | |
| Solder wire from Indium Corporation is manufactured to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation and research quantities to full-scale production volumes. | |
| SR-7 Solder Paste is a halogen-free, no-clean solder paste formulated for ultra low residue. It will also yield accurate, repeatable dispensing performance on both pneumatic and positive displacement dispensing equipment. | |
| The need for high-temperature solders is growing as RF and power semiconductor devices continue to get smaller, with power density increasing both as a consequence of the shrink and as... | |
| This alloy has excellent thermal fatigue properties. Good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting Temperature: 221ºC... | |
| This alloy has excellent thermal fatigue properties; good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting... | |
| Traditional solders have reflow temperatures in the range of 183°C to 221°C. However, advancements in components, substrates, and electronics design have driven the need for solder that will reflow in... | |
| Very popular lead-free solder alloy. Alloy: 96.5Sn 3.0Ag 0.5Cu Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 220ºC Solidus Melting Temperature: 217ºC Pb-Free: Yes | |
| Very popular lead-free solder alloy. Alloy: 96.5Sn 3.0Ag 0.5Cu Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 220ºC Solidus Melting Temperature: 217ºC Pb-Free: Yes | |
| Widely used solder for electronics. Good for silver metallization. Has improved strength and fatigue properties. Alloy: 62Sn 36Pb 2Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 179ºC Eutectic... | |
| Widely used solder for electronics. Good for silver metallization. Has improved strength and fatigue properties. Alloy: 62Sn 36Pb 2Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature:... |