Indium Corporation Datasheets for Solder

Solders include low melting point metal alloys usually in wire, powder, preform or paste forms. Solders are metal alloys with low melting points that are used to join metals together.
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Product Name Notes
Solder Ribbon -- Indium-Tin Ribbon - 52In 48Sn Product Description: Indium-tin ribbon has fair wettability on non-metals; good low temperature malleability. Alloy: 52In 48Sn Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 118ºC Eutectic Solidus...
Solder Wire -- Indium-Tin Wire - 52In 48Sn - 3 ft Product Description: Indium-tin wire has fair wettability on non-metals; good low temperature malleability. Alloy: 52ln 48Sn Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 118ºC Eutectic Solidus Melting Temperature:...
Solder Ribbon -- Bismuth-Tin-Silver Ribbon - 57Bi 42Sn 1.0Ag A low temperature lead-free alloy that is more malleable than BiSn. Alloy: 57Bi 42Sn 1.0Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 140ºC Solidus Melting Temperature:...
Solder Paste -- Indium6.4 Water-Soluble As a leader in soldering technology, Indium Corporation offers a number of solder pastes for SnPb circuit board assembly. With proven flux technology, these solder pastes will provide the highest...
Bar Solder Chips Bar Solder Chips are small pieces of Indium Corporation’s electronic-grade bar solder, typically used to fill smaller solder pots or to quicken the melting of solder in a new solder...
Solder Paste -- NC-SMQ92H Solder Paste Benefits Compatibility with common conformal coatings Clear, benign residue Superior stencil life Exceptional wetting in air reflow Outstanding print characteristics Halide-free
Semiconductor Solder Paste -- Indium7.08 BiAgX® High Temperature Pb-Free Dispensing Solder Paste
Semiconductor Solder Paste -- Indium7.16 BiAgX® High Temperature Pb-Free Printing Solder Paste
BiAgX® is a true solder paste technology. It reflows, solders, wets, and solidifies, just like any other solder paste. When converting from a standard high-Pb solder paste-based process, minimal process...
Engineered Solder Materials -- Bismuth Solder Bismuth (Bi) is being used more and more as a replacement for lead in solder alloys because it is non-toxic. Although the melting temperature of pure bismuth is 271°C, the...
Solder Wire -- Bismuth-Tin Wire - 58Bi 42Sn - 3 ft Bismuth-tin wire is a good low temperature lead-free alloy. Alloy: 58Bi 42Sn Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 138ºC Eutectic Solidus Melting Temperature: 138ºC Eutectic Pb-Free: Yes...
Solder Wire -- Bismuth-Tin Wire - 57Bi 42Sn 1Ag - 3 ft Bismuth-tin wire is a good low temperature lead-free alloy.Alloy: 57Bi 42Sn 1AgDiameter: .030"Quantity: 3 ft SpoolLiquidus Melting Temperature: 140ºC EutecticSolidus Melting Temperature: 139ºC EutecticPb-Free: Yes
Semiconductor Solder Paste -- BP-3106 BGA Bumping Solder Paste BP-3106 is a nitrogen reflow, no-clean solder paste with type 3 powder specifically formulated for BGA bumping applications. The flux is specifically formulated for Sn/Pb alloy systems. This product provides...
Flux-Cored Wire -- Core 230 Cored Wire Solder CORE 230 wire solder is cored with a no-clean flux fully compatible with Indium’s NC-SMQ230 Pb-Free solder paste. It contains a heat-stabilized rosin that provides excellent wetting and solder spread...
Flux-Cored Wire -- CORE 92 No-Clean Cored Wire Solder CORE 92 no-clean cored wire solder is manufactured to demanding quality standards. It is an excellent complementary product for rework with NC-SMQ92J and Indium5.8LS solder pastes.
Flux-Cored Wire -- CW-301 Water-Soluble Cored Wire Solder CW-301 wire solder is cored with a high reliability water-soluble fl ux that is compatible with Indium's full line of Pb-Free soldering materials. It provides excellent solder spread with minimal...
Flux-Cored Wire -- CW-807 Flux-Cored Wire CW-807 is Indium Corporation’s best selling flux-cored wire primarily because it is compatible with all Indium Corporation no-clean solder pastes, wave fluxes, and all common soft solder alloys. It also...
Flux-Cored Wire -- CW-901 Acid Cored Wire CW-901 wire solder is cored with an inorganic acid flux for industrial applications. It is highly active to accomplish rapid soldering at controlled conditions for most metals, including copper, brass,...
Flux-Cored Wire -- CW-908 Aluminum-Cored Solder Wire CW-908 Aluminum-Cored Solder Wire is specifically designed for soldering to aluminum and aluminum alloys. Aluminum is a metal that it is hard to solder due to the high surface tension...
Solder Wire -- Indium-Lead-Silver Wire - 92.5Pb 5In 2.5Ag - 3 ft Excellent choice for die-attach and can be used in reducing atmospheres such as 12% hydrogen. Alloy: 92.5Pb 5In 2.5Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 310ºC Solidus...
Solder Paste -- Indium9.91 Features: • Eliminates defects due to package-warping • Air-reflow • Rheology optimized for both dipping and package-retention • Designed for use with SAC305 and Sn63/Pb37 alloys • Excellent solderability •
Engineered Solder Materials -- Eutectic Gold/Tin Solder Features AuSn (gold-tin) alloy provides great joint strength AuSn alloy offers superior resistance to corrosion and superior thermal conductivity when compared to standard solders AuSn alloy is compatible with precious...
Semiconductor Solder Paste -- PoP Paste Indium9.88 Features Eliminates defects due to package-warping Air-reflow Rheology optimized for both dipping and package-retention Designed for use with SAC305 Excellent solderability Long pot life Suitable for use down to 0.4mm...
Solder Paste -- Indium8.9HF SnPb Solder Paste Features Halogen-free per EN14582 test method High transfer efficiency through small apertures (≤ 0.66AR) Eliminates hot and cold slump High oxidation resistance Wets well to oxidized BGA and pad surfaces...
Solder Paste -- Indium509L Solder Paste Features Specifically designed for laser reflow Low solder ball and solder splattering Consistent fine pitch print deposition No-clean residue Meets RMA criteria ( QQ-S-571F) Superior tack strength Works in both...
Solder Paste -- Indium510L Solder Paste Features Specifically designed for laser reflow Very fine pitch print deposition Excellent wetting on multiple surfaces (OSP, Immersion Ag, Immersion Sn, ENIG) No-clean residue Works in both air and nitrogen...
Flux-Cored Wire -- 88Pb10Sn2Ag Flux Cored Wire .032 inch diameter
Flux-Cored Wire -- 88Pb10Sn2Ag Flux Cored Wire .062 inch diameter
High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs. Additional diameters...
Flux-Cored Wire -- 90Pb10Sn Flux Cored Wire .032 inch diameter
Flux-Cored Wire -- 90Pb10Sn Flux Cored Wire .062 inch diameter
Flux-Cored Wire -- 92.5Pb5Sn2.5Ag Flux Cored Wire .032 inch diameter
Flux-Cored Wire -- 92.5Pb5Sn2.5Ag Flux Cored Wire .062 inch diameter
Flux-Cored Wire -- 93.5Pb5Sn1.5Ag Flux Cored Wire .032 inch diameter
Flux-Cored Wire -- 93.5Pb5Sn1.5Ag Flux Cored Wire .062 inch diameter
High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs.
Solder Ribbon/Foil High quality Solder Ribbon and Foil manufactured by Indium Corporation is available in many standard alloys and sizes. Material can also be custom made to your unique material and dimensional...
Gold-Tin Solder Paste -- Indalloy® 182 Indalloy 182 (80Au/20Sn) has a melting point of 280°C (556°F). It can be made into solder paste form with various options to address specific applications. Gold-tin solder paste is generally...
AuSn Preforms
Engineered Solder Materials -- AuSn Preforms for Die-Attach Application
Indalloy® 182 (80Au/20Sn) has a melting point of 280°C (556°F). It can be made into solder preforms with various options to address specific applications. Gold-tin solder preforms are generally used...
Solder Paste -- Indalloy® 272 Pb-Free Solder Paste Indalloy®272 is a SAC solder with the addition of Bi and Sb. The exact composition is available upon request. It provides high-reliability solder joints for automotive applications. Currently, it is...
Bar Solder -- Tin-Lead Alloy Wave Solder Bar - Sn63 Pb37 Rectangle shape Indium Corporation bar solder is a high purity material manufactured to provide consistent and reliable performance manufactured per J-STD. Bars are rectangular in shape (1.66 lbs./ each). 15 bars per...
Bar Solder -- Tin-Silver-Copper (SAC305) Alloy Wave Solder Bar - Sn96.5Ag3.5Cu.5 Indium Corporation bar solder is a high purity material manufactured to provide consistent and reliable performance manufactured per J-STD. Bars are triangular in shape (1.4 lbs./bar) packed 18 bars/box 25...
Flux-Cored Wire -- Flux-Cored Wires CW-809, CW-217, and CW-219 Indium Corporation has developed a range of flux-cored wire solutions to meet the needs of virtually every assembly and rework operation. Flux-cored wire solutions are created when the desired alloy,...
Flux-Cored Wire -- Activated Flux-Cored Wire Indium Corporation has developed a range of flux-cored wire solutions to meet the needs of virtually every electrical and non-critical electronic assembly and rework operation. Flux-cored wire solutions are created...
Flux-Cored Wire -- No-Clean Flux-Cored Wire Indium Corporation has developed a range of flux-cored wire solutions to meet the needs of virtually every electronic assembly and rework operation. Flux-cored wire solutions are created when the desired...
Water-Soluble, Halogen-Free Solder Paste -- Indium6.6HF Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing...
Flux-Cored Wire -- Core 230
Flux-Cored Wire -- Core 92
Flux-Cored Wire -- CW-102
Flux-Cored Wire -- CW-201
Flux-Cored Wire -- CW-207
Flux-Cored Wire -- CW-209
Flux-Cored Wire -- CW-301
Flux-Cored Wire -- CW-501
Flux-Cored Wire -- CW-802
Flux-Cored Wire -- CW-807
Flux-Cored Wire -- CW-807 HMP
Flux-Cored Wire -- CW-807M
Flux-Cored Wire -- CW-901
Indium Corporation is quickly becoming known as one of the highest quality, full line suppliers of flux-cored wire solder. Indium Corporation uses only "conflict-free" and grade A (per ASTM B32)...
Commercial Indium Metal Indium Corporation is the leading global supplier of commercial indium, high purity indium, indium fabrications, alloys, and chemicals. Indium metal is extracted from indium-bearing ore and is refined to various...
Bar Solder
Solder Research Kits
Indium Corporation manufactures bar solder specifically to surpass the strict quality demands of the surface mount industry in order to provide more consistent and reliable performance. Bar solder is available...
Engineered Solder Materials -- Pb-Free Precision Spheres (A4) Indium Corporation produces spheres with accurate diameters; bright, shiny surface finishes; and highly spherical shapes. Our spheres are made in dedicated manufacturing cells supported by Statistical Process Controls (SPC).
Semiconductor Solder Paste -- “Power-Safe” NC-SMQ®75 Die-Attach Solder Paste Indium Corporation’s “Power-Safe” NC-SMQ®75 is the world’s first and only solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach. The ultra-low flux residue, combined with...
Semiconductor Solder Paste -- Wafer Pastes Indium Corporation's Wafer Pastes are a nitrogen refl ow, no-clean solder pastes using Type 5 and Type 6 powder, which are specifi cally formulated for fl ip-chip attachment and CSP...
Solder Ribbon -- Indium-Lead Ribbon - 60In 40Pb Indium-lead ribbon minimizes gold leaching characteristics and has good thermal fatigue properties. Alloy: 60In 40Pb Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 181ºC Solidus Melting Temperature:...
Solder Wire -- Indium-Lead Wire - 60In 40Pb - 3 ft Indium-lead wire minimizes gold leaching characteristics and has good thermal fatigue properties. Alloy: 60In 40Pb Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 181ºC Solidus Melting Temperature: 173ºC Pb-Free:...
Solder Wire -- Indium-Lead Wire - 60Pb 40In - 3 ft Indium-lead wire minimizes gold leaching characteristics and has good thermal fatigue properties. Alloy: 60Pb 40In Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 231ºC Eutectic Solidus Melting Temperature: 197ºC...
Solder Wire -- Indium-Lead Wire - 70In 30Pb - 3 ft Indium-lead wire minimizes gold leaching characteristics and has good thermal fatigue properties. Alloy: 70In 30Pb Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 175ºC Solidus Melting Temperature: 165ºC Pb-Free:...
Solder Wire -- Indium-Lead Wire - 50In 50Pb - 3ft Indium-lead wire minimizes gold leaching characteristics and has good thermal fatigue properties. Indium-lead wire also has very good resistance to alkaline corrosion. Alloy: 50In 50Pb Diameter: .030" Quantity: 3 ft...
Solder Ribbon -- Indium-Lead-Silver Ribbon - 80In 15Pb 5Ag Indium-lead-silver ribbon is good for soldering to gold because it minimizes gold leaching. It also has good thermal fatigue properties. Alloy: 80In 15Pb 5Ag Size: 1.00" x .002" Quantity: 3...
Solder Wire -- Indium-Lead-Silver Wire - 80In 15Pb 5Ag - 3 ft Indium-lead-silver wire is good for soldering to gold because it minimizes gold leaching. It also has good thermal fatigue properties. Alloy: 80In 15Pb 5Ag Diameter: .030" Quantity: 3 ft Spool...
Solder Ribbon -- Indium-Silver Ribbon - 97In 3Ag Indium-silver ribbon has nearly the wettability, thermal conductivity, and low temperature malleability of indium. Good for thermal interfaces requiring more creep resistance than pure indium. Alloy: 97In 3Ag Size: 1.00"...
Solder Wire -- Indium-Silver Wire - 97In 3Ag - 3 ft Indium-silver wire has nearly the wettability, thermal conductivity, and low temperature malleability of indium. Good for thermal interfaces requiring more creep resistance than pure indium. Alloy: 97In 3Ag Diameter: .030"...
Solder Paste -- Indium10.1 Pb-Free Solder Paste Indium10.1 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu and other Pb-free alloy systems favored by the electronics...
Solder Paste -- Indium10.2HF Pb-Free Solder Paste Indium10.2HF is a no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. The flux residue is formulated to be hard and...
Solder Paste -- Indium10.5HF Pb-Free Solder Paste Indium10.5HF is no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. Flux residues remain soft, pliable, yet non-tacky after reflow in...
Solder Paste -- Indium10.8HF Pb-Free Solder Paste Indium10.8HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry...
Solder Paste -- SAC305 Indium3.2 Pb-Free Water Soluble Solder Paste Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems. This...
Solder Paste -- Indium3.2 Pb-Free Water-Soluble Solder Paste Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, SnSb, and other Pb-free alloy systems. This...
Solder Paste -- Indium3.2HF Water-Soluble Solder Paste Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems. This...
Solder Paste -- Indium5.7LT Solder Paste Indium5.7LT is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using eutectic SnBi and SnBiAg alloys. This paste is a moderate residue product with exceptional wetting capabilities.
Solder Paste -- Indium6.3 Halide-Free: Water Wash Indium6.3 is a halide free, low voiding, water soluble solder paste. Indium6.3 has excellent wetting and solder joint appearance, exceptional printing and response to pause with a wide reflow profile...
Solder Paste -- Indium6.4R Water-Soluble Pb-Free and SnPb Solder Paste Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. This...
Solder Paste -- Indium8.9 Pb-Free Solder Paste Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the...
Medical Assembly Materials -- SAC305 Indium8.9E Pb-Free solder paste
Solder Paste -- SAC305 Indium8.9E Pb-Free solder paste
Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu,Sn/Ag, and other alloy systems favored by the electronics industry to...
Solder Paste -- Indium8.9E Pb-Free Solder Paste Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry...
Solder Paste -- Indium8.9HF (T5) Pb-Free Solder Paste Indium8.9HF (T5) is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics...
Solder Paste -- Indium8.9HF Pb-Free Solder Paste Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry...
Medical Assembly Materials -- SAC305 Indium8.9HF PB-Free solder paste
Solder Paste -- SAC305 Indium8.9HF PB-Free solder paste
Indium8.9HF Pb-Free Solder Paste is Halogen-Free per EN14582 test method. Eliminates hot and cold slump, high oxidation resistance, wets well to oxidized BGA and pad surface. Indium8.9HF has a high...
Solder Paste -- Indium8.9HF-1 Pb-Free Solder Paste Indium8.9HF-1 is an air reflow, no-clean solder paste. Indium8.9HF-1 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of...
Solder Paste -- Indium8.9HFA Pb-Free Solder Paste Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to...
Semiconductor Solder Paste -- Indium8.9-LDA Pb-Free Solder Paste for IGBT Module Manufacturing Indium8.9LDA is specially designed for IGBT manufacturing. The formulation has been optimized for vacuum reflow soldering of large area die. Ultra-low total voids are possible (typically <0.5%) using a variety...
Solder Paste -- Indium9.0E Pb-Free Solder Paste Indium9.0E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry...
Semiconductor Solder Paste -- Indium9.52 Die-Attach Solder Paste Indium9.52 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent...
Semiconductor Solder Paste -- Indium9.72 Die-Attach Solder Paste Indium9.72 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent...
Semiconductor Solder Paste -- Indium9.72-HF Die-Attach Solder Paste Indium9.72-HF is a dispensing solder paste designed and formulated specifi cally for die attach processes. The fl ux vehicle is completely free of halides and halogens to eliminate halogen-corrosion of...
Engineered Solder Materials -- InFORMS® Reinforced Indium and Solder Alloy Fabrications InFORMS® are fabrications in which a copper mesh is embedded into a solder preform. This process produces a reinforced solder fabrication with improved strength and creates a more consistent bondline...
Engineered Solder Materials -- InTEGRATED® Solder Preforms InTEGRATED® Solder Preforms are joined in a matrix by fine, precise strands of solder which, during the soldering process, melt and flow to adjacent pads to give you complete preform...
High Temperature Pb-Free Solder Lead (Pb)-containing solders have been used for many years for wafer and substrate-bumping applications. Most recently, these solders have been replaced by Sn-based Pb-free solders; however, the majority of cutting-edge...
Solder Paste -- MicroDispense Solder Paste Series MicroDispense solder pastes include no-clean (NC) and water-soluble (WS) solder pastes and are used with SnAgCu and SnPb alloy systems. These pastes are designed for microdispense and jetting applications. The...
Solder Wire -- Tin-Lead Wire - 63Sn 37Pb - 3 ft Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 183ºC...
Solder Ribbon -- Tin-Lead Ribbon - 63Sn 37Pb Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting...
Solder Plated Preforms -- NanoFoil®
Solder Plated Sheets -- NanoFoil®
NanoFoil®, a nanotechnology material, is manufactured in a variety of forms including sheets and preforms. NanoFoil® sheets are available as standard or plated with solder. Common foil thicknesses are 40um,...
Sputter Target Bonding -- NanoFoil® NanoFoil®, a nanotechnology material, is used to simplify the sputtering target bonding process in a process called NanoBonding®. NanoBonding allows target bonders and target manufacturers to make reliable and repeatable...
Solder Paste -- NC-SMQ80 NC-SMQ® 80 is a halide-free, no-clean solder paste formulated for use with indium-based alloys. Indium-containing alloys offer the benefits of reduced leaching/scavenging of metallizations of precious metals like gold or...
Semiconductor Solder Paste -- NC-SMQ®71 Die-Attach Solder Paste NC-SMQ®71 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent...
Semiconductor Solder Paste -- NC-SMQ®75 Die-Attach Solder Paste NC-SMQ®75 is a halogen-free, no-clean solder paste formulated to leave a completely benign, invisible residue of 0.4% of paste or <5% of flux vehicle. It is designed for reflow in...
Medical Assembly Materials -- NC-SMQ92J Halide-Free: Air Reflow: No-Clean Solder Paste
Solder Paste -- NC-SMQ92J Halide-Free: Air Reflow: No-Clean Solder Paste
NC-SMQ92J is a halide free, air reflow, no-clean solder paste formulated to leave a benign, probe testable residue. The residue is easily penetrated and will not clog multi-point probes. In...
Flux-Cored Wire -- CW-102 Non-Activated Rosin Flux-Cored Wire Non-activated flux-cored wire CW-102 is a type “R” flux to be used with legacy military contracts requiring a flux-cored wire meeting QQ-S-571F (or predecessor). CW-102 contains pure Grade WW gum...
Engineered Solder Materials -- Solder Fortification® Preforms
Solder Fortification® Preforms
Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing. However, miniaturization trends, such as the reduction of stencil thickness and more tightly...
Solder Flux -- POP flux 89HF-LV PoP Flux 89HF-LV is a thixotropic no-clean flux designed for package-on-package applications with Pb-free solders. PoP Flux 89HF-LV has a unique halogen-free activator system. Features: Application by dipping or dispensing...
Semiconductor Solder Paste -- PoP Paste Indium5.79 PoP Paste Indium5.79 is a no-clean solder paste designed for use in package-on-package and finerpitch (0.4mm and larger) BGA rework applications. PoP Paste Indium5.79 has a rheology designed to provide...
Semiconductor Solder Paste -- PoP Paste Indium9.88-HF PoP Paste Indium9.88-HF is a no-clean solder paste designed for use in package-on-package (0.4mm and larger) applications. PoP Paste Indium9.88-HF has a rheology designed to provide a long-lasting dipping process.
Semiconductor Solder Paste -- PoP Paste Indium9.91 PoP Paste Indium9.91 is a no-clean solder paste designed for use in package-on-package (0.3mm and larger) applications. PoP Paste Indium9.91 has a rheology designed to provide a long-lasting dipping process.
Solder Ribbon -- Indium Ribbon - 99.99 Indium Pure indium ribbon is ideal for sealing, cryogenic applications, and joining many non-metals. Indium ribbon also makes an excellent thermal interface and allows for CTE mismatch. It can easily be...
Solder Wire -- Indium Wire - 99.99 Indium - 3 ft Pure indium wire is ideal for sealing, cryogenic applications, and joining many non-metals. Allows for CTE mismatch. Indium wire also makes an excellent thermal interface. Alloy: 99.99 lndium Diameter: .030"...
Solder Paste -- RMA-155 Solder Paste RMA-155 is an air reflow, RMA solder paste formulated to accommodate a variety of alloys for electronics assembly. RMA-155 has balanced performance to accommodate the widest variety of processes including:...
Engineered Solder Materials -- Indalloy® Alloys Liquid at Room Temperature Several low melting point Indalloy® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing...
Solder Shot Shot are tear-dropped shaped pieces of metal that are typcially used to weigh quantities of other alloys. Examples include: filling vapor deposition crucibles or filling anode baskets with indium for...
Semiconductor Solder Paste -- SMQ®51-SC High-Lead (Pb) Die-Attach Solder Paste SMQ®51-SC is a dispensing solder paste designed and formulated specifically for die-attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size...
Solder Paste -- Sn992 Pb-Free Soldering Alloy Sn992 Pb-Free solder is a low cost alternative to traditional SAC305. In addition to the lower cost, this cobalt- and bismuth-doped Sn/Cu alloy produces smoother, shinier joints and lower dross...
Bar Solder Sn995 Cobalt-Doped Pb-Free Soldering Alloy is a cobalt-doped Sn/Cu alloy that provides a low cost alternative to traditional SAC305. In addition to its low cost, it produces smoother, shinier joints...
Solder Fortification® -- SAC305 .020 inch x .040 inch x .019 inch
Solder Fortification® -- SAC305 .030 inch x .060 inch x .031 inch
Solder Paste -- SAC305 .020 inch x .040 inch x .019 inch
Solder Paste -- SAC305 .030 inch x .060 inch x .031 inch
Solder Fortification® preforms are used in conjunction with solder paste to give more volume (and therefore more strength) to the solder join that can be achieved through the printing process.
Engineered Solder Materials -- Solder Preforms Solder preforms are used in a variety of applications that require precise amounts of solder. Preforms come in standard shapes such as squares, rectangles, washers, and discs. Typical sizes range...
Engineered Solder Materials -- Solder Wire
Solder Wire
Solder wire from Indium Corporation is manufactured to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation and research quantities to full-scale production volumes.
Solar Materials -- OnSpec® SR-7 Solar-Grade Solder Paste SR-7 Solder Paste is a halogen-free, no-clean solder paste formulated for ultra low residue. It will also yield accurate, repeatable dispensing performance on both pneumatic and positive displacement dispensing equipment.
Engineered Solder Materials -- Semiconductor-Grade Preforms The need for high-temperature solders is growing as RF and power semiconductor devices continue to get smaller, with power density increasing both as a consequence of the shrink and as...
Medical Assembly Materials -- Tin-Silver Wire - 96.5Sn 3.5Ag - 3 ft
Solder Wire -- Tin-Silver Wire - 96.5Sn 3.5Ag - 3 ft
This alloy has excellent thermal fatigue properties. Good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting Temperature: 221ºC...
Solder Ribbon -- Tin-Silver Ribbon - 96.5Sn 3.5Ag This alloy has excellent thermal fatigue properties; good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting...
Engineered Solder Materials -- Low Temperature Solder Traditional solders have reflow temperatures in the range of 183°C to 221°C. However, advancements in components, substrates, and electronics design have driven the need for solder that will reflow in...
Solder Wire -- Tin-Silver-Copper (SAC) Wire - 96.5Sn 3.0Ag 0.5Cu - 3 ft Very popular lead-free solder alloy. Alloy: 96.5Sn 3.0Ag 0.5Cu Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 220ºC Solidus Melting Temperature: 217ºC Pb-Free: Yes
Solder Ribbon -- Tin-Silver-Copper (SAC) Ribbon - 96.5Sn 3.0Ag 0.5Cu - 3 ft Very popular lead-free solder alloy. Alloy: 96.5Sn 3.0Ag 0.5Cu Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 220ºC Solidus Melting Temperature: 217ºC Pb-Free: Yes
Solder Wire -- Tin-Lead-Silver Wire - 62Sn 36Pb 2Ag - 3 ft Widely used solder for electronics. Good for silver metallization. Has improved strength and fatigue properties. Alloy: 62Sn 36Pb 2Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 179ºC Eutectic...
Solder Ribbon -- Tin-Lead-Silver Ribbon - 62Sn 36Pb 2Ag Widely used solder for electronics. Good for silver metallization. Has improved strength and fatigue properties. Alloy: 62Sn 36Pb 2Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature:...