RMA-155 is an air reflow, RMA solder paste formulated to accommodate a variety of alloys for electronics assembly. RMA-155 has balanced performance to accommodate the widest variety of processes including: consistent stencil printing transfer, robust reflow window, and residue compatible with in-circuit testing.
| Indium Corporation | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | RMA-155 Solder Paste |
| Product Name | Solder Paste |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
