Indium Corporation No-Clean RMA-Based Flux TACFlux® 483

Description
TACFlux® 483 is a no-clean flux formulated for SnPb solders. TACFlux® 483 provides excellent wetting (Air or Nitrogen atmosphere) to many surfaces, including Ni. Its many uses include rework/repair and SMT component attach (including BGA and Flip-Chip). A minimum reflow temperature of approximately 200°C (dependent on reflow profile and method) is recommended to sufficiently drive off all volatiles for consideration in no-clean applications.
  • No-Clean RMA-Based Flux - TACFlux® 483 - Indium Corporation
    Indium Corporation
Description
TACFlux® 483 is a no-clean flux formulated for SnPb solders. TACFlux® 483 provides excellent wetting (Air or Nitrogen atmosphere) to many surfaces, including Ni. Its many uses include rework/repair and SMT component attach (including BGA and Flip-Chip). A minimum reflow temperature of approximately 200°C (dependent on reflow profile and method) is recommended to sufficiently drive off all volatiles for consideration in no-clean applications.

Suppliers

Company
Product
Description
Supplier Links
No-Clean RMA-Based Flux - TACFlux® 483 - Indium Corporation
Indium Corporation
Clinton, NY, USA
No-Clean RMA-Based Flux
TACFlux® 483
No-Clean RMA-Based Flux TACFlux® 483
TACFlux® 483 is a no-clean flux formulated for SnPb solders. TACFlux® 483 provides excellent wetting (Air or Nitrogen atmosphere) to many surfaces, including Ni. Its many uses include rework/repair and SMT component attach (including BGA and Flip-Chip). A minimum reflow temperature of approximately 200°C (dependent on reflow profile and method) is recommended to sufficiently drive off all volatiles for consideration in no-clean applications.

TACFlux® 483 is a no-clean flux formulated for SnPb solders. TACFlux® 483 provides excellent wetting (Air or Nitrogen atmosphere) to many surfaces, including Ni. Its many uses include rework/repair and SMT component attach (including BGA and Flip-Chip). A minimum reflow temperature of approximately 200°C (dependent on reflow profile and method) is recommended to sufficiently drive off all volatiles for consideration in no-clean applications.

Supplier's Site

Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number TACFlux® 483
Product Name No-Clean RMA-Based Flux
Fluxes & Cleaners Soldering Flux / Rosin
Unlock Full Specs
to access all available technical data