Indium Corporation No-Clean RMA-Based Flux TACFlux® 483

Description
TACFlux® 483 is a no-clean flux formulated for SnPb solders. TACFlux® 483 provides excellent wetting (Air or Nitrogen atmosphere) to many surfaces, including Ni. Its many uses include rework/repair and SMT component attach (including BGA and Flip-Chip). A minimum reflow temperature of approximately 200°C (dependent on reflow profile and method) is recommended to sufficiently drive off all volatiles for consideration in no-clean applications.
  • No-Clean RMA-Based Flux - TACFlux® 483 - Indium Corporation
    Indium Corporation
Description
TACFlux® 483 is a no-clean flux formulated for SnPb solders. TACFlux® 483 provides excellent wetting (Air or Nitrogen atmosphere) to many surfaces, including Ni. Its many uses include rework/repair and SMT component attach (including BGA and Flip-Chip). A minimum reflow temperature of approximately 200°C (dependent on reflow profile and method) is recommended to sufficiently drive off all volatiles for consideration in no-clean applications.

Suppliers

Company
Product
Description
Supplier Links
No-Clean RMA-Based Flux - TACFlux® 483 - Indium Corporation
Indium Corporation
Clinton, NY, USA
No-Clean RMA-Based Flux
TACFlux® 483
No-Clean RMA-Based Flux TACFlux® 483
TACFlux® 483 is a no-clean flux formulated for SnPb solders. TACFlux® 483 provides excellent wetting (Air or Nitrogen atmosphere) to many surfaces, including Ni. Its many uses include rework/repair and SMT component attach (including BGA and Flip-Chip). A minimum reflow temperature of approximately 200°C (dependent on reflow profile and method) is recommended to sufficiently drive off all volatiles for consideration in no-clean applications.

TACFlux® 483 is a no-clean flux formulated for SnPb solders. TACFlux® 483 provides excellent wetting (Air or Nitrogen atmosphere) to many surfaces, including Ni. Its many uses include rework/repair and SMT component attach (including BGA and Flip-Chip). A minimum reflow temperature of approximately 200°C (dependent on reflow profile and method) is recommended to sufficiently drive off all volatiles for consideration in no-clean applications.

Supplier's Site

Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number TACFlux® 483
Product Name No-Clean RMA-Based Flux
Fluxes & Cleaners Soldering Flux / Rosin
Unlock Full Specs
to access all available technical data

Similar Products

Surface Mount Technology (SMT) Solder Alloys - Low and No-Silver Lead Free Alloys SACX Plus 0307, SACX Plus 0807 - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Surface Mount Technology (SMT) Solder Alloys
Low and No-Silver Lead Free Alloys SACX Plus 0307, SACX Plus 0807
Specs
Solder Alloy Lead Free
View Details
Solder - 4203102 - RS Components, Ltd.
RS Components, Ltd.
Solder
4203102
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0394 inch (1 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
View Details
Resistance Welding Composites - - Mi-Tech Metals
Mi-Tech Metals
Resistance Welding Composites
Specs
Applications / Materials Joined Die Inserts And Electrode Facings
Joining Process / Product Form Solid wire or rod; Die/Insert or Electrode Facing
Nominal Composition Tungsten With Copper Or Silver
View Details
Backing Ring - Plain - Robvon Backing Ring Company, Inc.
Robvon Backing Ring Company, Inc.
Backing Ring
Plain
Specs
Joining Process / Product Form Rings or other shapes that backup or fill-in and provide spacing in a weld joint.; Backing Ring
Welding Filler Types Aluminum (optional feature); Carbon Steel (optional feature); Copper (optional feature); Steel - Stainless (optional feature); Chrome Moly
Weld Positions All positions; Vertical Downhand; Flat; Horizontal; Overhead; Vertical Up or Down; Vertical Up
View Details