Indium Corporation No-Clean RMA-Based Flux TACFlux® 483

TACFlux® 483 is a no-clean flux formulated for SnPb solders. TACFlux® 483 provides excellent wetting (Air or Nitrogen atmosphere) to many surfaces, including Ni. Its many uses include rework/repair and SMT component attach (including BGA and Flip-Chip). A minimum reflow temperature of approximately 200°C (dependent on reflow profile and method) is recommended to sufficiently drive off all volatiles for consideration in no-clean applications.