Indium6.6HF is a water-soluble solder paste that is compatible with both SnPb and Pb-free alloys, designed for use in air or nitrogen reflow processes. It features a low-voiding flux that minimizes voids, particularly for BGA, CSP, and bottom termination components. The solder paste offers exceptional stencil printing performance, with a long stencil life of up to 12 hours and excellent response-to-pause capabilities. It maintains high tack for over 8 hours, ensuring reliable component placement. Indium6.6HF is halogen-free, conforming to IEC 61249-2-21 standards, and is cleanable up to 72 hours post-reflow using DI water. The product is suitable for a wide range of surface finishes and provides a broad reflow process window, making it a versatile choice for PCB assembly applications.
Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications.
Indium6.6HF exhibits superior wetting to a variety of surface finishes resulting in the fewest voids, a reduction in the size of the largest voids, and minimized overall voiding.
Other Indium6.6HF benefits include:
| Indium Corporation | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | Indium6.6HF |
| Product Name | Water-Soluble, Halogen-Free Solder Paste |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
