Indium Corporation Semiconductor Flux Ball-Attach Flux WS-3611

Description
Features Flux rheology applicable for all sphere sizes Suitable for Pb-Free or Sn/Pb applications Uniform pin transfer over extended periods Red color for ease of detection Proven high yields in ball-attach process Excellent solderability on a wide range of surfaces Introduction Ball Attach Flux WS-3611 is a thixotropic fl ux designed for use in pin transfer applications for ball attachment to substrates (BGA manufacturing). Its rheology is specifi cally designed for use with even the smallest gravity-fed spheres. WS-3611 has an activator system powerful enough to promote wetting on the most demanding substrate metallizations. The fl ux is a distinctive red color, which aids automated level-sensing equipment and also enhances visual inspection.
Description
Features Flux rheology applicable for all sphere sizes Suitable for Pb-Free or Sn/Pb applications Uniform pin transfer over extended periods Red color for ease of detection Proven high yields in ball-attach process Excellent solderability on a wide range of surfaces Introduction Ball Attach Flux WS-3611 is a thixotropic fl ux designed for use in pin transfer applications for ball attachment to substrates (BGA manufacturing). Its rheology is specifi cally designed for use with even the smallest gravity-fed spheres. WS-3611 has an activator system powerful enough to promote wetting on the most demanding substrate metallizations. The fl ux is a distinctive red color, which aids automated level-sensing equipment and also enhances visual inspection.

Suppliers

Company
Product
Description
Supplier Links
Semiconductor Flux - Ball-Attach Flux WS-3611 - Indium Corporation
Clinton, NY, USA
Semiconductor Flux
Ball-Attach Flux WS-3611
Semiconductor Flux Ball-Attach Flux WS-3611
Features Flux rheology applicable for all sphere sizes Suitable for Pb-Free or Sn/Pb applications Uniform pin transfer over extended periods Red color for ease of detection Proven high yields in ball-attach process Excellent solderability on a wide range of surfaces Introduction Ball Attach Flux WS-3611 is a thixotropic fl ux designed for use in pin transfer applications for ball attachment to substrates (BGA manufacturing). Its rheology is specifi cally designed for use with even the smallest gravity-fed spheres. WS-3611 has an activator system powerful enough to promote wetting on the most demanding substrate metallizations. The fl ux is a distinctive red color, which aids automated level-sensing equipment and also enhances visual inspection.

Features

  • Flux rheology applicable for all sphere sizes
  • Suitable for Pb-Free or Sn/Pb applications
  • Uniform pin transfer over extended periods
  • Red color for ease of detection
  • Proven high yields in ball-attach process
  • Excellent solderability on a wide range of surfaces

Introduction

Ball Attach Flux WS-3611 is a thixotropic fl ux designed for use in pin transfer applications for ball attachment to substrates (BGA manufacturing). Its rheology is specifi cally designed for use with even the smallest gravity-fed spheres. WS-3611 has an activator system powerful enough to promote wetting on the most demanding substrate metallizations. The fl ux is a distinctive red color, which aids automated level-sensing equipment and also enhances visual inspection.

Supplier's Site

Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number Ball-Attach Flux WS-3611
Product Name Semiconductor Flux
Fluxes & Cleaners Soldering Flux / Rosin
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