Traditional solders have reflow temperatures in the range of 183°C to 221°C. However, advancements in components, substrates, and electronics design have driven the need for solder that will reflow in the 115°C to 180°C range. Some of these key drivers include:
Temperature sensitive components (i.e., plasticcapped MEMS or GaAs sensors)
Substrates that deform, melt, or delaminate at higher reflow temperatures (i.e., 3D-MID plastics, fabrics, or flex circuits)
Processes that require step-soldering
Desire for lower reflow costs
Mating parts that have significant difference in their coefficient of thermal expansion (CTE)
Pb-free solders that reflow in the range of the traditional SnPb and SnPbAg options
Traditional solders have reflow temperatures in the range of 183°C to 221°C. However, advancements in components, substrates, and electronics design have driven the need for solder that will reflow in the 115°C to 180°C range. Some of these key drivers include:
- Temperature sensitive components (i.e., plasticcapped MEMS or GaAs sensors)
- Substrates that deform, melt, or delaminate at higher reflow temperatures (i.e., 3D-MID plastics, fabrics, or flex circuits)
- Processes that require step-soldering
- Desire for lower reflow costs
- Mating parts that have significant difference in their coefficient of thermal expansion (CTE)
- Pb-free solders that reflow in the range of the traditional SnPb and SnPbAg options
