Indium Corporation Solder Paste Indium9.0E Pb-Free Solder Paste

Description
Indium9.0E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium9.0E offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.
Description
Indium9.0E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium9.0E offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.

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Indium9.0E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium9.0E offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Indium9.0E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium9.0E offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.

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Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number Indium9.0E Pb-Free Solder Paste
Product Name Solder Paste
Joining Process / Product Form Braze or solder in the form of a paste.
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