BP-3106 is a nitrogen reflow, no-clean solder paste with type 3 powder specifically formulated for BGA bumping applications. The flux is specifically formulated for Sn/Pb alloy systems. This product provides consistent volume deposition, extremely low voiding and high yields. If cleaning is need ed, the flux residue may be removed with commercially available cleaners.
| Indium Corporation | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | BP-3106 BGA Bumping Solder Paste |
| Product Name | Semiconductor Solder Paste |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
