Features
Specifically designed for laser reflow
Very fine pitch print deposition
Excellent wetting on multiple surfaces (OSP, Immersion Ag, Immersion Sn, ENIG)
No-clean residue
Works in both air and nitrogen
Halogen-free
Indium Corporation
Done
Description
Features
Specifically designed for laser reflow
Very fine pitch print deposition
Excellent wetting on multiple surfaces (OSP, Immersion Ag, Immersion Sn, ENIG)
No-clean residue
Works in both air and nitrogen
Halogen-free
Features
Specifically designed for laser reflow
Very fine pitch print deposition
Excellent wetting on multiple surfaces (OSP, Immersion Ag, Immersion Sn, ENIG)
No-clean residue
Works in both air and nitrogen
Halogen-free
Applications / Materials Joined
Chromium-Molybdenum and Other Low Alloy Steels, Including AISI 4130, 4140, 8630, Carbon-Manganese and Other Low Alloy Steels, Offshore
Joining Process / Product Form
Stick (SMAW) Electrode
Diameter / Thickness
0.0938 to 0.1562 inch (2.38 to 3.97 mm)
Joining Process / Product Form
Braze or solder in the form of a paste. (optional feature); Strip, sheet or foil (optional feature); Solid wire or rod (optional feature)
