Indium Corporation Semiconductor Solder Paste Indium9.72-HF Die-Attach Solder Paste

Description
Indium9.72-HF is a dispensing solder paste designed and formulated specifi cally for die attach processes. The fl ux vehicle is completely free of halides and halogens to eliminate halogen-corrosion of wirebond pads and for improved environmental compliance. Normally used with high temperature alloys, Indium9.72-HF is designed for refl ow in a forming gas or nitrogen atmosphere at less than 100ppm O2. This product has superior wetting capabilities and offers low voiding with minimal attention to profi ling.
Description
Indium9.72-HF is a dispensing solder paste designed and formulated specifi cally for die attach processes. The fl ux vehicle is completely free of halides and halogens to eliminate halogen-corrosion of wirebond pads and for improved environmental compliance. Normally used with high temperature alloys, Indium9.72-HF is designed for refl ow in a forming gas or nitrogen atmosphere at less than 100ppm O2. This product has superior wetting capabilities and offers low voiding with minimal attention to profi ling.

Suppliers

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Description
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Semiconductor Solder Paste - Indium9.72-HF Die-Attach Solder Paste - Indium Corporation
Clinton, NY, USA
Semiconductor Solder Paste
Indium9.72-HF Die-Attach Solder Paste
Semiconductor Solder Paste Indium9.72-HF Die-Attach Solder Paste
Indium9.72-HF is a dispensing solder paste designed and formulated specifi cally for die attach processes. The fl ux vehicle is completely free of halides and halogens to eliminate halogen-corrosion of wirebond pads and for improved environmental compliance. Normally used with high temperature alloys, Indium9.72-HF is designed for refl ow in a forming gas or nitrogen atmosphere at less than 100ppm O2. This product has superior wetting capabilities and offers low voiding with minimal attention to profi ling.

Indium9.72-HF is a dispensing solder paste designed and formulated specifi cally for die attach processes. The fl ux vehicle is completely free of halides and halogens to eliminate halogen-corrosion of wirebond pads and for improved environmental compliance. Normally used with high temperature alloys, Indium9.72-HF is designed for refl ow in a forming gas or nitrogen atmosphere at less than 100ppm O2. This product has superior wetting capabilities and offers low voiding with minimal attention to profi ling.

Supplier's Site

Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number Indium9.72-HF Die-Attach Solder Paste
Product Name Semiconductor Solder Paste
Joining Process / Product Form Braze or solder in the form of a paste.
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