Indium Corporation Engineered Solder Materials Eutectic Gold/Tin Solder

Description
Features AuSn (gold-tin) alloy provides great joint strength AuSn alloy offers superior resistance to corrosion and superior thermal conductivity when compared to standard solders AuSn alloy is compatible with precious metals AuSn is RoHS compliant When to Use AuSn Eutectic Solder Die-Attach: Thermal requirements often mandate a high-melting die-attach solder. With a melting point of 280°C, eutectic AuSn often satisfies these demands. Hi-Reliability Applications: AuSn’s compatibility with gold metallizations, coupled with its long-term reliability, make it a good choice for high-rel applications such as microwave systems, medical and aerospace applications, and more. Lid Sealing: AuSn’s excellent wetting properties, its relatively low melting point (when compared to certain dieattach alloys), and its long-term reliability make this alloy desirable for lid sealing applications. Braze Alternative: Eutectic AuSn, with a tensile strength of 275 MPa (40,000 pounds/square inch), provides a great alternative to brazes when high strength must be achieved at soldering temperatures.
Description
Features AuSn (gold-tin) alloy provides great joint strength AuSn alloy offers superior resistance to corrosion and superior thermal conductivity when compared to standard solders AuSn alloy is compatible with precious metals AuSn is RoHS compliant When to Use AuSn Eutectic Solder Die-Attach: Thermal requirements often mandate a high-melting die-attach solder. With a melting point of 280°C, eutectic AuSn often satisfies these demands. Hi-Reliability Applications: AuSn’s compatibility with gold metallizations, coupled with its long-term reliability, make it a good choice for high-rel applications such as microwave systems, medical and aerospace applications, and more. Lid Sealing: AuSn’s excellent wetting properties, its relatively low melting point (when compared to certain dieattach alloys), and its long-term reliability make this alloy desirable for lid sealing applications. Braze Alternative: Eutectic AuSn, with a tensile strength of 275 MPa (40,000 pounds/square inch), provides a great alternative to brazes when high strength must be achieved at soldering temperatures.

Suppliers

Company
Product
Description
Supplier Links
Engineered Solder Materials - Eutectic Gold/Tin Solder - Indium Corporation
Clinton, NY, USA
Engineered Solder Materials
Eutectic Gold/Tin Solder
Engineered Solder Materials Eutectic Gold/Tin Solder
Features AuSn (gold-tin) alloy provides great joint strength AuSn alloy offers superior resistance to corrosion and superior thermal conductivity when compared to standard solders AuSn alloy is compatible with precious metals AuSn is RoHS compliant When to Use AuSn Eutectic Solder Die-Attach: Thermal requirements often mandate a high-melting die-attach solder. With a melting point of 280°C, eutectic AuSn often satisfies these demands. Hi-Reliability Applications: AuSn’s compatibility with gold metallizations, coupled with its long-term reliability, make it a good choice for high-rel applications such as microwave systems, medical and aerospace applications, and more. Lid Sealing: AuSn’s excellent wetting properties, its relatively low melting point (when compared to certain dieattach alloys), and its long-term reliability make this alloy desirable for lid sealing applications. Braze Alternative: Eutectic AuSn, with a tensile strength of 275 MPa (40,000 pounds/square inch), provides a great alternative to brazes when high strength must be achieved at soldering temperatures.

Features

  • AuSn (gold-tin) alloy provides great joint strength
  • AuSn alloy offers superior resistance to corrosion and superior thermal conductivity when compared to standard solders
  • AuSn alloy is compatible with precious metals
  • AuSn is RoHS compliant

When to Use AuSn Eutectic Solder

  • Die-Attach: Thermal requirements often mandate a high-melting die-attach solder. With a melting point of 280°C, eutectic AuSn often satisfies these demands.
  • Hi-Reliability Applications: AuSn’s compatibility with gold metallizations, coupled with its long-term reliability, make it a good choice for high-rel applications such as microwave systems, medical and aerospace applications, and more.
  • Lid Sealing: AuSn’s excellent wetting properties, its relatively low melting point (when compared to certain dieattach alloys), and its long-term reliability make this alloy desirable for lid sealing applications.
  • Braze Alternative: Eutectic AuSn, with a tensile strength of 275 MPa (40,000 pounds/square inch), provides a great alternative to brazes when high strength must be achieved at soldering temperatures.
Supplier's Site

Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number Eutectic Gold/Tin Solder
Product Name Engineered Solder Materials
Joining Process / Product Form Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
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