Indium Corporation Solder Paste Indium8.9HF SnPb Solder Paste

Description
Features Halogen-free per EN14582 test method High transfer efficiency through small apertures (≤ 0.66AR) Eliminates hot and cold slump High oxidation resistance Wets well to oxidized BGA and pad surfaces to eliminate head-in-pillow defects Clear, probe testable flux residue SnPb and Pb-free compatible Ideal for mixed-alloy SnPb and Pb-free processes
Description
Features Halogen-free per EN14582 test method High transfer efficiency through small apertures (≤ 0.66AR) Eliminates hot and cold slump High oxidation resistance Wets well to oxidized BGA and pad surfaces to eliminate head-in-pillow defects Clear, probe testable flux residue SnPb and Pb-free compatible Ideal for mixed-alloy SnPb and Pb-free processes

Suppliers

Company
Product
Description
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Features Halogen-free per EN14582 test method High transfer efficiency through small apertures (≤ 0.66AR) Eliminates hot and cold slump High oxidation resistance Wets well to oxidized BGA and pad surfaces to eliminate head-in-pillow defects Clear, probe testable flux residue SnPb and Pb-free compatible Ideal for mixed-alloy SnPb and Pb-free processes

Features

  • Halogen-free per EN14582 test method
  • High transfer efficiency through small apertures (≤ 0.66AR)
  • Eliminates hot and cold slump
  • High oxidation resistance
  • Wets well to oxidized BGA and pad surfaces to eliminate head-in-pillow defects
  • Clear, probe testable flux residue
  • SnPb and Pb-free compatible
  • Ideal for mixed-alloy SnPb and Pb-free processes
Supplier's Site

Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number Indium8.9HF SnPb Solder Paste
Product Name Solder Paste
Joining Process / Product Form Braze or solder in the form of a paste.
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